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1. 发明申请

US20120155029A1 ADAPTIVE THERMAL GAP PAD 审中-公开
标题翻译：自适应热风垫
公开(公告)号：US20120155029A1
公开(公告)日：2012-06-21
申请号：US12973699
申请日：2010-12-20
申请人： Tse Eric Wong , Christopher R. Koontz , Charles Chu , Christal J. Sumner
发明人： Tse Eric Wong , Christopher R. Koontz , Charles Chu , Christal J. Sumner
IPC分类号： H05K7/20 , B21D53/02 , F28C3/00
CPC分类号： H01L23/433 , H01L23/42 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , Y10T29/4935
摘要： The present invention relates to a thermal gap pad for transferring heat from a heat-supplying component such as an electronic device, and more specifically to a thermal gap pad with reduced compressive loading. In one embodiment, a thermal assembly includes a heat-supplying component, a cooling structure, a gap pad having a first surface, and a lubricant provided along the first surface of the gap pad. The lubricant has a viscosity of about 500 cP or less. The gap pad is compressed between the heat-supplying component and the cooling structure, such that the first surface of the gap pad is in thermal contact with the cooling structure.
摘要翻译：本发明涉及一种用于从诸如电子设备的供热部件传递热量的热间隙垫，更具体地涉及具有降低的压缩载荷的热间隙垫。在一个实施例中，热组件包括供热部件，冷却结构，具有第一表面的间隙垫和沿着间隙垫的第一表面设置的润滑剂。润滑剂的粘度为约500cP以下。间隙垫在供热部件和冷却结构之间被压缩，使得间隙焊盘的第一表面与冷却结构热接触。

2. 发明授权

US09472487B2 Flexible electronic package integrated heat exchanger with cold plate and risers 有权
标题翻译：灵活的电子封装集成换热器与冷板和立管
公开(公告)号：US09472487B2
公开(公告)日：2016-10-18
申请号：US13558807
申请日：2012-07-26
申请人： Christopher R. Koontz , Charles Chu , Gilbert A. Flores
发明人： Christopher R. Koontz , Charles Chu , Gilbert A. Flores
IPC分类号： F28F7/00 , H01L23/433 , H05K7/20 , H01L23/473
CPC分类号： H01L23/4332 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20254 , H05K7/20509 , H01L2924/00
摘要： In some embodiments, a semiconductor cooling apparatus includes a heat exchanger configured to thermally couple to a semiconductor element to transfer heat to coolant flowing through the heat exchanger. The apparatus also includes a flexible coolant supply manifold and a flexible coolant return manifold. The flexible coolant supply manifold and flexible coolant return manifold flex to conform to a height of the semiconductor element to apply a force to maintain the thermal coupling between the heat exchanger and the semiconductor element. The apparatus also includes a cold plate located under the semiconductor element, the cold plate configured to couple to the flexible coolant supply manifold via a first riser to provide coolant to the flexible coolant supply manifold and configured to couple to the flexible coolant return manifold via a second riser to exhaust returned coolant to the cold plate.
摘要翻译：在一些实施例中，半导体冷却装置包括被配置为热耦合到半导体元件以将热量传递到流过热交换器的冷却剂的热交换器。该装置还包括柔性冷却剂供应歧管和柔性冷却剂回流歧管。柔性冷却剂供应歧管和柔性冷却剂返回歧管弯曲以符合半导体元件的高度以施加力以保持热交换器和半导体元件之间的热耦合。所述设备还包括位于所述半导体元件下方的冷板，所述冷板经配置以经由第一提升管耦合到所述柔性冷却剂供应歧管，以向所述柔性冷却剂供应歧管提供冷却剂，并经配置以经由第二提升管将返回的冷却剂排放到冷板。

3. 发明授权

US09553038B2 Semiconductor cooling apparatus 有权
标题翻译：半导体冷却装置
公开(公告)号：US09553038B2
公开(公告)日：2017-01-24
申请号：US13558759
申请日：2012-07-26
申请人： Christopher R. Koontz , Charles Chu , Rosalio S. Vidaurri
发明人： Christopher R. Koontz , Charles Chu , Rosalio S. Vidaurri
IPC分类号： F28F7/00 , H01L23/433 , H01L23/473
CPC分类号： H01L23/4332 , H01L23/473 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.
摘要翻译：用于冷却半导体元件的装置使用热交换器将热量从半导体元件传递到流过热交换器的冷却剂。由柔性材料制成的中心体位于热交换器和设置冷却剂的歧管之间。中心体包括流体耦合到每个热交换器和歧管的多个柔性流道，以将冷却剂提供给热交换器。热量通过冷却剂被转移离开半导体元件，并且加热的冷却剂从热交换器返回到歧管。每个柔性流道被构造为弯曲以符合相应的半导体元件的高度，从而向热交换器施加力以保持与半导体元件的接触。

4. 发明授权

US06820609B2 Low-profile ventilation hood 有权
标题翻译：低调通风罩
公开(公告)号：US06820609B2
公开(公告)日：2004-11-23
申请号：US10116154
申请日：2002-04-03
申请人： William Miles Woodall, III , Christopher R. Koontz
发明人： William Miles Woodall, III , Christopher R. Koontz
IPC分类号： F24C1520
CPC分类号： F24C15/20
摘要： The present invention provides a method, apparatus and system for safely and efficiently evacuating a ventilation hood having at least one blower unit disposed within a hood. The present invention incorporates an upper plenum frame having an opening in the bottom thereof. A squirrel cage fan is disposed about the opening to draw air down through the upper plenum frame, through a lower plenum, and out an exhaust duct connected to the lower plenum. In certain embodiments, the squirrel cage fan is driven at a speed appropriate to liquefy grease suspended in the heated air.
摘要翻译：本发明提供了一种安全有效地排空通风罩的方法，装置和系统，其具有设置在发动机罩内的至少一个鼓风机单元。本发明包括在其底部具有开口的上部增压框架。一个鼠笼式风扇设置在开口周围，以将空气向下通过上部通风架，通过一个下部通风室，并排出一个连接到下部通风室的排气管道。在某些实施例中，鼠笼式风扇以适于液化悬浮在加热空气中的油脂的速度被驱动。

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