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1. 发明专利

JP2007335530A Semiconductor module and semiconductor device 有权
标题翻译：半导体器件和半导体器件
公开(公告)号：JP2007335530A
公开(公告)日：2007-12-27
申请号：JP2006163781
申请日：2006-06-13
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , KUNO HIROMICHI , YAMADA YASUSHI , OSADA YUJI , YOKOI YUTAKA
IPC分类号： H01L23/473 , H02M7/00
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module and a semiconductor device having improved cooling performance. SOLUTION: The semiconductor device has a case 61 for allowing a cooling medium to flow; and a plurality of semiconductor modules 1-3. The semiconductor modules 1-3 include at least one semiconductor element sealed with resin. The plurality of semiconductor modules 1-3 are arranged in the case 61. The plurality of semiconductor modules 1-3 are arranged at nearly the same positions to the flow direction of a cooling medium shown by an arrow 111 discharged from a discharge pipe 62a supplied from a supply pipe 61a. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改进的冷却性能的半导体模块和半导体器件。解决方案：半导体器件具有用于允许冷却介质流动的壳体61; 和多个半导体模块1-3。半导体模块1-3包括用树脂密封的至少一个半导体元件。多个半导体模块1-3布置在壳体61中。多个半导体模块1-3被布置在与从提供的排放管62a排出的箭头111所示的冷却介质的流动方向几乎相同的位置从供给管61a。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007335517A Condenser 有权
标题翻译：冷凝器
公开(公告)号：JP2007335517A
公开(公告)日：2007-12-27
申请号：JP2006163584
申请日：2006-06-13
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , YOKOI YUTAKA , OSADA YUJI
IPC分类号： H01L23/427
CPC分类号： H01L23/427 , F28F3/048 , F28F13/187 , F28F2215/10 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a condenser capable of cooling uniformly.
SOLUTION: The condenser has a heat transfer member 1 for spraying a cooling liquid to the surface. The heat transfer member 1 includes: a first groove 1a formed on the surface; and a second groove 1b that is formed on the surface and crosses the first groove 1a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀冷却的冷凝器。解决方案：冷凝器具有用于将冷却液喷射到表面的传热构件1。传热构件1包括：形成在表面上的第一槽1a; 以及形成在表面上并与第一槽1a相交的第二槽1b。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007333357A Cooler 有权
标题翻译： COOLER
公开(公告)号：JP2007333357A
公开(公告)日：2007-12-27
申请号：JP2006168752
申请日：2006-06-19
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , YOKOI YUTAKA , OSADA YUJI
IPC分类号： F25D9/00 , H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooler capable of executing even cooling in relation to coolers having a matter to be cooled which is an object of cooling arranged on a surface of the cooler and cooling the same. SOLUTION: The cooler is provided with a plurality of channels 21-25. Branch parts 16 formed to supply liquid is provided on each of the plurality of channels 21-25. A merging part 17 formed to make liquid discharged from each of the plurality of channels 21-25 and merged is provided. The branch parts 16 and the merging part 17 are arranged on a diagonal line L of the cooler. Flow in side regulating parts 11a-15a and flow out side regulating part 11b-15b for regulating flow rate of each of the plurality of channels 21-25 are formed on inlet side end parts and outlet side end parts of the channels 21-25. In each of the channels 21-25, width of the channels 21-25 are established according to length from the branch part 16 to the merging part 17. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够相对于具有作为冷却对象的冷却对象的冷却器执行均匀冷却的冷却器，其布置在冷却器的表面上并对其进行冷却。解决方案：冷却器设有多个通道21-25。形成为供给液体的分支部16设置在多个通道21-25的每一个上。形成为使从多个通道21-25中的每一个排出的液体合并而合并的合流部17。分支部16和合流部17配置在冷却器的对角线L上。在通道21-25的入口侧端部和出口侧端部形成有用于调节多个通道21-25中的每一个的流量的侧限制部11a-15a和流出侧限制部11b-15b中的流动。在每个通道21-25中，通道21-25的宽度根据从分支部分16到合并部分17的长度建立。版权所有：（C）2008，JPO＆INPIT

