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1. 发明专利

JP2014005032A Packaging container with ic tag 有权
标题翻译：包装容器与IC标签
公开(公告)号：JP2014005032A
公开(公告)日：2014-01-16
申请号：JP2012142193
申请日：2012-06-25
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社 , Nippon Closures Co Ltd , 日本クロージャー株式会社
发明人： ARAI TOSHIYUKI , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI
IPC分类号： B65D51/24 , G06K19/00 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a packaging container with an IC tag capable of displaying the fact that a container mouth is opened and also capable of reading information input to an IC chip o the IC tag even after the container is opened.SOLUTION: The present invention provides a packaging container including an inner cap 30 attached to a container mouth 20, an over cap 40 arranged over the inner cap 30, and an IC tag 10, where an engagement means is arranged between an inner surface of a skirt 42 of the over cap 40 and an outer surface of a tubular wall 32 of the inner cap 30; the IC tag 10 is made from a resin film 1 having an IC chip 3, an antenna 5, and an unsealing detection circuit 9; and the IC tag 10 is attached to the inner cap 30 or the over cap 40 so that the unsealing detection circuit 9 breaks by the relative movement of the over cap 40 and the inner cap 30 that occurs in the course of opening the inner cap 30.
摘要翻译：要解决的问题：为了提供具有能够显示容器口打开的事实的IC标签的包装容器，并且即使在容器打开之后也能够读取输入到IC标签中的IC芯片的信息。解决方案：本发明提供了一种包装容器，其包括安装在容器口20上的内盖30，设置在内盖30上的上盖40和IC标签10，其中接合装置设置在裙边42的内表面之间上盖40和内盖30的管状壁32的外表面; IC标签10由具有IC芯片3的树脂膜1，天线5和开封检测电路9制成; 并且IC标签10附接到内盖30或上盖40，使得开封检测电路9通过在打开内盖30的过程中发生的上盖40和内盖30的相对运动而断裂。

2. 发明专利

JP2014006810A Radio frequency (rf) tag 有权
标题翻译：无线电频率（RF）标签
公开(公告)号：JP2014006810A
公开(公告)日：2014-01-16
申请号：JP2012143328
申请日：2012-06-26
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KIKUCHI TAKAYUKI , SHIMIZU HIRONAGA
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/38 , H01Q9/16
摘要： PROBLEM TO BE SOLVED: To obtain a RF tag that has a metal-adaptive structure including an enclosure for protecting an inlay, is broadly adaptable even when a communication frequency of the RF tag or a usage environment varies, and is less expensive and excellent in general versatility and expandability.SOLUTION: The RF tag is configured to include: an inlay 10 that includes an IC chip 11 and an antenna 12; a planar auxiliary antenna 20 that is laminated in a state insulated from the inlay 10; a permittivity adjustment plate 30 that serves as a base on which the inlay 10 having the auxiliary antenna 20 laminated is mounted and functions as a permittivity adjustment layer with respect to a mounted inlay 10; and an enclosure 50 (51 and 52) that houses the permittivity adjustment plate 30 in a state where the inlay 10 with the auxiliary antenna 20 laminated is mounted inside the enclosure. The permittivity adjustment plate 30 is configured to be fit in the enclosure 50 detachably and in a non-movable manner and to be formed into a shape so as to have predetermined permittivity that adjusts a communication characteristic of the inlay 10 with the auxiliary antenna 20 laminated.
摘要翻译：要解决的问题：为了获得具有金属自适应结构的RF标签，其包括用于保护嵌体的外壳，即使在RF标签或使用环境的通信频率变化时也是广泛适用的，并且价格便宜且优异通用性和可扩展性。解决方案：RF标签被配置为包括：包括IC芯片11和天线12的嵌体10; 在与嵌体10绝缘的状态下层叠的平面辅助天线20; 用作层叠有辅助天线20的嵌体10的基底的介电常数调节板30，并且用作相对于安装的嵌体10的介电常数调节层; 以及在具有层叠有辅助天线20的嵌体10安装在外壳内的状态下容纳介电常数调整板30的外壳50（51和52）。介电常数调整板30被配置为以可移动的方式装配在外壳50中并且被形成为具有预定介电常数的形状，以便调整辅助天线20层叠的嵌体10的通信特性。

