专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013019020A Method for manufacturing power module 有权
标题翻译：制造电源模块的方法
公开(公告)号：JP2013019020A
公开(公告)日：2013-01-31
申请号：JP2011152954
申请日：2011-07-11
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： HIRANO MASATERU , OZAKI TOMOKO , TAKATANI TOMOKI , IKEJIRI TAKASHI , TAKANO HIROYUKI , MIYAZAKI TOMOHIRO
IPC分类号： C23C24/04 , H01L21/52 , H01L23/373 , H01L25/07 , H01L25/18
CPC分类号： H01L24/83 , H01L2224/83191 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a power module, in which the generation of a void is suppressed in a solder, and the adhesion between a power element and a base material can be improved.SOLUTION: A film formation step is for blowing metal powder in a solid phase together with a compressed carrier gas to form a metal film, on a surface of the base material 11, for soldering the power element 15. The film formation method includes: a first film formation step of blowing the metal powder against the surface of the base material 11 at a blowing pressure such that the carrier gas is contained to form a first metal film 12 made of the metal powder, on the surface of the base material 11; and a second film formation step of blowing the metal powder against a surface of the first metal film 12 at a blowing pressure lower than the blowing pressure of the metal powder in the first film formation step to form a second metal film 13 made of the metal powder, on the surface of the first metal film.
摘要翻译：要解决的问题：提供一种制造功率模块的方法，其中在焊料中抑制空穴的产生，并且可以提高功率元件和基材之间的粘合性。解决方案：成膜步骤用于在基材11的表面上与压缩的载气一起吹入固相中的金属粉末以形成金属膜，用于焊接功率元件15.成膜方法包括：第一成膜步骤，以使得载体载体形成由金属粉末制成的第一金属膜12的吹塑压力将金属粉末吹在基材11的表面上，在基材的表面上材料11; 以及第二成膜步骤，在第一成膜步骤中以比金属粉末的吹送压力低的吹塑压力将金属粉末吹向第一金属膜12的表面，以形成由金属制成的第二金属膜13 粉末，在第一金属膜的表面上。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2010270349A Method for depositing coating film containing carbon particle, heat transfer member, power module, and inverter for vehicle 有权
标题翻译：用于沉积含有碳颗粒的涂层膜，热传递构件，功率模块和车辆逆变器的方法
公开(公告)号：JP2010270349A
公开(公告)日：2010-12-02
申请号：JP2009121031
申请日：2009-05-19
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： MIYAMOTO NORITAKA , TSUZUKI YOSHIHIKO , OZAKI TOMOKO
IPC分类号： C23C24/04 , B60L9/18 , H02M7/48
CPC分类号： C23C4/067 , C23C4/01 , Y10T428/30
摘要： PROBLEM TO BE SOLVED: To provide a method for depositing a coating film containing carbon particles capable of manufacturing the coating film containing carbon particles at a low cost, a heat transfer member, a power module having the heat transfer member, and an inverter for a vehicle having the module. SOLUTION: In the film deposition method, a coating film 12 containing carbon particles 12b is deposited by spraying powder for film deposition containing carbon powder consisting of carbon particles on the surface of a base material. Slurry for film deposition is manufactured by mixing liquid to be vaporized at least at the spraying temperature of the surface of the base material with the powder for film deposition, and the slurry for film deposition is sprayed on the surface of the base material at the spraying temperature to deposit the coating film 12 containing carbon particles. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种沉积含有能够以低成本制造含有碳颗粒的涂膜的碳颗粒的涂膜的方法，传热构件，具有传热构件的功率模块和具有该模块的车辆用逆变器。解决方案：在成膜方法中，通过在基材表面上喷涂含有由碳颗粒组成的碳粉末的薄膜沉积来沉积含有碳颗粒12b的涂膜12。通过将至少在基材表面的喷涂温度下蒸发的液体与用于成膜的粉末混合来制造用于成膜的浆料，并且用于成膜的浆料在喷涂时喷涂在基材的表面上温度以沉积含有碳颗粒的涂膜12。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010189754A Method of depositing metallic film, heat transfer member, power module, and inverter for vehicle 审中-公开
标题翻译：沉积金属薄膜的方法，热传递构件，功率模块和逆变器
公开(公告)号：JP2010189754A
公开(公告)日：2010-09-02
申请号：JP2009038373
申请日：2009-02-20
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： OZAKI TOMOKO , TSUZUKI YOSHIHIKO , MIYAMOTO NORITAKA
IPC分类号： C23C24/04 , C23C8/12
摘要： PROBLEM TO BE SOLVED: To provide a method of depositing metallic film by which the deposition efficiency of copper powder even when forming the metallic film by spraying the copper powder in a solid phase state as it is to a substrate by using low-pressure compression gas, to provide a heat transfer member manufactured by the method of depositing metallic film, to provide a power module with the heat transfer member, and to provide an inverter for vehicle with the power module.
