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    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH0917856A
    • 1997-01-17
    • JP16635995
    • 1995-06-30
    • TOYOTA MOTOR CORP
    • KUROMIYA SHIGERUMASE AKIRAKUSHIDA TOMOYOSHI
    • H01L21/762H01L21/76H01L27/12
    • PURPOSE: To prevent a step in a trench region surface by simplifying a manufacturing process when a trench is formed by adopting a method including formation of a trench by etching a semiconductor substrate from an opening part formed in a first insulation film covering a surface of a semiconductor and a second film of a large etching velocity. CONSTITUTION: When a semiconductor device with a trench 22 is manufactured, a first insulation film 16 is formed to cover a surface of a semiconductor substrate 10 and a second film 18 whose etching velocity is larger than that of the first insulation film 16 is formed to cover a surface of the first insulation film 16. Then, an opening part 21 is formed in the first insulation film 16 and the second film 18 and a trench 22 is formed in the semiconductor substrate 10 from the opening part 21 by etching by using the first insulation film 16 and the second film 18 as a mask. After the second film 18 is removed by etching, a filler is put in the trench 22. For example, the first insulation film 16 is made a heat oxide film and the second film 18 is made a CVD oxide film or an SOG film.
    • 10. 发明专利
    • THIN FILM SEMICONDUCTOR DEVICE WITH IMPROVED BREAKDOWN STRENGTH
    • JPH06310524A
    • 1994-11-04
    • JP9459993
    • 1993-04-21
    • TOYOTA MOTOR CORP
    • KUROMIYA SHIGERU
    • H01L27/12H01L21/331H01L29/73
    • PURPOSE:To acquire necessary breakdown strength without increasing an area necessary for element formation by forming a dielectric isolation groove passing through an upper surface layer between a base region and a collector region. CONSTITUTION:An emitter region 13, a base region 14 and a collector region 15 are formed one by one along a main surface of a semiconductor layer 12 formed on an insulating supporting substrate 10. At least one region of the base region 14 and the collector region 15 has an impurity high concentration region formed inside an upper surface layer of the semiconductor layer 12 and an impurity low concentration region formed in a lower surface layer. A dielectric isolation groove 19 passing through an upper surface layer is further formed between the base region 14 and the collector region 15. The base region 14 and the emitter region 13 are connected because of the presence of the dielectric isolation groove 19 through an impurity low concentration region which is made to remain in a lower part of the impurity high concentration region formed inside the upper surface layer. Necessary breakdown strength characteristic can be acquired due to the presence of the impurity low concentration region.