3. 发明专利

JP2008192041A Ic tag and manufacturing method for it 有权
标题翻译： IC标签及其制造方法
公开(公告)号：JP2008192041A
公开(公告)日：2008-08-21
申请号：JP2007027809
申请日：2007-02-07
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： TANABE KAZUO , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI , SOTOBAYASHI MASARU , MORI MASAYUKI
IPC分类号： G06K19/077 , B29C45/14 , B29C65/20 , B29C65/48 , B32B15/08 , B32B27/32 , B65D51/24 , G06K19/07
CPC分类号： B29C66/71
摘要： PROBLEM TO BE SOLVED: To provide an IC tag having good adhesion to a plastic molded object and firmly fixable to the surface part of the plastic molded object by insertion molding especially, without causing delamination. SOLUTION: In a resin base board 1, at least one surface is constructed of a thermoadhesive surface 9 formed of thermoadhesive resin, and an IC chip 5 and an antenna 3 formed of a metal thin film are stuck and fixed onto the thermoadhesive surface 9 of the resin base board 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种对塑料成型体具有良好粘附性的IC标签，并且通过特别是通过插入成型牢固地固定到塑料模制对象的表面部分，而不会引起分层。解决方案：在树脂基板1中，至少一个表面由由热粘合树脂形成的热粘合表面9构成，并且将IC芯片5和由金属薄膜形成的天线3粘附并固定到热粘合剂树脂基板1的表面9。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008021084A Lid body with ic tag 有权
标题翻译：带IC标签的身体
公开(公告)号：JP2008021084A
公开(公告)日：2008-01-31
申请号：JP2006191584
申请日：2006-07-12
申请人： Japan Crown Cork Co Ltd , Toyo Seikan Kaisha Ltd , 日本クラウンコルク株式会社 , 東洋製罐株式会社
发明人： HASHIMOTO KATSUMI , ISHII OSAMU , NOZAKI YUKITO , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI
IPC分类号： G06K19/077 , B65D51/24 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a lid body with an IC tag, from which the IC tag in which product information is stored can easily be removed. SOLUTION: This lid body with an IC tag is provided with a top plate 30 and a skirt wall 31 going down from the peripheral section of the top plate, wherein an annular protrusion 53 whose upper end is bent inward is formed on the upper surface of the top plate 30, and the IC tag 55 in which the product information is stored is locke on the upper face of the top plate by the annular protrusion 53. A top plate pushup section X configured of a thin section 57 or a concave section 60 recessed downward is formed so that at least the central part of the top plate can be included in a region surrounded by the annular protrusion 53 of the top late 30, and the top plate pushup section X is pushed up upward so that the IC tag 55 can be removed from the upper face of the top plate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有IC标签的盖体，可以容易地去除存储有产品信息的IC标签。解决方案：具有IC标签的盖体设置有从顶板的周边部分向下的顶板30和裙壁31，其中上端向内弯曲的环形突起53形成在顶板30的上表面和存储产品信息的IC标签55通过环形突起53锁定在顶板的上表面上。顶板上推部分X由薄部分57或形成为向下凹陷的凹部60，使得至少顶板的中心部分可以包围在由顶部末端30的环状突起53包围的区域中，并且顶板上推部分X被向上推，使得 IC标签55可以从顶板的上表面去除。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2014012560A Ic tag equipped resin overcap 有权
标题翻译： IC TAG设备树脂覆盖
公开(公告)号：JP2014012560A
公开(公告)日：2014-01-23
申请号：JP2013182267
申请日：2013-09-03
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KIKUCHI TAKAYUKI , KUROSAWA TAKAHIRO , SOTOBAYASHI MASARU , MORI MASAYUKI , TANABE KAZUO
IPC分类号： B65D51/24 , G06K19/00 , G06K19/07 , G06K19/077
CPC分类号： G06K19/0723 , B65D41/62 , B65D51/245 , B65D2203/10 , B65D2251/0015 , B65D2251/0078 , G06K19/07749 , G06K19/07758 , G06K19/07771
摘要： PROBLEM TO BE SOLVED: To provide an IC tag equipped resin overcap which is covered on a cap installed to a container mouth portion and used for removing the cap installed to the container mouth portion.SOLUTION: A resin overcap 20 which is used by covering a cap 50 is made up of a top plate 21 and a cylindrical side wall 23 inside of which the cap 50 is fitted. A step 25 or vertical ribs 30 for blocking upward movement of the cap 50 fitted inside the cylindrical side wall 23 are formed at an upper portion inside the cylindrical side wall 23, a knurling 27 is formed on a position under the step 25 or the vertical ribs 30, and an IC tag 10 equipped with an IC chip 5 is installed to the top plate 21.
摘要翻译：要解决的问题：提供一种装有IC标签的树脂顶盖，其被覆盖在安装到容器口部上的盖上并用于移除安装到容器口部的盖。解决方案：树脂顶盖20，其被覆盖盖50由顶板21和圆筒形侧壁23组成，盖子50装配在其中。在圆筒形侧壁23内的上部形成有用于阻止安装在圆筒形侧壁23内侧的帽50的向上运动的台阶25或垂直肋30，滚花27形成在台阶25下方的位置或纵向肋30和装有IC芯片5的IC标签10安装在顶板21上。