SOLUTION: The method of depositing metallic film comprises: a film-thickening process of increasing the thickness of oxide film 3b formed on the surface of the copper powder 3A to produce film-thickened copper powder 3B; and a film-depositing process of depositing the metallic film 12 on the surface of the substrate 11 by spraying the film-thickening copper powder 3B after the film-thickening process in the solid state against the surface of the substrate 11 together with the compression gas.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种沉积金属膜的方法，即使在通过使用低分子量聚合物将铜粉末以固相状态喷涂到基板上时，即使形成金属膜也可以使铜粉的沉积效率，提供通过沉积金属膜的方法制造的传热构件，以提供具有传热构件的功率模块，并提供具有功率模块的车辆用逆变器。解决方案：沉积金属膜的方法包括：增加形成在铜粉3A的表面上的氧化膜3b的厚度以形成薄膜增厚的铜粉3B的薄膜增稠方法; 以及将金属膜12沉积在基板11的表面上的成膜方法，通过在固态的膜增稠处理之后，将薄膜增稠铜粉3B与压缩气体一起喷射到基板11的表面。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2014156634A Powder for cold spray, production method thereof, and film deposition method of copper-based film by use thereof 审中-公开
标题翻译：用于冷喷粉的粉末，其生产方法及其使用的基于铜箔的薄膜沉积方法
公开(公告)号：JP2014156634A
公开(公告)日：2014-08-28
申请号：JP2013028198
申请日：2013-02-15
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： OZAKI TOMOKO , HIRANO MASAKI , USUI HIROKI
IPC分类号： C23C24/04 , B22F1/00 , B22F1/02
摘要： PROBLEM TO BE SOLVED: To provide powder for cold spray capable of heightening adhesion efficiency onto a substrate even in the case of spherical copper-based powder, and to provide a film deposition method of a copper-based film.SOLUTION: In powder for cold spray comprising copper-based particles produced by a gas atomization method or copper-based particles 3B produced spherically by a water atomization method, an oxide film 3c comprising cuprous oxide (CuO) having the thickness of 10 nm-53 nm is coated on the surface of the copper-based particles.
摘要翻译：要解决的问题：即使在球形铜基粉末的情况下，也可以提供即使在球状铜基粉末的情况下也能够提高基材附着效率的冷喷涂粉末，并提供铜基薄膜的成膜方法。包含通过气雾化法制造的铜基颗粒或通过水雾化法制造的铜基颗粒3B的喷涂包括厚度为10nm-53nm的氧化亚铜（CuO）的氧化膜3c在表面上的铜基颗粒。

5. 发明专利

JP2013125952A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013125952A
公开(公告)日：2013-06-24
申请号：JP2011275879
申请日：2011-12-16
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： HIRANO MASATERU , OZAKI TOMOKO , YANAGIMOTO HIROSHI , USUI HIROKI
IPC分类号： H01L23/36
CPC分类号： H01L2224/83385
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which a circuit board and a semiconductor element are connected via a solder layer; which includes another layer between the circuit board and the solder layer to achieve favorable solder wettability; and which can inhibit accumulation of voids among layers thereby to achieve high connection strength between the solder layer and the other layer.SOLUTION: A semiconductor device 10 in which a circuit board 4 composed of Al or an Al alloy and a semiconductor element 1 are connected via a solder layer 3, comprises a metal powder layer 2 formed by lamination of metal powder composed of Ni, Cu, Ag, Au or an alloy of any of the metals, which is sandwiched between the circuit board 4 and the solder layer 3. The metal powder layer 2 includes groove strips 2b traversing the metal powder layer 2 on a surface 2a on the solder layer side.
