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    • 1. 发明专利
    • Light-receiving device, and its manufacturing method
    • 光接收装置及其制造方法
    • JP2008028002A
    • 2008-02-07
    • JP2006196486
    • 2006-07-19
    • Toyota Central Res & Dev Lab IncToyota Gakuen学校法人トヨタ学園株式会社豊田中央研究所
    • OZAWA TAKAHIROOSAWA JUN
    • H01L31/108
    • PROBLEM TO BE SOLVED: To provide a light-receiving device that converts light of at least two kinds of wavelength regions into a current. SOLUTION: The light-receiving device 10 is provided with a first electrode 32, a second electrode 34, and a light-receiving region 20 provided between the first electrode 32 and the second electrode 34. The light-receiving region 20 has a first partial light-receiving region 26, and a second partial light-receiving region 28 that respectively have different band gap widths. The light-receiving device 10 is composed so that ultraviolet light is absorbed with the first partial light-receiving region 26 so as to be converted into a positive current flowing between the first electrode 32 and the second electrode 34, and blue light is absorbed with the second partial light-receiving region 28 so as to be converted into a negative current flowing between the first electrode 32 and the second electrode 34. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种将至少两种波长区域的光转换为电流的光接收装置。 解决方案:光接收装置10设置有设置在第一电极32和第二电极34之间的第一电极32,第二电极34和光接收区域20.光接收区域20具有 分别具有不同带隙宽度的第一部分光接收区域26和第二部分光接收区域28。 光接收装置10被构成为使得紫外光被第一部分光接收区域26吸收,以便转换为在第一电极32和第二电极34之间流动的正电流,并且蓝光被 第二部分光接收区域28,以便转换成在第一电极32和第二电极34之间流动的负电流。版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Group iii nitride-based compound semiconductor optical element
    • 第III类氮化物化合物半导体光学元件
    • JP2007158128A
    • 2007-06-21
    • JP2005352722
    • 2005-12-06
    • Toyoda Gosei Co LtdToyota Central Res & Dev Lab Inc株式会社豊田中央研究所豊田合成株式会社
    • KAMIMURA TOSHIYAHORIUCHI SHIGEMIOZAWA TAKAHIRO
    • H01L33/32H01L33/38H01L33/42
    • PROBLEM TO BE SOLVED: To optimize an electrode shape of an n layer side and a p layer side on top and bottom with a light-emitting region interposed. SOLUTION: The group III nitride-based compound semiconductor light-emitting element 1000 has an n-type silicon substrate 200 having conductive multilayer films on both surfaces as a supporting substrate. In the element, a transparent electrode 121-t consisting of ITO, a connection 121-c consisting of nickel (Ni), and a highly reflective metal layer 121-r consisting of aluminum (Al) are formed on the p side, and are electrically connected to the n-type silicon substrate 200 by a gold-tin solder (Au-20Sn) 50 via a multilayer metal film. In the light-emitting element 1000, a region where a multilayer metal film 130 is not formed as an n-electrode formed into a window frame is a light extracting region. For the shape of the connection 121-c consisting of nickel (Ni) of the p electrode side and the shape of the multilayer metal film 130 as an n electrode, orthographic projections do not overlap on each of light-emitting region L planes, and they are separated with a distance of 20 μm or more on either position. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了使介于发光区域的顶层和底部的n层侧和p层侧的电极形状优化。 解决方案:III族氮化物系化合物半导体发光元件1000具有在两面具有导电性多层膜的n型硅衬底200作为支撑衬底。 在该元件中,在p侧形成由ITO构成的透明电极121-t,由镍(Ni)构成的连接部121-c和由铝(Al)构成的高反射性金属层121-r, 通过金 - 锡焊料(Au-20Sn)50经由多层金属膜与n型硅衬底200电连接。 在发光元件1000中,未形成多层金属膜130的形成为窗框的n电极的区域是光提取区域。 对于由p电极侧的镍(Ni)构成的连接部121-c的形状和作为n电极的多层金属膜130的形状,在每个发光区域L平面上不重叠正交突起, 它们在任一位置上以20μm或更大的距离分开。 版权所有(C)2007,JPO&INPIT
    • 3. 发明专利
    • Semiconductor light emitting element
    • 半导体发光元件
    • JP2003332619A
    • 2003-11-21
    • JP2003164330