6. 发明专利

JP2014007655A Rf tag 有权
标题翻译： RF TAG
公开(公告)号：JP2014007655A
公开(公告)日：2014-01-16
申请号：JP2012143329
申请日：2012-06-26
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KIKUCHI TAKAYUKI , AKAMATSU SHINYA
IPC分类号： H01Q1/38 , G06K19/07 , G06K19/077 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To obtain good communication characteristics for each communication frequency by forming a planar antenna corresponding to the communication frequency of an RF tag, and to allow for bulk reading of data even for a plurality of RF tags by avoiding and reducing the influence of moisture and metal effectively.SOLUTION: The RF tag includes an inlay 10 having an IC chip 11 and an antenna 12, a planar auxiliary antenna 20 being laminated on the inlay 10 in the insulated state, and a substrate 50 on which the inlay 10 and auxiliary antenna 20 are laminated. The auxiliary antenna 20 is formed in a rectangular shape having a long side which is substantially equal to 1/4 of the wavelength of radio wave frequency of the inlay 10. It has a notch 21 for dividing one long side into two sides substantially equal to 1/8 of the wavelength of radio wave frequency of the inlay 10. The notch 21 is formed in concave shape opening to the edge of one long side, and has predetermined width and depth for allowing the IC chip 11 of the inlay 10 to be placed therein.
摘要翻译：要解决的问题：为了通过形成与RF标签的通信频率相对应的平面天线来获得每个通信频率的良好的通信特性，并且即使对于多个RF标签也允许批量读取数据，通过避免和减少影响的水分和金属。解决方案：RF标签包括具有IC芯片11和天线12的嵌体10，在绝缘状态下层压在嵌体10上的平面辅助天线20和衬底50，衬底50上嵌有嵌入式和辅助天线20层叠。辅助天线20形成为具有大致等于嵌入式10的无线电波频率的波长的1/4的长边的矩形形状。它具有用于将一个长边分成两侧的切口21，其大致等于镶嵌10的无线电频率波长的1/8。凹口21形成为开口于一个长边的边缘的凹形，并且具有预定的宽度和深度，以使嵌体10的IC芯片11成为放在其中

