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1. 发明专利

JP2009154239A Grinding wheel 有权
标题翻译：砂轮
公开(公告)号：JP2009154239A
公开(公告)日：2009-07-16
申请号：JP2007334248
申请日：2007-12-26
申请人： Toyoda Van Moppes Ltd , Toyota Industries Corp , 株式会社豊田自動織機 , 豊田バンモップス株式会社
发明人： KAMIYA KAZUNOBU , MOROTO TAKAYUKI , TAKEHARA HIROSHI , IMAIKE HIROO , KONO TAKUMA , KOJIMA TAKASHI
IPC分类号： B24D3/00 , B24D3/18
摘要： PROBLEM TO BE SOLVED: To stabilize machining accuracy from the start of usage of a grinding wheel up to the finishing.
SOLUTION: A segment chip 20 makes a surface side of a grinding wheel main body 21 formed with many pores 24 by bonding abrasive grains 22 by vitrified bond 23 as a pore sealing layer 26 sealed with sealant 25 made of thermosetting resin into the pores 24 from the surface, and makes the remainder except the pore sealing layer 26 of the grinding wheel main body 21 as a porous layer 27 in which the pores 24 are remained as they are without being sealed by the sealant 25. By retreating the surface of the sealant 25 of the pore sealing layer 26, a part of the abrasive grains 22 are projected on the surface of the pore sealing layer 26.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：从磨轮开始使用到精加工稳定加工精度。解决方案：分段芯片20通过将由玻璃化粘结剂23形成的磨粒22作为密封层26，将由热固性树脂制成的密封剂25密封在一起，形成具有许多孔24的砂轮主体21的表面侧，从表面除去孔24，除了砂轮主体21的孔密封层26以外的其余部分作为多孔层27，其中孔24保持原样，而不被密封剂25密封。通过后退表面的孔密封层26的密封剂25的一部分，磨粒22的一部分突出在孔密封层26的表面上。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2012084588A Connection structure of electrode in electronic parts 审中-公开
标题翻译：电子部件电极连接结构
公开(公告)号：JP2012084588A
公开(公告)日：2012-04-26
申请号：JP2010227517
申请日：2010-10-07
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KAMIYA KAZUNOBU , TAKEUCHI MASAMI , HIGASHIMOTO SHIGEKAZU , SATO HARUMITSU , ISHIZAKI TAKUYA , MASUTANI MUNEHIKO
IPC分类号： H01L23/48 , B23K1/00 , B23K1/14 , B23K101/40 , H01L21/60
CPC分类号： H01L24/33 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a connection structure of an electrode in an electronic part in which it is unnecessary to keep a gap between an upper electrode and a member to be joined in a space where capillarity occurs, and which can enhance joint strength of the member to be joined and the upper electrode.SOLUTION: In the connection structure of electrode in the electronic part comprising a planar base member 11; a semiconductor device 12 as a member to be joined having a first electrode 13 and a second electrode 14; and an upper electrode 15 as a planar electrode oppositely arranged with a gap from the semiconductor device 12, the upper electrode 15 comprises a horizontal part 15A horizontally extending; and an inclined part 15B extending in an inclined manner with respect to the horizontal part 15A, and is arranged so that the horizontal part 15A and the inclined part 15B are opposed to the second electrode 14 of the semiconductor device 12 and a gap distance d between the inclined part 15B and the second electrode 14 becomes smaller as it is separated from the horizontal part 15A, and a solder is supplied to the gap between the upper electrode 15 and the second electrode 14 through a through hole 15c of the horizontal part 15A to perform solder joint.
摘要翻译：要解决的问题：提供电子部件中的电极的连接结构，其中不需要在毛细管发生的空间中在上电极和要接合的部件之间保持间隙，并且可以增强要连接的构件和上电极的接合强度。解决方案：在包括平面基底构件11的电子部件中的电极的连接结构中; 作为要连接的部件的半导体器件12具有第一电极13和第二电极14; 和作为与半导体器件12间隔相对地布置的平面电极的上电极15，上电极15包括水平延伸的水平部分15A; 以及相对于水平部15A以倾斜方式延伸的倾斜部15B，并且被布置成使得水平部15A和倾斜部15B与半导体器件12的第二电极14相对，并且间隔距离d在倾斜部分15B和第二电极14随着与水平部分15A分离而变小，并且通过水平部分15A的通孔15c将焊料供应到上电极15和第二电极14之间的间隙，执行焊点。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011254006A Connecting structure of power element 审中-公开
标题翻译：电力元件连接结构
公开(公告)号：JP2011254006A
公开(公告)日：2011-12-15
申请号：JP2010128020
申请日：2010-06-03
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： SATO HARUMITSU , ISHIZAKI TAKUYA , MASUTANI MUNEHIKO , KAMIYA KAZUNOBU
IPC分类号： H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32245 , H01L2224/33181 , H01L2224/37 , H01L2224/37011 , H01L2224/37013 , H01L2224/37155 , H01L2224/37599 , H01L2224/376 , H01L2224/40 , H01L2224/4007 , H01L2224/40137 , H01L2224/84801 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a connecting structure of a power element enabling visual checking of the supply amount of solder.SOLUTION: A strip-shaped upper electrode 24 is connected on upper surfaces of power elements 21, 22 through solder. The upper electrode 24 has a pair of clefts 26a, 27a, 26b, 27b separating in a width direction and extending in a length direction, and arc-shaped projecting portions 29a, 30a, 29b, 30b projecting from a body portion 25 in a direction approaching the upper surfaces of the power elements 21, 22, at an outside part of the pair of the clefts. The solder 31 is wet and spread on the upper surfaces of the power elements 21, 22 and both upper and lower surfaces (34, 35) of the projecting portions 29a, 30a, 29b, 30b of the upper electrode 24.
摘要翻译：要解决的问题：提供能够目视检查焊料供给量的功率元件的连接结构。解决方案：条形上电极24通过焊料连接在功率元件21,22的上表面上。上部电极24具有沿宽度方向分隔并沿长度方向延伸的一对间隙26a，27a，26b，27b，以及从主体部25沿方向突出的圆弧状的突出部29a，30a，29b，30b，在所述一对裂缝的外侧部分处接近功率元件21,22的上表面。焊料31湿润并扩散在功率元件21,22的上表面以及上电极24的突出部29a，30a，29b，30b的上表面和下表面（34,35）上。（C）2012，JPO＆INPIT

