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    • 1. 发明专利
    • Led light-emitting device
    • LED发光装置
    • JP2009245981A
    • 2009-10-22
    • JP2008087591
    • 2008-03-28
    • Toyoda Gosei Co LtdToyota Central R&D Labs Inc株式会社豊田中央研究所豊田合成株式会社
    • ITO KENJITOMITA KAZUYOSHIKACHI TORUOZAWA TAKAHIROKATO SATORUICHIKAWA TADASHIINOUE MITSUHIRO
    • F21V9/40H01L33/32H01L33/48H01L33/50H01L33/56H01L33/62
    • H01L33/504H01L2224/48091H01L2924/00014
    • PROBLEM TO BE SOLVED: To further improve efficiency of an LED light-emitting device emitting white light. SOLUTION: The LED light-emitting device shown in Fig. 1 includes an LED 10, a red light-emitting R phosphor layer 11, a yellow light-emitting Y phosphor layer 12, and a blue light-emitting B phosphor layer 13. The phosphor layers are stacked in the sequence of the Y phosphor layer 12, the B phosphor layer 13, and the R phosphor layer 11 from the side close to the LED 10. The stacking sequence of the Y phosphor layer 12 and the B phosphor layer 13 is first determined to prevent these layers from interacting with each other, and the stacking sequence of the R phosphor layer 11 and the Y phosphor layer 12 and the stacking sequence of the R phosphor layer 11 and the B phosphor layer 13 are determined by a determination expression D. By determining the stacking sequence like that, degradation of the conversion efficiency of the phosphors due to concentration quenching can be considered, the emission efficiency of the LED light-emitting device is improved. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:进一步提高发射白光的LED发光装置的效率。 解决方案:图1所示的LED发光装置。 1包括LED 10,红色发光R荧光体层11,黄色发光Y荧光体层12和蓝色发光B荧光体层13.荧光体层按照Y荧光体层 12,B荧光体层13和R荧光体层11。接着,确定Y荧光体层12和B荧光体层13的层叠顺序,以防止这些层彼此相互影响 并且通过确定表达式D确定R荧光体层11和Y荧光体层12的堆叠顺序以及R荧光体层11和B荧光体层13的堆叠顺序。通过确定这样的堆叠顺序,降解 可以考虑由于浓度淬灭引起的荧光体的转换效率,提高了LED发光装置的发光效率。 版权所有(C)2010,JPO&INPIT
    • 2. 发明专利
    • Led light-emitting device
    • LED发光装置
    • JP2010087267A
    • 2010-04-15
    • JP2008255115
    • 2008-09-30
    • Toyoda Gosei Co LtdToyota Central R&D Labs Inc株式会社豊田中央研究所豊田合成株式会社
    • KAMIMURA TOSHIYAINOUE MITSUHIRONAMIKI AKIOOZAWA TAKAHIROICHIKAWA TADASHIITO KENJI
    • H01L33/48H01L33/32
    • H01L33/58
    • PROBLEM TO BE SOLVED: To provide an LED light-emitting device capable of easily controlling the outer appearance color of a phosphor layer when light is turned off. SOLUTION: The phosphor layer 13 of the LED light-emitting device 1 has a structure in which a yellow phosphor layer 13a, a red phosphor layer 13b and a blue phosphor layer 13c are sequentially laminated from the side near an LED 10. The thickness and the phosphor concentration of the blue phosphor layer 13c are each set at a value at which when the yellow phosphor layer 13a and the red phosphor layer 13b are excited by an outside light and emit a yellow light and a red light, respectively, the yellow light and the red light do not pass through the blue phosphor layer 43b. As the result, the outer appearance color of the phosphor layer 13 when the LED light-emitting device 1 is lighted off is white as the outer appearance color of the blue phosphor layer 13c. Since the LED light-emitting device 1 emits a white color light and this color matches the outer appearance color of the phosphor layer 13 when light is turned off, the outer appearance quality is high. COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供一种当光关闭时能够容易地控制荧光体层的外观颜色的LED发光装置。 解决方案:LED发光装置1的荧光体层13具有从靠近LED10的一侧依次层叠黄色荧光体层13a,红色荧光体层13b和蓝色荧光体层13c的结构。 蓝色荧光体层13c的厚度和荧光体浓度各自设定为当黄色荧光体层13a和红色荧光体层13b被外部光激发并分别发出黄色光和红色光的值时, 黄色光和红色光不穿过蓝色荧光体层43b。 结果,LED发光装置1点亮时的荧光体层13的外观颜色为蓝色荧光体层13c的外观颜色为白色。 由于LED发光器件1发出白色光,并且当光关闭时该颜色匹配荧光体层13的外观颜色,因此外观质量高。 版权所有(C)2010,JPO&INPIT
    • 8. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2013106018A
    • 2013-05-30
    • JP2011251261
    • 2011-11-17
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • KATSUNO TAKASHIKIGAMI MASAHITOICHIKAWA TADASHIISHII EIKO
    • H01L21/338H01L21/336H01L21/337H01L29/41H01L29/778H01L29/78H01L29/808H01L29/812
    • PROBLEM TO BE SOLVED: To provide a semiconductor device which operates in a normally-off fashion and which has high withstanding voltage and low on-resistance.SOLUTION: A semiconductor device 1 comprises: a drain electrode 21 capable of being electrically connected to a two-dimensional electron gas layer formed on a first hetero-junction surface; a source electrode 29 capable of being electrically insulated from the two-dimensional electron gas layer formed on the first hetero-junction surface 32 and capable of being electrically connected to a two-dimensional electron gas layer formed on a second hetero-junction surface 34; a gate part 28 facing the second hetero-junction surface 34; and a conductive electrode 25 capable of being electrically connected to both of the two-dimensional electron gas layers formed on the first hetero-junction layer 32 and the second hetero-junction surface 34. An electron concentration of the two-dimensional electron gas layer formed on the first hetero-junction surface 32 is higher than an electron concentration of the two-dimensional electron gas layer formed on the second hetero-junction surface 34.