7. 发明专利

JP2009132446A Method for attaching ic tag to cap 有权
标题翻译：将IC标签连接到CAP的方法
公开(公告)号：JP2009132446A
公开(公告)日：2009-06-18
申请号：JP2008073208
申请日：2008-03-21
申请人： Japan Crown Cork Co Ltd , Toyo Seikan Kaisha Ltd , 日本クラウンコルク株式会社 , 東洋製罐株式会社
发明人： KUROSAWA TAKAHIRO , TANABE KAZUO , KIKUCHI TAKAYUKI , HASHIMOTO KATSUMI
IPC分类号： B65D51/24 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a method for attaching an IC tag to a cap capable of effectively avoiding either a positional displacement or dispersion of the IC tag having product information stored therein and further capable of efficiently attaching the tag to the cap and fixing it there. SOLUTION: There are provided an IC tag web 100 having a plurality of IC units 102 comprised of a combination of IC chips and metallic antennas arranged at one surface of a first thermoplastic resin substrate sheet 101 and fixed there and a second thermoplastic resin substrate sheet 103, wherein the IC tag web 100 is thermally adhered to the surface of the second substrate sheet 103 to form a laminated body A, a tag piece B having the second thermoplastic resin substrate 103 adhered to the IC tag 10 is punched out in sequence and the punched-out tag pieces B are installed in sequence on the upper surface of the cap top plate 21 in concurrent with each of the punching-out operations and temporarily fixed there, then the second thermoplastic resin substrate 103 adhered to the tag piece B is thermally adhered to the upper surface of the top plate 21 of the cap to cause the IC tag 10 to be integrally formed at the top plate 21 through the second thermoplastic resin substrate 103. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种将IC标签附着到盖上的方法，所述盖能够有效地避免具有存储在其中的产品信息的IC标签的位置偏移或分散，并且还能够有效地将标签附接到盖并将其固定在那里。解决方案：提供了一种具有多个集成电路单元102的集成电路标签网100，该多个集成电路单元102由布置在第一热塑性树脂基板101的一个表面上的IC芯片和金属天线的组合构成，并固定在其上，并且第二热塑性树脂基板103，其中IC标签网100热粘合到第二基板103的表面以形成层压体A，将具有粘附到IC标签10上的第二热塑性树脂基板103的标签件B冲压出顺序，并且冲孔标签件B按顺序安装在盖顶板21的上表面上并与每次冲压操作并且暂时固定在其上，然后第二热塑性树脂基板103粘附到标签件 B被热粘附到盖的顶板21的上表面，以使IC标签10通过第二热塑性树脂基板103一体地形成在顶板21上。右：（C）2009，JPO＆INPIT