摘要翻译：要解决的问题：提供其中电路板和半导体元件经由焊料层连接的半导体器件; 其包括电路板和焊料层之间的另一层，以获得良好的焊料润湿性; 并且可以抑制层间的空隙的积聚，从而实现焊料层和另一层之间的高连接强度。解决方案：其中由Al或Al合金构成的电路板4和半导体元件1通过焊料层3连接的半导体器件10包括通过层压由Ni构成的金属粉末形成的金属粉末层2 ，Cu，Ag，Au或任何金属的合金，其被夹在电路板4和焊料层3之间。金属粉末层2包括在其上的表面2a上穿过金属粉末层2的槽条2b 焊层一面。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2014096319A Aggregated conductor and coil 审中-公开
标题翻译：集成导体和线圈
公开(公告)号：JP2014096319A
公开(公告)日：2014-05-22
申请号：JP2012248513
申请日：2012-11-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： HIRAOKA MOTOKI , YANAGIMOTO HIROSHI , OZAKI TOMOKO
IPC分类号： H01B7/00 , H01B7/02 , H01F5/06 , H01F27/28 , H02K3/30
摘要： PROBLEM TO BE SOLVED: To provide an aggregated conductor exhibiting an eddy current loss reduction effect and having excellent weldability, and a coil formed by coiling the aggregated conductor.SOLUTION: Provided is an aggregated conductor 10 formed by bundling a plurality of element wires 3 made of a conductor 1 and an insulation film 2 formed around the conductor 1. The insulation film 2 is formed from silicone, and also, its thickness lies in the range of 10 μm or less.
摘要翻译：要解决的问题：提供具有涡流损耗降低效果并且具有优异焊接性的聚集体，以及通过卷绕聚集的导体形成的线圈。解决方案：提供一种聚集导体10，其通过将多个元素线3 导体1和形成在导体1周围的绝缘膜2.绝缘膜2由硅酮形成，并且其厚度在10μm以下的范围内。

7. 发明专利

JP2013072093A Connection structure between different kinds of metal members 审中-公开
标题翻译：金属成员不同种类之间的连接结构
公开(公告)号：JP2013072093A
公开(公告)日：2013-04-22
申请号：JP2011209742
申请日：2011-09-26
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： OZAKI TOMOKO , HIRANO MASATERU , USUI HIROKI
IPC分类号： C23C24/04
摘要： PROBLEM TO BE SOLVED: To provide a connection structure between different kinds of metal members, wherein no brittle metal phase is formed at an interface of the metal members and increase in electric resistance or thermal resistance between the metal members is prevented.SOLUTION: In the connection structure 10, different kinds of metal members 1 and 2 are at least partially contacting each other, a metallic film 3 extending across both metal members 1 and 2 is closely attached to the metal members 1 and 2, and the metal members 1 and 2 are indirectly connected to each other via the metallic film 3. The metallic film 3 may be formed by a cold spray method or a warm spray method.
摘要翻译：要解决的问题：为了提供不同种类的金属构件之间的连接结构，其中在金属构件的界面处没有形成脆性金属相，并且防止金属构件之间的电阻或耐热性增加。解决方案：在连接结构10中，不同种类的金属构件1和2至少部分地彼此接触，跨过金属构件1和2延伸的金属膜3紧密地附接到金属构件1和2，并且金属构件1和2经由金属膜3彼此间接连接。金属膜3可以通过冷喷涂法或暖喷法形成。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式