4. 发明专利

JP2007141872A Cooling apparatus 有权
标题翻译：冷却装置
公开(公告)号：JP2007141872A
公开(公告)日：2007-06-07
申请号：JP2005329039
申请日：2005-11-14
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , OSADA YUJI , YOKOI YUTAKA
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a cooling apparatus having improved cooling capability while reducing uneven cooling by solving a stagnant region due to interference of a plurality of jet streams. SOLUTION: The cooling apparatus 100 is provided with a coolant path 40 provided with at least two jet ports 12, 14 and 16 for jetting a coolant; and a heat transfer plate 42 in which semiconductor elements 1-3 as cooling objects are mounted on a first main surface 44, and the coolant to be jetted from the jetting ports 12, 14 and 16 collides against a second main surface 46. The heat transfer plate 42 has grooves 21-24 as a structure for reducing the stagnant region due to the interference of the plurality of jet streams B4, B5 to be jetted from the at least two jetting ports 11-16, on the second main surface 46. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的冷却能力的冷却装置，同时通过解决由于多个喷射流的干扰而导致的停滞区域来减少不均匀的冷却。解决方案：冷却装置100设置有设置有至少两个用于喷射冷却剂的喷射口12,14和16的冷却剂路径40; 以及其中作为冷却对象的半导体元件1-3安装在第一主表面44上的传热板42，并且从喷射口12,14和16喷射的冷却剂与第二主表面46碰撞。热量传递板42具有凹槽21-24作为用于由于在第二主表面46上从至少两个喷射口11-16喷射的多个喷射流B4，B5的干涉而减少停滞区域的结构。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007281163A Cooler 有权
标题翻译： COOLER
公开(公告)号：JP2007281163A
公开(公告)日：2007-10-25
申请号：JP2006105056
申请日：2006-04-06
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , YOKOI YUTAKA , OSADA YUJI
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooler for semiconductor elements whose cooling performance is excellent.
SOLUTION: The cooler has a substrate 1 for disposing therein semiconductor elements 21, plate-form members 2 fastened to the rear surface of the substrate 1, a main tube 11, and auxiliary tubes 12. Also, the first flow passage of a refrigerant is constituted out of the space interposed between the substrate 1 and the main tube 11. Further, the second flow passages of the refrigerant are constituted out of the main tube 11 and the auxiliary tubes 12. Moreover, each auxiliary tube 12 is so disposed as to jet the refrigerant toward the region wherein the semiconductor elements 21 are disposed. Furthermore, the second flow passages are formed separately from the first flow passage.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供冷却性能优异的半导体元件的冷却器。解决方案：冷却器具有用于设置半导体元件21的基板1，紧固到基板1的后表面的板状构件2，主管11和辅助管12.另外，第一流路制冷剂由介于基板1和主管11之间的空间构成。此外，制冷剂的第二流路由主管11和辅助管12构成。此外，各辅助管12为设置成将制冷剂喷射到其中设置有半导体元件21的区域。此外，第二流路与第一流路分开形成。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008021721A Chiller, and vehicle including the same 有权
标题翻译： CHILLER和车辆，包括它们
公开(公告)号：JP2008021721A
公开(公告)日：2008-01-31
申请号：JP2006190368
申请日：2006-07-11
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , YOKOI YUTAKA , OSADA YUJI
IPC分类号： H05K7/20 , H01L23/473 , H02M7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a chiller with improved cooling efficiency and reduced unevenness in cooling.
SOLUTION: The chiller is equipped with an inlet 26 for a coolant medium and an outlet for discharging the coolant, and includes a heat absorber 10 for sealing the coolant at parts other than the inlet and the outlet. The absorber 10 includes an upper member 32 having a placement surface 36 on which semiconductor elements 21-23 to be cooled are placed and a cooling surface 38 which is the rear of the surface 36, and a lower member 34 forming a chamber having the cooling surface 38 as part of an inner wall surface together with the upper member 32. The lower member 34 is equipped with spouts 41-43 communicating with the inlet 26 for ejecting the coolant toward the cooling surface 38, and an outlet at a lower position than the opening position of the spouts 41-43.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有改善的冷却效率和减少冷却不均匀性的冷却器。解决方案：冷却器配备有用于冷却剂介质的入口26和用于排出冷却剂的出口，并且包括用于在除入口和出口之外的部分处密封冷却剂的吸热体10。吸收器10包括具有放置表面36的上部构件32，待放置的半导体元件21-23被放置在其上，并且作为表面36的后部的冷却表面38和形成具有冷却的室的下部构件34 表面38与上部构件32一起作为内壁表面的一部分。下部构件34配备有与入口26连通的喷口41-43，用于将冷却剂朝向冷却表面38排出，并且出口处于低于喷口41-43的打开位置。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007335588A Heat sink and condenser 有权
标题翻译：散热器和冷凝器
公开(公告)号：JP2007335588A
公开(公告)日：2007-12-27
申请号：JP2006164956
申请日：2006-06-14
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , OSADA YUJI , YOKOI YUTAKA
IPC分类号： H01L23/473 , F28F3/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/02 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink capable of cooling uniformly.
