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1. 发明授权

US08453314B2 Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle 有权
标题翻译：在柔性电路基板中使用细长楔形物和通道形状的容器形成通道的方法
公开(公告)号：US08453314B2
公开(公告)日：2013-06-04
申请号：US13368248
申请日：2012-02-07
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

2. 发明申请

US20130255917A1 SEMICONDUCTOR COOLING APPARATUS 有权
标题翻译：半导体冷却装置
公开(公告)号：US20130255917A1
公开(公告)日：2013-10-03
申请号：US13558759
申请日：2012-07-26
申请人： Christopher R. KOONTZ , Charles CHU , Rosalio S. VIDAURRI
发明人： Christopher R. KOONTZ , Charles CHU , Rosalio S. VIDAURRI
IPC分类号： F28D15/00
CPC分类号： H01L23/4332 , H01L23/473 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： In some embodiments, a semiconductor cooling apparatus includes heat exchangers to transfer heat from semiconductor elements to coolant flowing through the heat exchangers. The apparatus also includes a plurality of supply flexible runners and return flexible runners, a supply flexible runner coupled to each heat exchanger for providing coolant to the respective heat exchanger and a return flexible runner coupled to each heat exchanger for exhausting returned coolant from the respective heat exchanger, each flexible runner flexing to conform to a height of a respective semiconductor element and apply a force to the respective heat exchanger to maintain contact of the heat exchanger with the respective semiconductor element. The apparatus also includes a manifold coupled to the plurality of supply flexible runners and the plurality of return flexible runners, the manifold for supplying coolant to the supply flexible runners and for exhausting returned coolant received from the return flexible runners.
摘要翻译：在一些实施例中，半导体冷却装置包括将热量从半导体元件传递到流过热交换器的冷却剂的热交换器。该装置还包括多个供应柔性流道和返回柔性流道，一个供应柔性流道，其耦合到每个热交换器，用于向相应的热交换器提供冷却剂;以及返回柔性流道，其连接到每个热交换器，用于从相应的热量排出返回的冷却剂交换器，每个柔性流道弯曲成符合相应的半导体元件的高度，并向相应的热交换器施加力以保持热交换器与相应半导体元件的接触。该装置还包括联接到多个供应柔性流道和多个返回柔性流道的歧管，该歧管用于将冷却剂供应到供应柔性流道并用于排出从回弹柔性流道接收的返回的冷却剂。

3. 发明授权

US09553038B2 Semiconductor cooling apparatus 有权
标题翻译：半导体冷却装置
公开(公告)号：US09553038B2
公开(公告)日：2017-01-24
申请号：US13558759
申请日：2012-07-26
申请人： Christopher R. Koontz , Charles Chu , Rosalio S. Vidaurri
发明人： Christopher R. Koontz , Charles Chu , Rosalio S. Vidaurri
IPC分类号： F28F7/00 , H01L23/433 , H01L23/473
CPC分类号： H01L23/4332 , H01L23/473 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.
摘要翻译：用于冷却半导体元件的装置使用热交换器将热量从半导体元件传递到流过热交换器的冷却剂。由柔性材料制成的中心体位于热交换器和设置冷却剂的歧管之间。中心体包括流体耦合到每个热交换器和歧管的多个柔性流道，以将冷却剂提供给热交换器。热量通过冷却剂被转移离开半导体元件，并且加热的冷却剂从热交换器返回到歧管。每个柔性流道被构造为弯曲以符合相应的半导体元件的高度，从而向热交换器施加力以保持与半导体元件的接触。

4. 发明申请

US20120137505A1 PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE 有权
标题翻译：制造ORIGAMI形成的天线放射结构的方法
公开(公告)号：US20120137505A1
公开(公告)日：2012-06-07
申请号：US13368248
申请日：2012-02-07
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

5. 发明授权

US08127432B2 Process for fabricating an origami formed antenna radiating structure 有权
标题翻译：用于制作折纸形天线辐射结构的工艺
公开(公告)号：US08127432B2
公开(公告)日：2012-03-06
申请号：US12620544
申请日：2009-11-17
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

6. 发明申请

US20110113618A1 PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE 有权
标题翻译：制造ORIGAMI形成的天线放射结构的方法
公开(公告)号：US20110113618A1
公开(公告)日：2011-05-19
申请号：US12620544
申请日：2009-11-17
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

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