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1. 发明专利

JP2014189306A Composite container lid comprising ic tag 有权
标题翻译：复合容器包装IC标签
公开(公告)号：JP2014189306A
公开(公告)日：2014-10-06
申请号：JP2013067084
申请日：2013-03-27
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社 , Nippon Closures Co Ltd , 日本クロージャー株式会社
发明人： ARAI TOSHIYUKI , KUROSAWA TAKAHIRO , SAWARA TORU , SUGI MAMIKO
IPC分类号： B65D51/24 , B65D41/04 , B65D55/02 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a packaging container in which an IC tag is reliably destroyed at the time of opening.SOLUTION: An inner cap 10 comprises a top plate 11 and a cylindrical wall 12 including a screw thread hanging from a peripheral edge of the top plate, in which its inner surface engages with a mouth outer surface of a container by screwing on. On an upper surface of the top plate, an IC tag having an antenna circuit is attached. An over-cap comprises a top wall panel and a skirt hanging from a peripheral edge of the top wall panel. On a lower surface of the top wall panel, a projection with a sharp tip is formed so as to be a cutter for breaking the antenna circuit of the IC tag. The IC tag consists of a resin film including at least an IC chip and a plurality of adjacent antenna lines. The projection with the sharp tip of the over-cap has cutting blades at least at both ends in a direction orthogonal to an arrangement direction of the adjacent antenna lines, and a maximum width between the cutting blades of both ends is longer than a space between the adjacent antenna lines.
摘要翻译：要解决的问题：提供一种在打开时可靠地破坏IC标签的包装容器。解决方案：内盖10包括顶板11和圆柱形壁12，圆柱形壁12包括从外周边缘悬挂的螺纹顶板，其内表面通过螺纹与容器的口外表面接合。在顶板的上表面上安装有具有天线电路的IC标签。顶盖包括顶壁板和从顶壁板的周边边缘悬挂的裙部。在顶壁板的下表面上，形成具有尖锐尖端的突起，以便成为用于断开IC标签的天线电路的切割器。 IC标签由至少包含IC芯片和多个相邻的天线线路的树脂膜构成。具有上盖尖尖的突起至少在与相邻天线线的排列方向正交的方向的两端处具有切割刀片，并且两端的切割刀片之间的最大宽度比第相邻的天线。

2. 发明专利

JP2014114065A Composite cap 有权
标题翻译：复合CAP
公开(公告)号：JP2014114065A
公开(公告)日：2014-06-26
申请号：JP2012271189
申请日：2012-12-12
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： ARAI TOSHIYUKI , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI
IPC分类号： B65D51/24 , B65D51/18 , G06K19/00 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a composite cap which enables an IC chip and a reading device to read data of the IC chip continuously even after opening of a cap.SOLUTION: A composite cap comprises: an inner cap 3 provided to a neck 21 of a container 6; an over-cap 2 which covers the inner cap 3 and has a push plate 9 breakable on a top wall panel 7; an intermediate member 4 provided between the inner cap 3 and the over-cap 2; and an IC tag 5 stuck to the intermediate member 4. The IC tag 5 is formed of a resin film including an IC chip and an antenna for transmitting-receiving information. On a lower surface of the push plate 9, a cutter 11 disposed above the antenna and cutting the antenna when the push plate 9 is broken by pressing, is formed.
摘要翻译：要解决的问题：提供一种能够使IC芯片和读取装置即使在打开盖子之后也可以连续读取IC芯片的数据的复合盖。解决方案：复合盖包括：内盖3，其设置于颈部21 的容器6; 盖2覆盖内盖3并且具有可在顶壁板7上断裂的推板9; 设置在内盖3和上盖2之间的中间构件4; IC标签5粘贴在中间构件4上.IC标签5由包括IC芯片和发送接收信息的天线的树脂膜形成。在推板9的下表面上，形成有设置在天线上方的切割器11，并且当按压板9被按压而断开时切割天线。