SOLUTION: The heat sink comprises a plurality of fins 1a, 2a and 3a. The fins 1a, 2a and 3a are formed so that they become partitions of the channels of refrigerants. The fins 1a, 2a and 3a are formed so that the refrigerants flow along a surface. Merge spaces 36, 37 are formed so that the media in channels separated by the fins 1a, 2a and 3a are merged. The merge spaces 36, 37 are formed in the middle of the channels formed of the fins 1a, 2a and 3a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀冷却的散热器。散热器包括多个翅片1a，2a和3a。翅片1a，2a和3a形成为它们成为制冷剂通道的隔板。翅片1a，2a和3a形成为使得制冷剂沿着表面流动。合并空间36,37形成为使得由翅片1a，2a和3a分离的通道中的介质合并。合流空间36,37形成在由翅片1a，2a和3a形成的通道的中间。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007258352A Cooler 有权
标题翻译： COOLER
公开(公告)号：JP2007258352A
公开(公告)日：2007-10-04
申请号：JP2006078967
申请日：2006-03-22
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , NISHIBE YUJI , YOKOI YUTAKA
IPC分类号： H01L23/473 , H02M1/00 , H05K7/20
CPC分类号： H01L24/33 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooler for a semiconductor element as a power converter excellent in cooling performance. SOLUTION: The cooler is provided with a coolant flowing tube 9 joined by a solder 11 to one surface of the semiconductor element 1 as a power converter, and formed so that a coolant may flow through in its inside; a cooling plate 5 formed of a material excellent in thermal conductivity and having a concave portion 5a joined by a solder 11 on a surface opposite to the one surface of the semiconductor element 1; and a coolant jetting device for jetting a coolant toward the concave portion 5a of the cooling plate, as shown by an arrow 42. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于半导体元件的冷却器，作为冷却性能优异的功率转换器。解决方案：冷却器设置有由焊料11连接到作为功率转换器的半导体元件1的一个表面的冷却剂流动管9，并且形成为使得冷却剂可以在其内部流过; 由导热性优异的材料形成的冷却板5，在与半导体元件1的一个表面相反的表面上具有通过焊料11接合的凹部5a; 以及用于朝向冷却板的凹部5a喷射冷却剂的冷却剂喷射装置，如箭头42所示。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005143269A Rotary electric machine 有权
标题翻译：旋转电机
公开(公告)号：JP2005143269A
公开(公告)日：2005-06-02
申请号：JP2003380068
申请日：2003-11-10
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOKOI YUTAKA , MOCHIZUKI MIYO , TANIGUCHI YOSUKE , INAGUMA YUKIO , ARAKAWA TOSHIFUMI , TAJIMA SHIN , HATTORI TAKESHI , KASHIWABARA KANSHIN , KAMIYA MUNEHIRO
IPC分类号： H02K1/20 , H02K1/02 , H02K1/18 , H02K9/19 , H02K9/22
CPC分类号： Y02T10/641
摘要： PROBLEM TO BE SOLVED: To provide a rotary electric machine in which a size reduction and a high performance are realized by improving a cooling method.
SOLUTION: In the rotary electric machine, assuring of a magnetic path by the deflection of a magnetic flux line 25 and enlarging of a region 26 which can be cooled are realized by forming a stator core 23 of a dust core material and adding a collar-like additional region 23a to this stator core 23. The reason why such a constitution is formed is because since a loss heat is generated in response to a magnetic flux in the stator core 23 and simultaneously the heat is added as the current loss of the stator coil 22 itself at the place where the magnetic flux in the stator core 23 is generated around a stator coil 22 from the stator to the magnet of a rotor, it is desired to set a refrigerant channel 26 in the region which surrounds the magnetic flux in the stator core 23. In other words, the stator core 23 is suitable to have the refrigerant channel 26 in the interior or the front surface of the stator core of the region which is not interfered with the dense part the magnetic flux line 25 generated with the stator coil 22, and passing through the interior of the stator core 23.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供通过改进冷却方法来实现尺寸减小和高性能的旋转电机。解决方案：在旋转电机中，通过磁通线25的偏转确保磁路的径向，并且可以冷却的区域26的扩大通过形成防尘芯材料的定子芯23并添加形成该定子铁芯23的轴环状附加区域23a。形成这种结构的原因是因为由于在定子铁心23中响应于磁通量而产生损耗热量，同时加上热量作为电流损耗定子线圈22本身在定子铁心23的磁通量从定子绕转子的定子线圈22周围产生的位置处，因此希望将制冷剂通道26设置在围绕定子铁芯23中的磁通量。换句话说，定子铁心23适于将制冷剂通道26设置在不干扰密实部分的区域的定子铁芯的内部或前表面中，磁通量 ne 25与定子线圈22产生并穿过定子芯23的内部。版权所有：（C）2005，JPO＆NCIPI

10. 发明专利

JP2007258458A Cooler 有权
标题翻译： COOLER
公开(公告)号：JP2007258458A
公开(公告)日：2007-10-04
申请号：JP2006081091
申请日：2006-03-23
申请人： Toyota Central Res & Dev Lab Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田中央研究所
发明人： YOSHIDA TADASHI , OSADA YUJI , YOKOI YUTAKA
IPC分类号： H01L23/473 , H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a small cooler for a semiconductor element which is excellent in cooling performance. SOLUTION: The cooler used for the semiconductor element 1d is provided with a jetting substrate 2 arranged so as to oppose the apparatus substrate 1 including the semiconductor element 1d. The jetting substrates 2 are stacked on the apparatus substrates 1. The jetting substrate 2 has a jetting hole 2d formed to jet a coolant to the apparatus substrate 1. The jetting substrates 2 are arranged on both sides of front and rear surfaces of the apparatus substrate 1. COPYRIGHT: (C)2008,JPO&INPIT

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