8. 发明专利

JP2008239237A Plastic cap with ic tag 有权
标题翻译：带IC标签的塑料盖
公开(公告)号：JP2008239237A
公开(公告)日：2008-10-09
申请号：JP2007086664
申请日：2007-03-29
申请人： Japan Crown Cork Co Ltd , Toyo Seikan Kaisha Ltd , 日本クラウンコルク株式会社 , 東洋製罐株式会社
发明人： KUROSAWA TAKAHIRO , TANABE KAZUO , KIKUCHI TAKAYUKI , KIMURA TAKASHI , HASHIMOTO KATSUMI , FUKUSHI SEIJI , ISHII OSAMU
IPC分类号： B65D51/24 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a plastic cap with an IC tag which can input product information into the IC tag and can output product information input certainly by disturbing neither transmission nor reception of information to the IC tag. SOLUTION: In the plastic cap, the IC tag 10 memorizing product information is provided on the upper face of the top plate 21 and a shielding member 50 is provided on the inner side of the top plate 21 and such a space so as not to disturb neither transmission nor reception of signals to the IC tag 10 is secured between an aerial 3 in the IC tag 10 provided on the upper face of the top plate 21 and the level surface of a liquid in a container by the shielding member 50. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有IC标签的塑料盖，其可以将产品信息输入到IC标签中，并且可以通过不对IC标签的传输也不接收信息来肯定地输出产品信息。解决方案：在塑料盖中，IC标签10存储产品信息设置在顶板21的上表面上，屏蔽构件50设置在顶板21的内侧，并且这样的空间如在设置在顶板21的上表面的IC标签10中的天线3与屏蔽部件50的容器内的液面的水平面之间，不会妨碍IC标签10的发送信号和信号的接收，版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2006178638A Metallic material corresponding to ic tag, ic tag corresponding to metal, metallic container corresponding to ic tag, and method for manufacturing the metallic material corresponding to ic tag 审中-公开
标题翻译：与IC标签对应的金属材料，与IC标签对应的金属，金属容器相关的IC标签，以及制造与IC标签相关的金属材料的方法
公开(公告)号：JP2006178638A
公开(公告)日：2006-07-06
申请号：JP2004369559
申请日：2004-12-21
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KIKUCHI TAKAYUKI , SOTOBAYASHI MASARU
IPC分类号： G06K19/077 , B42D15/10 , B65D25/20 , B65D25/34 , G06K19/02 , G06K19/07 , H04B5/02
摘要： PROBLEM TO BE SOLVED: To attain accurate radio communication in a communication range originally suitable to an existing IC tag without requiring any specific constitution or the like only for a metal on the tag side. SOLUTION: A metallic material 10 to which an IC tag 20 for performing radio communication between a reader and a writer is to be attached is provided with: a metallic layer 11 which is a base material; a resin layer 13 laminated on the metallic layer 11 and consisting of a thermoplastic such as a PET resin for separating the IC tag 20 from the metallic layer 11; an electromagnetic wave shielding layer 14 laminated on the resin layer 13 and consisting of an electromagnetic wave shielding coating material containing a metal oxide material for interrupting the passage of a magnetic field of the IC tag up to the metallic layer 11; and a cavity layer 15 laminated on the electromagnetic wave shielding layer 14 and consisting of nonwoven fabric for further separating the IC tag 20 from the metallic layer 11: and constituted so that the IC tag 20 is mounted on the cavity layer 15. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在原来适合于现有IC标签的通信范围内获得准确的无线电通信，而不需要仅在标签侧的金属的任何具体结构等。
解决方案：要安装用于执行读取器和写入器之间的无线电通信的IC标签20的金属材料10设置有：作为基材的金属层11; 层叠在金属层11上的树脂层13，由用于将IC标签20与金属层11分离的热塑性树脂例如PET树脂构成; 层叠在树脂层13上的电磁波屏蔽层14，由包含金属氧化物材料的电磁波屏蔽涂层材料构成，用于阻断IC标签的磁场通过金属层11; 以及层叠在电磁波屏蔽层14上并由非织造布构成的空腔层15，用于将IC标签20与金属层11进一步分离，构成为将IC标签20安装在空腔层15上。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005321935A Ic tag incorporated cap 审中-公开
标题翻译： IC TAG INCORPORATED CAP
公开(公告)号：JP2005321935A
公开(公告)日：2005-11-17
申请号：JP2004138330
申请日：2004-05-07
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KIKUCHI TAKAYUKI , TAKENOUCHI TAKESHI
IPC分类号： B65D51/24 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To conceal an IC tag from the outside, and prevent the tag from being peeled or destroyed, and to set the length of an antenna as the optimal length, by burying the IC tag in a container cap. SOLUTION: This cap mounted on the opening of a container so as to be detachable is provided with a cap main body 10 and the IC tag 20 constituted of a tag main body 21, an antenna 22 and a base material 23, and the IC tag 20 is buried in a top face part 11 of the cap main body 10, and the antenna 22 of the IC tag 20 is configured so as to be spirally buried in the top face part 11 of the cap main body 10. Thus, the IC tag 20 is buried and concealed in the cap, so as to be effectively protected from peeling or destruction or the like. Also, the antenna is spirally formed, so that the length of the antenna can be set as arbitrary length, and that radio communication characteristics can be improved. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过将IC标签埋入容器盖中，从外部隐藏IC标签，防止标签被剥离或破坏，并将天线的长度设定为最佳长度。
解决方案：安装在容器开口上以便可拆卸的该盖设置有盖主体10和由标签主体21，天线22和基材23构成的IC标签20，以及 IC标签20被埋在盖主体10的顶面部11中，IC标签20的天线22被构造成螺旋地埋在盖主体10的顶面部11中。因此 IC标签20被掩埋并隐藏在盖中，以便有效地防止剥离或破坏等。此外，天线螺旋地形成，使得天线的长度可以被设置为任意长度，并且可以提高无线电通信特性。版权所有（C）2006，JPO＆NCIPI

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