3. 发明专利

JP2014005032A Packaging container with ic tag 有权
标题翻译：包装容器与IC标签
公开(公告)号：JP2014005032A
公开(公告)日：2014-01-16
申请号：JP2012142193
申请日：2012-06-25
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社 , Nippon Closures Co Ltd , 日本クロージャー株式会社
发明人： ARAI TOSHIYUKI , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI
IPC分类号： B65D51/24 , G06K19/00 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a packaging container with an IC tag capable of displaying the fact that a container mouth is opened and also capable of reading information input to an IC chip o the IC tag even after the container is opened.SOLUTION: The present invention provides a packaging container including an inner cap 30 attached to a container mouth 20, an over cap 40 arranged over the inner cap 30, and an IC tag 10, where an engagement means is arranged between an inner surface of a skirt 42 of the over cap 40 and an outer surface of a tubular wall 32 of the inner cap 30; the IC tag 10 is made from a resin film 1 having an IC chip 3, an antenna 5, and an unsealing detection circuit 9; and the IC tag 10 is attached to the inner cap 30 or the over cap 40 so that the unsealing detection circuit 9 breaks by the relative movement of the over cap 40 and the inner cap 30 that occurs in the course of opening the inner cap 30.
摘要翻译：要解决的问题：为了提供具有能够显示容器口打开的事实的IC标签的包装容器，并且即使在容器打开之后也能够读取输入到IC标签中的IC芯片的信息。解决方案：本发明提供了一种包装容器，其包括安装在容器口20上的内盖30，设置在内盖30上的上盖40和IC标签10，其中接合装置设置在裙边42的内表面之间上盖40和内盖30的管状壁32的外表面; IC标签10由具有IC芯片3的树脂膜1，天线5和开封检测电路9制成; 并且IC标签10附接到内盖30或上盖40，使得开封检测电路9通过在打开内盖30的过程中发生的上盖40和内盖30的相对运动而断裂。