4. 发明专利

JP2014093413A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2014093413A
公开(公告)日：2014-05-19
申请号：JP2012242924
申请日：2012-11-02
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： TAKEUCHI KAZUYOSHI , MASUTANI MUNEHIKO , HIGASHIMOTO SHIGEKAZU , KAMIYA KAZUNOBU
IPC分类号： H01L21/60
CPC分类号： H01L24/73 , H01L2224/48091 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat transfer performance between a semiconductor element and an electrode.SOLUTION: A semiconductor device comprises a circuit board on which a semiconductor element 21 is bonded. In the circuit board, a first metal plate 13, a second metal plate and a third metal plate are arranged on a top face of the insulating substrate. An undersurface 22a of an emitter electrode 22 of the semiconductor element 21 and a top face 13a of the first metal plate 13 are bonded with a conductive adhesive. A plurality of salients 41 are formed on the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. The salients 41 are particles having good thermal conductivity which adhere to the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. A conductive filler 51 is brought in contact with outer peripheral edges of a plurality of salients 41 (adjacent salients 41) without entering between the adjacent salients 41.
摘要翻译：要解决的问题：提高半导体元件和电极之间的传热性能。解决方案：半导体器件包括其上结合有半导体元件21的电路板。在电路板中，第一金属板13，第二金属板和第三金属板布置在绝缘基板的顶面上。半导体元件21的发射电极22的下表面22a和第一金属板13的顶面13a用导电粘合剂粘接。在发射电极22的下表面22a和第一金属板13的顶面13a上形成有多个凸起41.这些凸部41是具有良好导热性的颗粒，其粘附到发射极22的下表面22a和第一金属板13的顶面13a。导电填料51与多个凸部41（相邻的凸部41）的外周边缘接触而不进入相邻凸起部41之间。

