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    • 1. 发明专利
    • Electronic component, and film capacitor
    • 电子元件和薄膜电容器
    • JP2008091764A
    • 2008-04-17
    • JP2006272841
    • 2006-10-04
    • Toyota Motor Corpトヨタ自動車株式会社
    • HIRANO MASATERU
    • H01G4/18
    • PROBLEM TO BE SOLVED: To form an electrode having a sufficient thickness, without giving any thermal influence to a film material (a base material).
      SOLUTION: In the forming method of an electronic component, one or more kinds of pure Cu, a Cu-based alloy, pure Al, and an Al-based alloy are selected as a thermal-spray material for the electronic component, and then, the supersonic flow of a gas having a temperature not higher than the melting point or softening temperature of the thermal-spray material is generated, the powder particles of the thermal-spray material are injected into the supersonic-flow gas, and the thermal-spray material is made to collide with the base material in the state of its solid phase so as to use the resultantly generated film as the electrode of the electronic component.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:形成具有足够厚度的电极,而不对膜材料(基材)产生任何热影响。 解决方案:在电子部件的形成方法中,选择一种或多种纯Cu,Cu基合金,纯Al和Al基合金作为电子部件的热喷涂材料, 然后,产生温度不高于热喷涂材料的熔点或软化温度的气体的超音速流动,将热喷涂材料的粉末颗粒注入超声流动气体中,并且 使热喷涂材料以其固相的状态与基材碰撞,以便使用所产生的膜作为电子部件的电极。 版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Hollow member manufacturing device and hollow member manufacturing method
    • 中空会员制造设备和中空会员制造方法
    • JP2007245156A
    • 2007-09-27
    • JP2006067558
    • 2006-03-13
    • Toyota Motor Corpトヨタ自動車株式会社
    • TAKAMA HISANORIHAYASHI SOICHIHAYASAKA TOSHIAKIHIRANO MASATERU
    • B21C23/00B21C23/08B21C25/04
    • PROBLEM TO BE SOLVED: To provide a hollow member manufacturing device for manufacturing a structure-controlled hollow member by performing the shear deformation of an extruded material, which is capable of enhancing the productivity of the hollow member and suppressing the manufacturing cost.
      SOLUTION: The hollow member manufacturing device 10 comprises an extruding unit 14 for extruding a material 12, and a mandrel 16 which is arranged facing the extruded material 12 to form a hollow portion in the extruded material. The extruding unit 14 and the mandrel 16 are arranged with a shear deformation working passage 22 for performing the shear deformation by bending the extruded material 12. The hollow member manufacturing device 10 manufactures the structure-controlled hollow member by performing the shear deformation of the extruded material 12 through the shear deformation working passage 22. A container 18 of the extruding unit 14 and the mandrel 16 include a plurality of stages 24, 30, respectively, and are arranged so that the shear deformation working passage 22 has a plurality of bends.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 解决的问题:提供一种通过进行挤出材料的剪切变形来制造结构受控的中空构件的中空构件制造装置,其能够提高中空构件的生产率并抑制制造成本。 解决方案:中空构件制造装置10包括用于挤出材料12的挤出单元14和布置成面向挤出材料12的心轴16,以在挤出材料中形成中空部分。 挤出单元14和心轴16配置有剪切变形工作通道22,用于通过弯曲挤出材料12来进行剪切变形。中空构件制造装置10通过执行挤压成型工序22的剪切变形来制造结构受控的中空构件 材料12通过剪切变形工作通道22.挤出单元14和心轴16的容器18分别包括多个阶段24,30,并且被布置成使得剪切变形工作通道22具有多个弯曲部。 版权所有(C)2007,JPO&INPIT
    • 5. 发明专利
    • Connection structure between different kinds of metal members
    • 金属成员不同种类之间的连接结构
    • JP2013072093A
    • 2013-04-22
    • JP2011209742
    • 2011-09-26
    • Toyota Motor Corpトヨタ自動車株式会社
    • OZAKI TOMOKOHIRANO MASATERUUSUI HIROKI
    • C23C24/04
    • PROBLEM TO BE SOLVED: To provide a connection structure between different kinds of metal members, wherein no brittle metal phase is formed at an interface of the metal members and increase in electric resistance or thermal resistance between the metal members is prevented.SOLUTION: In the connection structure 10, different kinds of metal members 1 and 2 are at least partially contacting each other, a metallic film 3 extending across both metal members 1 and 2 is closely attached to the metal members 1 and 2, and the metal members 1 and 2 are indirectly connected to each other via the metallic film 3. The metallic film 3 may be formed by a cold spray method or a warm spray method.
    • 要解决的问题:为了提供不同种类的金属构件之间的连接结构,其中在金属构件的界面处没有形成脆性金属相,并且防止金属构件之间的电阻或耐热性增加。 解决方案:在连接结构10中,不同种类的金属构件1和2至少部分地彼此接触,跨过金属构件1和2延伸的金属膜3紧密地附接到金属构件1和2, 并且金属构件1和2经由金属膜3彼此间接连接。金属膜3可以通过冷喷涂法或暖喷法形成。 版权所有(C)2013,JPO&INPIT
    • 9. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2013125952A
    • 2013-06-24
    • JP2011275879
    • 2011-12-16
    • Toyota Motor Corpトヨタ自動車株式会社
    • HIRANO MASATERUOZAKI TOMOKOYANAGIMOTO HIROSHIUSUI HIROKI
    • H01L23/36
    • H01L2224/83385
    • PROBLEM TO BE SOLVED: To provide a semiconductor device in which a circuit board and a semiconductor element are connected via a solder layer; which includes another layer between the circuit board and the solder layer to achieve favorable solder wettability; and which can inhibit accumulation of voids among layers thereby to achieve high connection strength between the solder layer and the other layer.SOLUTION: A semiconductor device 10 in which a circuit board 4 composed of Al or an Al alloy and a semiconductor element 1 are connected via a solder layer 3, comprises a metal powder layer 2 formed by lamination of metal powder composed of Ni, Cu, Ag, Au or an alloy of any of the metals, which is sandwiched between the circuit board 4 and the solder layer 3. The metal powder layer 2 includes groove strips 2b traversing the metal powder layer 2 on a surface 2a on the solder layer side.
    • 要解决的问题:提供其中电路板和半导体元件经由焊料层连接的半导体器件; 其包括电路板和焊料层之间的另一层,以获得良好的焊料润湿性; 并且可以抑制层间的空隙的积聚,从而实现焊料层和另一层之间的高连接强度。 解决方案:其中由Al或Al合金构成的电路板4和半导体元件1通过焊料层3连接的半导体器件10包括通过层压由Ni构成的金属粉末形成的金属粉末层2 ,Cu,Ag,Au或任何金属的合金,其被夹在电路板4和焊料层3之间。金属粉末层2包括在其上的表面2a上穿过金属粉末层2的槽条2b 焊层一面。 版权所有(C)2013,JPO&INPIT