    • 2003-06-09
    • Toyoda Gosei Co LtdToyota Central Res & Dev Lab Inc株式会社豊田中央研究所豊田合成株式会社
    • KOIDE NORIKATSUKOIKE MASAYOSHIUMEZAKI JUNICHIWAKIGUCHI MITSUOASAMI SHINYAITO KENJIKACHI TORUTOMITA KAZUYOSHIOZAWA TAKAHIRO
    • H01L33/06H01L33/08H01L33/12H01L33/32H01L33/40H01L33/00
    • PROBLEM TO BE SOLVED: To retrieve light from a substrate side by emitting light of arbitrary chromaticity (saturation, hue) by a single pixel. SOLUTION: A semiconductor light emitting element comprises a first light emitting layer 3 and a second light emitting layer 9 laminated on a substrate 1 to emit lights of different chromaticities so that the first layer 3 is formed in a multiple quantum well structure. Since a forbidden band width can be changed by changing a crystal ratio of the layer 3 to the layer 9, the peak wavelength of the emitting light can be changed by the crystal ratio, and wavelength intensity characteristics of combined light of the lights emitted from the layers 3 and 9 are set to desired characteristics. Accordingly, the light having the arbitrary chromaticity can be emitted from the single pixel. The element also comprises a buffer layer 6 provided between the layer 3 and the layer 9, and since the light emitted from the layer 3 to an electrode 14 side is reflected to the substrate 1 side by the layer 6, the retrieving efficiency of the light from the substrate 1 side can be enhanced. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:通过以单个像素发出任意色度(饱和度,色调)的光来从基板侧检索光。 解决方案:半导体发光元件包括层叠在基板1上的第一发光层3和第二发光层9,以发射不同色度的光,使得第一层3形成为多量子阱结构。 由于可以通过改变层3与层9的晶体比来改变禁带宽度,所以可以通过晶体比改变发光的峰值波长,并且可以改变发射的光的组合光的波长强度特性 层3和9被设置为期望的特性。 因此,可以从单个像素发射具有任意色度的光。 该元件还包括设置在层3和层9之间的缓冲层6,并且由于从层3发射到电极14侧的光被层6反射到衬底1侧,所以光的检索效率 从基板1侧可以得到增强。 版权所有(C)2004,JPO
    • 8. 发明专利
    • Semiconductor element
    • 半导体元件
    • JP2007158129A
    • 2007-06-21
    • JP2005352723
    • 2005-12-06
    • Toyoda Gosei Co LtdToyota Central Res & Dev Lab Inc株式会社豊田中央研究所豊田合成株式会社
    • KAMIMURA TOSHIYAMORIYAMA JITSUKIHORIUCHI SHIGEMIOZAWA TAKAHIRO
    • H01L31/10H01L33/10H01L33/14H01L33/32H01L33/38H01L33/40
    • PROBLEM TO BE SOLVED: To laminate an oxide electrode with a metal electrode in which an oxide has insulative performance while it is a high-reflection metal. SOLUTION: An n-type layer 11 having a light-emitting region L and a p-type layer 12 are formed on a sapphire substrate 100. An ITO electrode 121-t, a connection 121-c made of Ni consisting of an SiN x dielectric layer 150 and its hole, and a high-reflection metal layer 121-r made of Al are formed. A Ti layer 122, an Ni layer 123, and an Au layer 124 are successively formed thereon. Subsequently, an n-type silicon substrate 200 is prepared, and conductive multilayer films are formed by vapor deposition in the order of TiN layers 221, 231, Ti layers 222, 232, Ni layers 223, 233 and Au layers 224, 234. Gold-tin solder (Au-20Sn) 51, 52 containing 20% tin are formed on these layers, thermal pressing is applied at 300°C, and two wafers are composited. After that, GaN on the surface of the n-type layer 11 is decomposed by laser irradiation from the sapphire substrate 100, and the sapphire substrate 100 is removed by lift-off. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了将氧化物电极与其中具有绝缘性能的金属电极层叠,同时是高反射金属。 解决方案:在蓝宝石衬底100上形成具有发光区域L和p型层12的n型层11. ITO电极121-t,由Ni构成的连接121-c,由 形成SiN x 介电层150及其孔,并且形成由Al制成的高反射金属层121-r。 在其上依次形成Ti层122,Ni层123和Au层124。 随后,制备n型硅衬底200,并且以TiN层221,231,Ti层222,232,Ni层223,233和Au层224,234的顺序通过气相沉积形成导电多层膜。金 在这些层上形成含有20%锡的锡焊料(Au-20Sn)51,52,在300℃下进行热压,并且复合两个晶片。 之后,通过激光照射从蓝宝石衬底100分解n型层11的表面上的GaN,通过剥离来去除蓝宝石衬底100。 版权所有(C)2007,JPO&INPIT
    • 9. 发明专利
    • Light emitting diode and its manufacturing method