    • 要解决的问题:提供一种以常闭方式操作并具有高耐压和低导通电阻的半导体器件。 解决方案:半导体器件1包括:能够与形成在第一异质结表面上的二维电子气层电连接的漏电极21; 源极电极29,其能够与形成在第一异质结表面32上的二维电子气层电绝缘并能够电连接到形成在第二异质结表面34上的二维电子气层; 面对第二异质结表面34的栅极部分28; 以及能够与形成在第一异质结层32和第二异质结表面34上的二维电子气层电连接的导电电极25.形成二维电子气层的电子浓度 在第一异质结表面32上的电子浓度高于形成在第二异质结表面34上的二维电子气层的电子浓度。(C)2013,JPO&INPIT
    • 9. 发明专利
    • Ohmic electrode and formation method thereof
    • OHMIC电极及其形成方法
    • JP2013045841A
    • 2013-03-04
    • JP2011181658
    • 2011-08-23
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • KATSUNO TAKASHIKIGAMI MASAHITOICHIKAWA TADASHIISHII EIKO
    • H01L21/28H01L21/338H01L29/778H01L29/812
    • PROBLEM TO BE SOLVED: To provide a formation method of an ohmic electrode capable of removing a resist film used to form a contact hole using an etching liquid containing sulfuric acid.SOLUTION: A formation method of an ohmic electrode comprises: a laminated electrode part formation step of forming a laminated electrode part 2; an annealing step of heat-treating the laminated electrode part 2; a covering electrode part formation step of forming a covering electrode part 4 by covering the heat-treated laminated electrode part 2 with a covering part 3; an insulator film formation step of forming an insulator film 5 on a surface of a semiconductor layer 1 so as to cover the covering electrode part 4; a resist film formation step of patterning a resist film 6 in which an opening 7 is formed corresponding to the covering electrode part 4 on a surface of the insulator film 5; an exposure step of exposing the covering electrode part 4 by removing the insulator film 5 exposed from the opening 7 of the resist film 6; and a resist film removal step of removing the resist film 6 using an etching liquid containing sulfuric acid. A material of the covering part 3 is gold or platinum.
    • 要解决的问题:提供一种能够使用含有硫酸的蚀刻液除去用于形成接触孔的抗蚀剂膜的欧姆电极的形成方法。 解决方案:欧姆电极的形成方法包括:形成叠层电极部分2的叠层电极部分形成步骤; 对叠层电极部2进行热处理的退火工序; 覆盖电极部形成步骤,通过用覆盖部3覆盖热处理层叠电极部2来形成覆盖电极部4; 绝缘膜形成步骤,在半导体层1的表面上形成绝缘膜5以覆盖覆盖电极部分4; 在绝缘膜5的表面上形成对应于覆盖电极部分4形成有开口7的抗蚀剂膜6的抗蚀剂膜形成步骤; 通过去除从抗蚀剂膜6的开口7露出的绝缘膜5来曝光覆盖电极部分4的曝光步骤; 以及使用含有硫酸的蚀刻液除去抗蚀剂膜6的抗蚀剂膜去除步骤。 覆盖部分3的材料是金或铂。 版权所有(C)2013,JPO&INPIT
    • 10. 发明专利
    • Protection element, semiconductor device, and method of manufacturing semiconductor device
    • 保护元件,半导体器件及制造半导体器件的方法
    • JP2013098275A
    • 2013-05-20
    • JP2011238330
    • 2011-10-31
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • KATSUNO TAKASHIKIGAMI MASAHITOICHIKAWA TADASHIISHII EIKO
    • H01L21/8232H01L21/28H01L21/336H01L21/337H01L21/338H01L21/822H01L27/04H01L27/06H01L29/41H01L29/778H01L29/78H01L29/786H01L29/808H01L29/812H01L29/86
    • PROBLEM TO BE SOLVED: To provide a novel protection element using a hetero junction.SOLUTION: A protection portion 36 of a semiconductor device 10 includes a wiring lower layer 11B and a wiring upper layer 13 having a different band-gap from the wiring lower layer 11B. The wiring upper layer 13 includes a first part 41, a middle part 43, and a second part 45. A two-dimensional-electron-gas layer formed at the bonding surface between the wiring upper layer 13 and the wiring lower layer 11B is isolated between the first part 41 and the middle part 43, and between the second part 45 and the middle part 43. A two-dimensional electron gas formed at the bonding surface between the first part 41 and the wiring lower layer 11B is electrically connected to a drain electrode 21. A two-dimensional electron gas formed at the bonding surface between the second part 45 and the wiring lower layer 11B is electrically connected to a source electrode 28. A two-dimensional electron gas formed at the bonding surface between the middle part 43 and the wiring lower layer 11B is electrically connected to a gate electrode 25.
    • 要解决的问题:提供使用异质结的新型保护元件。 解决方案:半导体器件10的保护部分36包括布线下层11B和与布线下层11B具有不同带隙的布线上层13。 布线上层13包括第一部分41,中间部分43和第二部分45.形成在布线上层13和布线下层11B之间的接合表面处的二维电子 - 气体层被隔离 在第一部分41和中间部分43之间以及第二部分45和中间部分43之间。形成在第一部分41和布线下层11B之间的接合表面处的二维电子气电连接到 漏电极21.形成在第二部分45与布线下层11B之间的接合表面处的二维电子气电连接到源电极28.二维电子气形成在中间部分 43和布线下层11B电连接到栅电极25.版权所有(C)2013,JPO&INPIT