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1. 发明授权

US08467188B2 Modular heat-dissipating device 有权
标题翻译：模块式散热装置
公开(公告)号：US08467188B2
公开(公告)日：2013-06-18
申请号：US13018023
申请日：2011-01-31
申请人： Yi-Hwa Hsieh , Yao-Cheng Chen
发明人： Yi-Hwa Hsieh , Yao-Cheng Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20927
摘要： A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.
摘要翻译：模块化散热装置包括电子装置，冷板和散热基座。电子设备包括壳体，盖板和电路板。电路板设置在壳体内。多个电子部件设置在电路板上。冷板，套管和盖板组合在一起，以确定密封空间。冷板包括多个第一固定结构。散热基座选自空冷部件或液冷部件。每个冷却构件和液冷构件包括在冷板下面的第一板坯和对应于第一固定结构的多个第二固定结构。空气冷却部件和液冷部件被归一化。由电子装置产生的热量通过冷板传送到第一板坯，然后由空气冷却部件或液冷部件消散。

2. 发明申请

US20070115643A1 Electronic device with dual heat dissipating structures 有权
标题翻译：具有双重散热结构的电子设备
公开(公告)号：US20070115643A1
公开(公告)日：2007-05-24
申请号：US11411668
申请日：2006-04-26
申请人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K7/20445 , H05K7/20509 , H01L2924/00
摘要： An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.
摘要翻译：公开了一种在电子系统中使用的具有双重散热结构的电子装置。电子设备包括具有第一和第二发热表面的电路板，分别设置在电路板的第一和第二发热表面上的主要和辅助散热结构，以及连接辅助散热结构和主要散热结构。电路板的第二发热面相对于电子系统中的电路基板的第一发热面为高温区域，由电路基板的第二发热面产生的热量可以导通到主要散热结构通过辅助散热结构和连接部分进行散热。

3. 发明授权

US08462509B2 Heat-dissipating module and electronic device using same 有权
标题翻译：散热模块和使用其的电子设备
公开(公告)号：US08462509B2
公开(公告)日：2013-06-11
申请号：US13035720
申请日：2011-02-25
申请人： Yi-Hwa Hsieh , Yao-Cheng Chen
发明人： Yi-Hwa Hsieh , Yao-Cheng Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , H05K7/205
摘要： A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.
摘要翻译：一种用于电气设备的散热模块包括电路板，至少一个发热元件和至少一个导热元件。电路板具有第一表面，第二表面和至少一个穿孔。导热元件设置在穿孔中。导热元件包括基座和侧壁。发热元件设置在导热元件的基部或侧壁上，使得发热元件的热量通过导热元件传导到电路板的第二表面。

4. 发明申请

US20110222246A1 HEAT-DISSIPATING MODULE AND ELECTRONIC DEVICE USING SAME 有权
标题翻译：散热模块和电子设备使用相同
公开(公告)号：US20110222246A1
公开(公告)日：2011-09-15
申请号：US13035720
申请日：2011-02-25
申请人： Yi-Hwa Hsieh , Yao-Cheng Chen
发明人： Yi-Hwa Hsieh , Yao-Cheng Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , H05K7/205
摘要： A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.
摘要翻译：一种用于电气设备的散热模块包括电路板，至少一个发热元件和至少一个导热元件。电路板具有第一表面，第二表面和至少一个穿孔。导热元件设置在穿孔中。导热元件包括基座和侧壁。发热元件设置在导热元件的基部或侧壁上，使得发热元件的热量通过导热元件传导到电路板的第二表面。

5. 发明申请

US20090097211A1 CIRCUIT MODULE AND CIRCUIT BOARD ASSEMBLY HAVING SIP CONNECTOR 审中-公开
标题翻译：具有SIP连接器的电路模块和电路板组件
公开(公告)号：US20090097211A1
公开(公告)日：2009-04-16
申请号：US12035524
申请日：2008-02-22
申请人： Tsu-Cheng Chen , Chih-Hung Chiang , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Chih-Hung Chiang , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K1/14
CPC分类号： H05K9/00 , H05K1/144 , H05K2201/042 , H05K2201/10303 , H05K2201/10871
摘要： A circuit module to be mounted on a system board having multiple through holes is disclosed. The circuit module includes a circuit board, multiple SIP connectors and multiple sheathing elements. Each of the SIP connectors includes a connecting part disposed at a first end thereof and fixed on the circuit board and an insertion part disposed at a second end thereof. Each of the sheathing elements includes a plurality of clamping arms and a receiving portion. The receiving portion is defined by the clamping arms for receiving the insertion part of a corresponding SIP connector. The insertion part is clamped by the clamping arms such that the sheathing element is fixed on the SIP connector. The sheathing element is sustained against a surface of the system board after the insertion part is inserted into a corresponding through hole of the system board, so that the support area between the SIP connector and the system board is increased.
摘要翻译：公开了一种要安装在具有多个通孔的系统板上的电路模块。电路模块包括电路板，多个SIP连接器和多个护套元件。每个SIP连接器包括设置在其第一端并固定在电路板上的连接部分和设置在其第二端的插入部分。每个护套元件包括多个夹持臂和接收部分。接收部分由用于接收相应SIP连接器的插入部分的夹持臂限定。插入部被夹持臂夹紧，使得护套元件固定在SIP连接器上。在将插入部插入系统板的相应通孔中之后，护套元件被支撑在系统板的表面上，从而增加了SIP连接器与系统板之间的支撑区域。