    • 发光二极管及其制造方法
    • JP2005302804A
    • 2005-10-27
    • JP2004112796
    • 2004-04-07
    • Toyoda Gosei Co LtdToyota Central Res & Dev Lab Inc株式会社豊田中央研究所豊田合成株式会社
    • ASAI MAKOTOYAMAZAKI SHIROUBUKAWA MITSUHISAOZAWA TAKAHIRO
    • H01L33/20H01L33/32H01L33/34H01L33/00
    • PROBLEM TO BE SOLVED: To highly secure external quantum efficiency and light derivation efficiency when manufacturing a light emitting diode with a relatively short light emission wavelength using a crystal growth substrate consisting of semiconductor bulk crystal. SOLUTION: The light emitting diode includes, on the backside of an about 150 μm semiconductor crystal substrate 102 comprising a natural GaN bulk crystal, a flat face 102a to be polished finished by dry etching and a tapered face 102b to be ground finished by dry etching. In the active layer 105 of an MQW structure of ultraviolet ray emission, there are laminated a well layer 51 consisting of an about 2 nm thick Al 0.005 In 0.045 Ga 0.95 N, and a barrier layer 52 consisting of an about 18 nm thick Al 0.12 Ga 0.88 N alternately by 5 layers in total, on an about 10 nm thick n-type cladding layer 104 (low carrier concentration layer) consisting of GaN. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:使用由半导体本体晶体构成的晶体生长衬底制造具有相对短的发光波长的发光二极管时,可以高度确保外部量子效率和光的衍生效率。 解决方案:发光二极管在包括天然GaN体晶的约150μm半导体晶体衬底102的背面上包括通过干法蚀刻完成的待抛光的平坦面102a和待研磨的锥形面102b 通过干蚀刻。 在MQW紫外线发射结构的有源层105中,层叠有由约2nm厚的Al 0.005 0.95 N,以及由大约18nm厚的Al 0.12 Ga 0.88 N组成的阻挡层52,总共5层,约10nm 由GaN构成的厚n型包覆层104(低载流子浓度层)。 版权所有(C)2006,JPO&NCIPI
    • 10. 发明专利
    • Method of forming electrode on semiconductor substrate
    • 在半导体基板上形成电极的方法
    • JP2005044954A
    • 2005-02-17
    • JP2003202240
    • 2003-07-28
    • Toyoda Gosei Co LtdToyota Central Res & Dev Lab Inc株式会社豊田中央研究所豊田合成株式会社
    • ASAI MAKOTOYAMAZAKI SHIROOZAWA TAKAHIRO
    • H01L33/32H01L33/36H01S5/042H01S5/323H01L33/00
    • PROBLEM TO BE SOLVED: To efficiently suppress the driving voltage of a semiconductor element, relating to a method of forming an electrode on the polished surface of a semiconductor substrate consisting of a group III conductive nitride compound element and has already been polished. SOLUTION: Before an electrode forming process for forming a negative electrode (n electrode c) on the polished surface of the semiconductor substrate (a) consisting of a group III conductive nitride compound semiconductor and has already been polished, the polished surface is dry-etched. This semiconductor substrate (a) has the function of an n-type contact layer in a light-emitting diode 10. By dry-etching the polished surface before the electrode forming process, a damaged layer having deteriorated crystallinity can be removed and good ohmic contact can be obtained. It is considered that the above effect can be obtained because the damaged layer has a high resistivity due to deterioration of crystallinity. Also, according to the above method, since the necessity of suppressing the size of a slurry, a frictional force and pressure in polishing work is not particularly required, the polishing time of a semiconductor substrate can be shortened. Accordingly, according to this method, the productivity of the semiconductor element can also be improved. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了有效地抑制半导体元件的驱动电压,涉及在由III族导电氮化物复合元件组成的半导体衬底的抛光表面上形成电极的方法,并且已经被抛光。 解决方案:在由III族导电氮化物半导体组成的半导体衬底(a)的抛光表面上形成负极(n电极c)的电极形成工艺之前,已经被抛光,抛光表面是 干法蚀刻。 该半导体衬底(a)具有发光二极管10中的n型接触层的功能。通过在电极形成工艺之前对抛光表面进行干法蚀刻,可以去除具有劣化的结晶度的损伤层和良好的欧姆接触 可以获得。 认为可以获得上述效果,因为损坏层由于结晶度的劣化而具有高的电阻率。 此外,根据上述方法,由于不需要特别需要抑制浆料的尺寸,磨削加工中的摩擦力和压力,所以可以缩短半导体基板的研磨时间。 因此,根据该方法,也可以提高半导体元件的生产率。 版权所有(C)2005,JPO&NCIPI