5. 发明专利

JP2012021942A Radiation inspection device of joint, radiation inspection method of joint, and production device of electronic component 审中-公开
标题翻译：接头辐射检查装置，接头辐射检测方法及电子元器件生产设备
公开(公告)号：JP2012021942A
公开(公告)日：2012-02-02
申请号：JP2010161793
申请日：2010-07-16
申请人： Comscantecno Co Ltd , Toyota Industries Corp , コムスキャンテクノ株式会社 , 株式会社豊田自動織機
发明人： HATTORI TOMOKAZU , KAMIYA KAZUNOBU , KIKUCHI KAZUO
IPC分类号： G01N23/04
摘要： PROBLEM TO BE SOLVED: To provide a radiation inspection device for joints, capable of automatically extracting an optimal image for an inspection of a joint part from a plurality of slice images with an electronic component formed with a multi-layered joint part of joining materials, as an inspection object; to provide a radiation inspection method of joints and a production device of electronic components.SOLUTION: A personal computer (PC), or an X-ray inspection device 30 for a solder joint part, irradiates the solder joint with X-rays while displacing a power module Mp to capture a plurality of X-ray images of the solder joint part by an optical receiver 32; generates three-dimensional reconstruction data from the plurality of X-ray images; and extracts respective layers of slice images along the joining surface of the power module Mp from the generated three-dimensional reconstruction data. The personal computer (PC) calculates an average value of a luminance histogram on each layer of the slice images, and extracts a slice image having a calculated maximum average value of the luminance histogram as an optimal image for the inspection of the state of the solder joint part.
摘要翻译：要解决的问题：提供一种用于接头的辐射检查装置，其能够自动地从多个切片图像中提取用于检查接合部分的最佳图像，其中电子部件形成有多层接合部分加工材料，作为检验对象; 提供接头的辐射检查方法和电子部件的生产装置。解决方案：用于焊接部分的个人计算机（PC）或X射线检查装置30在移动功率模块Mp的同时照射具有X射线的焊点，以捕获多个X射线图像焊接部分由光接收器32提供; 从所述多个X射线图像生成三维重建数据; 并且从所生成的三维重构数据中提取沿功率模块Mp的接合表面的切片图像的各层。个人计算机（PC）计算切片图像的每一层上的亮度直方图的平均值，并提取具有计算的亮度直方图的最大平均值的切片图像作为用于检查焊料状态的最佳图像联合部分。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2014029955A Sealing part molding jig, semiconductor device, and method for manufacturing semiconductor device 审中-公开
标题翻译：密封件成型夹具，半导体器件及制造半导体器件的方法
公开(公告)号：JP2014029955A
公开(公告)日：2014-02-13
申请号：JP2012170323
申请日：2012-07-31
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KAMIYA KAZUNOBU , TAKEUCHI KAZUYOSHI , HIGASHIMOTO SHIGEKAZU , MASUTANI MUNEHIKO
IPC分类号： H01L21/56
CPC分类号： H01L2224/33 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a sealing part molding jig capable of preventing a fillet projecting upward from being formed on a sealing part, a semiconductor device, and a method for manufacturing a semiconductor device.SOLUTION: A sealing part molding jig 40 molds a sealing part 30 which surrounds a laminate 44 including a semiconductor element 20 and seals an upper end face 14a of an upper electrode 14 in the laminate 44 while exposing the upper end face 14a from a top face 30a. The sealing part molding jig 40 has a jig body 41 surrounding the laminate 44, the jig body 41 has an inside face 41a which is brought into contact with an outside face 30b of the sealing part 30 to mold the outside face 30b, and a height H2 at a top edge of the inside face 41a in the jig body 41 is set lower than a height H1 of the upper end face 14a of the upper electrode 14.
摘要翻译：要解决的问题：提供一种能够防止在密封部上形成向上突出的圆角的密封部成型夹具，半导体装置以及半导体装置的制造方法。封装部成形模具40将模具密封部件30围绕包括半导体元件20的层压体44并且密封层压体44中的上电极14的上端面14a，同时使顶端面14a从顶面30a露出。密封部成型夹具40具有围绕层叠体44的夹具主体41，夹具主体41具有与密封部30的外侧面30b接触以形成外侧面30b的内侧面41a，夹具本体41的内侧面41a的顶端部的H2被设定为低于上部电极14的上端面14a的高度H1。