6. 发明申请

US20110192568A1 MODULAR HEAT-DISSIPATING DEVICE 有权
标题翻译：模块式散热装置
公开(公告)号：US20110192568A1
公开(公告)日：2011-08-11
申请号：US13018023
申请日：2011-01-31
申请人： Yi-Hwa Hsieh , Yao-Cheng Chen
发明人： Yi-Hwa Hsieh , Yao-Cheng Chen
IPC分类号： F25B29/00 , F24F7/00
CPC分类号： H05K7/20927
摘要： A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.
摘要翻译：模块化散热装置包括电子装置，冷板和散热基座。电子设备包括壳体，盖板和电路板。电路板设置在壳体内。多个电子部件设置在电路板上。冷板，套管和盖板组合在一起，以确定密封空间。冷板包括多个第一固定结构。散热基座选自空冷部件或液冷部件。每个冷却构件和液冷构件包括在冷板下面的第一板坯和对应于第一固定结构的多个第二固定结构。空气冷却部件和液冷部件被归一化。由电子装置产生的热量通过冷板传送到第一板坯，然后由空气冷却部件或液冷部件消散。

7. 发明授权

US07491583B2 Power module fabrication method and structure thereof 有权
标题翻译：电源模块制造方法及其结构
公开(公告)号：US07491583B2
公开(公告)日：2009-02-17
申请号：US11371562
申请日：2006-03-09
申请人： Chin Chi Kuo , Yi Hwa Hsieh
发明人： Chin Chi Kuo , Yi Hwa Hsieh
IPC分类号： H01L21/00
CPC分类号： H01L23/49568 , H01L23/49531 , H01L23/49551 , H01L2924/0002 , H05K3/0061 , H05K3/284 , H05K3/3405 , H05K2201/1034 , H05K2201/10924 , H05K2203/1316 , H01L2924/00
摘要： A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.
摘要翻译：公开了一种功率模块的制造方法及其结构。该方法包括以下步骤：提供金属板并在金属板上限定图案; 根据图案切割金属板以形成多个销和导热板，其中销通过连接部彼此连接或连接到金属板，并且导热板联接到连接部分通过固定部分; 弯曲销的第一端以形成延伸部分并弯曲固定部分以将导热板和金属板设置在不同的水平; 提供具有多个通孔的电路板，并将所述延伸部分相应地插入所述通孔中并将所述销固定在所述电路板上; 形成壳体以将电路板封装在其中，其中导热板镶嵌在壳体上，并且销的第二端延伸出壳体; 以及切割连接部分和固定部分，以将销彼此分开并与金属板分离，并使引脚和导热板隔离。

8. 发明授权

US07365972B2 Electronic device with dual heat dissipating structures 有权
标题翻译：具有双重散热结构的电子设备
公开(公告)号：US07365972B2
公开(公告)日：2008-04-29
申请号：US11411668
申请日：2006-04-26
申请人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
发明人： Tsu-Cheng Chen , Kai-Hung Huang , Yi-Hwa Hsieh
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K7/20445 , H05K7/20509 , H01L2924/00
摘要： An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.
摘要翻译：公开了一种在电子系统中使用的具有双重散热结构的电子装置。电子设备包括具有第一和第二发热表面的电路板，分别设置在电路板的第一和第二发热表面上的主要和辅助散热结构，以及连接辅助散热结构和主要散热结构。电路板的第二发热面相对于电子系统中的电路基板的第一发热面为高温区域，由电路基板的第二发热面产生的热量可以导通到主要散热结构通过辅助散热结构和连接部分进行散热。

9. 发明授权

US06366486B1 Power supply device for enhancing heat-dissipating effect 有权
公开(公告)号：US06366486B1
公开(公告)日：2002-04-02
申请号：US09791257
申请日：2001-02-22
申请人： Kun-Feng Chen , Yi-Hwa Hsieh , Ko-Yu Hsiao
发明人： Kun-Feng Chen , Yi-Hwa Hsieh , Ko-Yu Hsiao
IPC分类号： H02M100
CPC分类号： H05K1/165 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2924/13091 , H01L2924/30107 , H02M3/00 , H05K1/0203 , H05K7/209 , H05K2201/066 , H05K2201/086 , H05K2201/09063 , H05K2201/10166 , H01L2924/00
摘要： A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.

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