4. 发明专利

JP2011240272A Treatment device of waste containing biodegradable resin and treatment method of waste containing biodegradable resin 有权
标题翻译：含有生物降解树脂的废物处理装置和含有生物降解树脂的废物处理方法
公开(公告)号：JP2011240272A
公开(公告)日：2011-12-01
申请号：JP2010115428
申请日：2010-05-19
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KUROSAWA TAKAHIRO , KATAYAMA TADAYOSHI , YOSHIKAWA SEISHI , KOGURE MASATO
IPC分类号： B09B3/00 , B29B17/04 , C02F11/04 , C08J11/10 , C08J11/18
CPC分类号： Y02E50/343 , Y02W30/625 , Y02W30/702 , Y02W30/706
摘要： PROBLEM TO BE SOLVED: To provide a treatment device of waste containing a biodegradable resin which can effectively utilize a biodegradable enzyme, and can efficiently treat the waste composed of the biodegradable resin, a non-biodegradable resin and organic waste without sorting the waste in advance, and its treatment method.SOLUTION: The treatment device 1 of the waste comprises: a decomposing tank 4 for decomposing the biodegradable resin 11 included in the waste 10 by using a decomposing liquid 40 containing the biodegradable enzyme; a separator 5 which separates the biodegradable enzyme and a decomposed product; and a fermentation tank 8 which recovers the decomposed product in which the biodegradable enzyme is separated.
摘要翻译：要解决的问题：提供一种含有可生物降解树脂的废物处理装置，其可有效利用可生物降解的酶，并且可以有效地处理由可生物降解树脂，不可生物降解的树脂和有机废物组成的废物，而不分类提前废物及其处理方法。废物处理装置1包括：分解槽4，用于通过使用含有可生物降解酶的分解液40来分解包含在废物10中的生物降解性树脂11; 分离生物降解酶和分解产物的分离器5; 以及回收生物降解酶分离的分解产物的发酵罐8。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2008100441A Molded body by insert molding, and its molding method 有权
标题翻译：通过插件成型模制的模具及其模具方法
公开(公告)号：JP2008100441A
公开(公告)日：2008-05-01
申请号：JP2006285439
申请日：2006-10-19
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： KUROSAWA TAKAHIRO , TANABE KAZUO
IPC分类号： B29C45/14 , B29C33/12 , B29K23/00 , B29K105/20 , B29L31/56 , B65D30/02 , B65D33/38 , B65D51/24
摘要： PROBLEM TO BE SOLVED: To provide a molded body effectively preventing an interfacial release from occurring between a molded article and an insert member without generating an above-described problem in the molded body formed by integrally molding the molded article and the insert member.
SOLUTION: The molded body prepared by integrally welding the molded article made of polypropylene by insert molding with the insert member is characterized in that a resin constituting a face to be welded of the insert member consists of a propylene polymer having the value of P expressed by an equation P (mW/K)=b/a of smaller than 1.75 (mW/K) wherein (a) is a difference between a heat generation starting temperature and a heat generation peak temperature in a heat generating reaction in a DSC measurement (temperature lowering speed is 10°C/min) and b is a base line height from a reference line of a heat generation peak in the DSC measurement (temperature fall speed is 10°C/min), and has the value of the amount of heat generation Q obtained from the area of the heat generation peak of smaller than 66.4 (J/g).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种成型体，有效地防止在模制品和插入件之间发生界面剥离，而不会在通过将模制品和插入件一体地模制而形成的模制体中产生上述问题。解决方案：通过嵌入成型将由聚丙烯制成的模制品与插入构件一体地焊接而制备的成型体的特征在于，构成插入构件的被焊接面的树脂由具有 P表示为P（mW / K）= b / a小于1.75（mW / K），其中（a）是发热反应中的发热开始温度与发热峰值温度之差 DSC测定（降温速度为10℃/分钟），b为从DSC测定中的发热峰值的基准线（温度下降速度为10℃/分钟）的基线高度，从发热峰面积获得的发热量Q小于66.4（J / g）。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007238105A Composite spout, and injection molding device for molding the same 有权
标题翻译：复合喷射器和注射成型装置，用于模制该模具
公开(公告)号：JP2007238105A
公开(公告)日：2007-09-20
申请号：JP2006059277
申请日：2006-03-06
申请人： Japan Crown Cork Co Ltd , Toyo Seikan Kaisha Ltd , 日本クラウンコルク株式会社 , 東洋製罐株式会社
发明人： KUROSAWA TAKAHIRO , TAKEUCHI KIMIO , HASHIMOTO KATSUMI , YONEKAWA YUHEI , ISHII OSAMU , MATSUTANI HITOOMI
IPC分类号： B65D33/38 , B29C45/14 , B29C45/26 , B29L23/00
摘要： PROBLEM TO BE SOLVED: To provide a composite spout which is reliably stuck to adhesive surfaces between a spout body and a sleeve.
SOLUTION: The composite spout 1 is formed in a manner in which a cylindrical sleeve 10 is embedded in an inner peripheral surface of a spout body 2 substantially only with its inner peripheral surface being exposed thereto by injection-molding the spout body 2 while the cylindrical sleeve 10 with a functional resin layer being arranged as an intermediate layer is fitted to a core member of an injection molding die as a core. At one end of the spout body 2 constituting a discharging opening 6 of the composite spout 1, an additional part for covering one end of the inner peripheral surface of the cylindrical sleeve 10 is formed on the spout body 2 at least on a part of the peripheral direction.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可靠地粘附在喷口主体和套筒之间的粘合剂表面上的复合喷嘴。解决方案：复合喷嘴1以这样的方式形成，其中圆柱形套筒10基本上仅通过注射成型喷嘴主体2而使其内周表面暴露在喷嘴主体2的内周表面中而具有作为中间层配置的功能性树脂层的圆筒套筒10以作为核心的注射成型模具的芯材配合。在构成复合喷嘴1的排出口6的喷口主体2的一端，在喷口主体2的至少一部分上形成用于覆盖圆筒套10的内周面的一端的附加部周边方向。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004314336A Hollow multilayered resin molded article and its molding method 有权