7. 发明专利

JP2013183103A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013183103A
公开(公告)日：2013-09-12
申请号：JP2012047219
申请日：2012-03-02
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO , HIGASHIMOTO SHIGEKAZU , TAKEUCHI KAZUYOSHI , KAMIYA KAZUNOBU
IPC分类号： H01L23/36
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which enables a heat sink to be securely bonded with a small amount of resin.SOLUTION: A semiconductor element 20 is joined to one surface of a first metal plate 30, and the other surface of the first metal plate 30 is joined to one surface of an insulation plate 40. The other surface of the insulation plate 40 is joined to one surface of the second metal plate 50. The other surface of the second metal plate 50 is joined to one surface of a stress relaxation member 60, and the other surface of the stress relaxation member 60 is joined to one surface of a heat sink 70. A sealing resin 80 is disposed on a joining surface of the stress relaxation member 60 in the heat sink 70 and seals the semiconductor element 20, the first metal plate 30, the insulation plate 40, the second metal plate 50, and the stress relaxation member 60. The stress relaxation member 60 is larger than the second metal plate 50, and the sealing resin 80 fills a stress relaxation space 61 of the stress relaxation member 60.
摘要翻译：要解决的问题：提供一种使散热器能够用少量树脂牢固地结合的半导体器件。解决方案：半导体元件20接合到第一金属板30的一个表面，并且第二金属板的另一个表面第一金属板30连接到绝缘板40的一个表面。绝缘板40的另一个表面连接到第二金属板50的一个表面。第二金属板50的另一个表面与应力缓和构件60，应力缓和构件60的另一个表面接合到散热器70的一个表面。密封树脂80设置在散热器70中的应力松弛构件60的接合表面上，并且密封半导体元件20，第一金属板30，绝缘板40，第二金属板50和应力松弛部件60.应力松弛部件60大于第二金属板50，密封树脂80填充应力松弛部件60的应力松弛空间61。

8. 发明专利

JP2013183102A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013183102A
公开(公告)日：2013-09-12
申请号：JP2012047218
申请日：2012-03-02
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO , TAKEUCHI KAZUYOSHI , HIGASHIMOTO SHIGEKAZU , KAMIYA KAZUNOBU
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing stress to a semiconductor element.SOLUTION: A semiconductor device element 20 is bonded on a lower electrode 30 through a bonding material 50, and on the semiconductor element 20, an upper electrode 40 is bonded through a bonding material 60. A bonding area between the semiconductor element 20 and the upper electrode 40 is smaller than a bonding area between the semiconductor element 20 and the lower electrode 30. Further, the linear expansion coefficient of the upper electrode 40 is larger than the linear expansion coefficient of the lower electrode 30. The upper electrode 40 has a linear expansion coefficient to cancel a warp vertically produced on the semiconductor element 20 by stress generated by a difference of the linear expansion coefficients between the semiconductor element 20 and the upper electrode 40 and a difference of the linear expansion coefficients between the semiconductor element 20 and the lower electrode 30.
摘要翻译：要解决的问题：提供能够抑制对半导体元件的应力的半导体器件。解决方案：半导体器件元件20通过接合材料50接合在下电极30上，并且在半导体元件20上，上电极40 通过接合材料60接合。半导体元件20和上电极40之间的接合面积小于半导体元件20和下电极30之间的接合面积。此外，上电极40的线膨胀系数为大于下电极30的线膨胀系数。上电极40具有线性膨胀系数，以消除由半导体元件20和第二半导体元件20之间的线性膨胀系数的差异产生的应力来消除在半导体元件20上垂直产生的翘曲上电极40和半导体元件20与t之间的线膨胀系数的差他下电极30。

