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1. 发明申请

US20070115643A1 Electronic device with dual heat dissipating structures 有权
标题翻译：具有双重散热结构的电子设备
公开(公告)号：US20070115643A1
公开(公告)日：2007-05-24
申请号：US11411668
申请日：2006-04-26
申请人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K7/20445 , H05K7/20509 , H01L2924/00
摘要： An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.
摘要翻译：公开了一种在电子系统中使用的具有双重散热结构的电子装置。电子设备包括具有第一和第二发热表面的电路板，分别设置在电路板的第一和第二发热表面上的主要和辅助散热结构，以及连接辅助散热结构和主要散热结构。电路板的第二发热面相对于电子系统中的电路基板的第一发热面为高温区域，由电路基板的第二发热面产生的热量可以导通到主要散热结构通过辅助散热结构和连接部分进行散热。

2. 发明授权

US07365972B2 Electronic device with dual heat dissipating structures 有权
标题翻译：具有双重散热结构的电子设备
公开(公告)号：US07365972B2
公开(公告)日：2008-04-29
申请号：US11411668
申请日：2006-04-26
申请人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K7/20445 , H05K7/20509 , H01L2924/00
摘要： An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.
摘要翻译：公开了一种在电子系统中使用的具有双重散热结构的电子装置。电子设备包括具有第一和第二发热表面的电路板，分别设置在电路板的第一和第二发热表面上的主要和辅助散热结构，以及连接辅助散热结构和主要散热结构。电路板的第二发热面相对于电子系统中的电路基板的第一发热面为高温区域，由电路基板的第二发热面产生的热量可以导通到主要散热结构通过辅助散热结构和连接部分进行散热。

3. 发明申请

US20090097211A1 CIRCUIT MODULE AND CIRCUIT BOARD ASSEMBLY HAVING SIP CONNECTOR 审中-公开
标题翻译：具有SIP连接器的电路模块和电路板组件
公开(公告)号：US20090097211A1
公开(公告)日：2009-04-16
申请号：US12035524
申请日：2008-02-22
申请人： Tsu-Cheng Chen , Chih-Hung Chiang , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Chih-Hung Chiang , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K1/14
CPC分类号： H05K9/00 , H05K1/144 , H05K2201/042 , H05K2201/10303 , H05K2201/10871
摘要： A circuit module to be mounted on a system board having multiple through holes is disclosed. The circuit module includes a circuit board, multiple SIP connectors and multiple sheathing elements. Each of the SIP connectors includes a connecting part disposed at a first end thereof and fixed on the circuit board and an insertion part disposed at a second end thereof. Each of the sheathing elements includes a plurality of clamping arms and a receiving portion. The receiving portion is defined by the clamping arms for receiving the insertion part of a corresponding SIP connector. The insertion part is clamped by the clamping arms such that the sheathing element is fixed on the SIP connector. The sheathing element is sustained against a surface of the system board after the insertion part is inserted into a corresponding through hole of the system board, so that the support area between the SIP connector and the system board is increased.
摘要翻译：公开了一种要安装在具有多个通孔的系统板上的电路模块。电路模块包括电路板，多个SIP连接器和多个护套元件。每个SIP连接器包括设置在其第一端并固定在电路板上的连接部分和设置在其第二端的插入部分。每个护套元件包括多个夹持臂和接收部分。接收部分由用于接收相应SIP连接器的插入部分的夹持臂限定。插入部被夹持臂夹紧，使得护套元件固定在SIP连接器上。在将插入部插入系统板的相应通孔中之后，护套元件被支撑在系统板的表面上，从而增加了SIP连接器与系统板之间的支撑区域。

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