9. 发明专利

JP2013175683A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013175683A
公开(公告)日：2013-09-05
申请号：JP2012040662
申请日：2012-02-27
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KAMIYA KAZUNOBU , HIGASHIMOTO SHIGEKAZU , TAKEUCHI KAZUYOSHI , MASUTANI MUNEHIKO
IPC分类号： H01L23/28 , H01L23/12 , H01L23/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that allows preventing warpage.SOLUTION: A semiconductor element 30 is bonded to a metal substrate 40, and a shield plate 50 is disposed so as to face the semiconductor element 30. A molding resin 60 bonds the semiconductor element 30 to the metal substrate 40 and integrally molds the semiconductor element 30, the metal substrate 40, and the shield plate 50 with the semiconductor element 30 faced to the shield plate 50. The expansion characteristics of the metal substrate 40 and the expansion characteristics of the shield plate 50 are matched so that the warpage of the metal substrate 40 and the warpage of the shield plate 50 are canceled.
摘要翻译：要解决的问题：提供一种允许防止翘曲的半导体器件。解决方案：将半导体元件30接合到金属基板40，并且屏蔽板50设置成面对半导体元件30.模制树脂60结合半导体元件30连接到金属基板40，并且半导体元件30，金属基板40和屏蔽板50一体地模制，半导体元件30面向屏蔽板50.金属基板40的膨胀特性和膨胀遮蔽板50的特性匹配，从而消除金属基板40的翘曲和屏蔽板50的翘曲。

10. 发明专利

JP2014207284A 半導体装置の電極構造审中-公开
标题翻译：半导体器件的电极结构
公开(公告)号：JP2014207284A
公开(公告)日：2014-10-30
申请号：JP2013083107
申请日：2013-04-11
申请人：株式会社豊田自動織機 , Toyota Industries Corp
发明人： KAMIYA KAZUNOBU , HIGASHIMOTO SHIGEKAZU , TAKEUCHI KAZUYOSHI , MASUTANI MUNEHIKO
IPC分类号： H01L23/48
摘要：【課題】半導体素子側の導電部と外部へ出力する外部出力用電極部材とを繋ぐための接合を行う際の治具を不要にできる半導体装置の電極構造を提供する。【解決手段】電極板10を備え、電極板10は、電極部10a(第1直線部11,第2直線部12,第3直線部13)と押さえ部10b(第4直線部14,第5直線部15)を有する。電極部10aは、外部出力用電極板30と重ね合わせて接合される第1直線部11と、半導体素子側の導電部20と接合される第3直線部13を備え、押さえ部10bは、第3直線部13から第1直線部11の反外部出力用電極板30側に延びている。【選択図】図1
摘要翻译：要解决的问题：为了提供一种半导体器件的电极结构，当实现用于连接半导体元件侧的导电部分的接合部和用于输出到外部的外部输出的电极部件时，能够消除夹具的需要电极结构包括电极板10.电极板10包括电极部分10a（第一直线部分11，第二直线部分12和第三直线部分13）和按压部分10b（第四直线部分 14和第五直线部分15）。电极部分10a包括与外部输出用电极板30重叠的第一直线部分11和与半导体元件侧的导体部分20接合的第三直线部分13。按压部10b从第三直线部13延伸到靠近用于防外部输出的电极板30的第一直线部11。

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