公开(公告)号：JP2004314336A
公开(公告)日：2004-11-11
申请号：JP2003108188
申请日：2003-04-11
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： TAKEUCHI KIMIO , KUROSAWA TAKAHIRO , HENMI CHIYO , SAITO TAKESHI
IPC分类号： B32B27/08 , B29C43/18 , B29C43/20
CPC分类号： B29C43/203 , B29C2043/3433 , B29C2043/3631 , B29K2105/258
摘要： PROBLEM TO BE SOLVED: To obtain a hollow multilayered resin molded article, which is constituted so as to prevent the exposure of a resin constituting an intermediate resin layer to the inner surface of the molded article, has excellent sanitation properties, does not cause the disturbance such as non-uniform wall thickness, multiplicity, cutting and the like of the intermediate resin layer, ensures a uniform layered constitution and has excellent functionality, by compression molding.
SOLUTION: A ring or disc-shaped auxiliary resin lump 9 comprising an inner surface coating resin is fused to the upper end part of a cylindrical main resin lump 7 having another resin layer excepting the inner surface coating resin to obtain a main/auxiliary resin lump 10. In such a state that the main/auxiliary resin lump is seated on the bottom surface of a cavity, the auxiliary resin lump is compressed by a core mold 13 so as to flow along the cylindrical inner layer of the cylindrical main resin lump to allow the inner surface coating resin to flow along the inner surface of a main resin layer to coat the inner surface of the main resin layer with an auxiliary resin.
COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2008192041A Ic tag and manufacturing method for it 有权
标题翻译： IC标签及其制造方法
公开(公告)号：JP2008192041A
公开(公告)日：2008-08-21
申请号：JP2007027809
申请日：2007-02-07
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： TANABE KAZUO , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI , SOTOBAYASHI MASARU , MORI MASAYUKI
IPC分类号： G06K19/077 , B29C45/14 , B29C65/20 , B29C65/48 , B32B15/08 , B32B27/32 , B65D51/24 , G06K19/07
CPC分类号： B29C66/71
摘要： PROBLEM TO BE SOLVED: To provide an IC tag having good adhesion to a plastic molded object and firmly fixable to the surface part of the plastic molded object by insertion molding especially, without causing delamination. SOLUTION: In a resin base board 1, at least one surface is constructed of a thermoadhesive surface 9 formed of thermoadhesive resin, and an IC chip 5 and an antenna 3 formed of a metal thin film are stuck and fixed onto the thermoadhesive surface 9 of the resin base board 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种对塑料成型体具有良好粘附性的IC标签，并且通过特别是通过插入成型牢固地固定到塑料模制对象的表面部分，而不会引起分层。解决方案：在树脂基板1中，至少一个表面由由热粘合树脂形成的热粘合表面9构成，并且将IC芯片5和由金属薄膜形成的天线3粘附并固定到热粘合剂树脂基板1的表面9。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008074443A Spout and container with spout equipped with spout 有权
标题翻译：带SPOUT的SPOUT和CONTAINER
公开(公告)号：JP2008074443A
公开(公告)日：2008-04-03
申请号：JP2006255473
申请日：2006-09-21
申请人： Toyo Seikan Kaisha Ltd , 東洋製罐株式会社
发明人： TAKEUCHI KIMIO , KUROSAWA TAKAHIRO
IPC分类号： B65D47/36 , A61J1/05 , A61J1/10 , B65D33/38 , B65D81/24
摘要： PROBLEM TO BE SOLVED: To provide a spout excellent in gas barrier properties preventing oxygen from entering a container and also excellent in productivity, and to provide the container equipped with the spout. SOLUTION: The spout has a cylindrical spout part 2 and a fitting part 3 fitted on an opening part of a container main body. A multi-layered diaphragm 6 whose intermediate layer 5 consisting of a functional resin is integrally provided at a position closing the spout 4 of the spouting part, and gas is blocked to a position reaching the fitting part from the multi-layered diaphragm. As a gas barrier means, the multi-layered diaphragm is provided so as to be positioned in a sealing part 11 between the container main body 10, or a multi-layered cylindrical sleeve in which the functional resin layer is used as the intermediate layer is provided at the spout part on the container main body side more than the multi-layered diaphragm so as to extend to the sealing part between the container main body and the spout part. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种防止氧气进入容器的气体阻隔性优异且生产率优异的喷嘴，以及提供配备有喷口的容器。
解决方案：喷嘴具有圆筒形喷口部分2和装配在容器主体的开口部分上的装配部分3。由功能性树脂构成的中间层5的多层隔膜6一体地设置在关闭喷射部的喷口4的位置，气体被阻挡到从多层隔膜到达嵌合部的位置。作为气体阻隔装置，多层隔膜设置成位于容器主体10或功能性树脂层用作中间层的多层圆柱形套筒之间的密封部分11中设置在容器主体侧的吐出部分上，而不是多层隔膜，以便延伸到容器主体和喷口部分之间的密封部分。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008021084A Lid body with ic tag 有权
标题翻译：带IC标签的身体
公开(公告)号：JP2008021084A
公开(公告)日：2008-01-31
申请号：JP2006191584
申请日：2006-07-12
申请人： Japan Crown Cork Co Ltd , Toyo Seikan Kaisha Ltd , 日本クラウンコルク株式会社 , 東洋製罐株式会社
发明人： HASHIMOTO KATSUMI , ISHII OSAMU , NOZAKI YUKITO , KUROSAWA TAKAHIRO , KIKUCHI TAKAYUKI
IPC分类号： G06K19/077 , B65D51/24 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a lid body with an IC tag, from which the IC tag in which product information is stored can easily be removed. SOLUTION: This lid body with an IC tag is provided with a top plate 30 and a skirt wall 31 going down from the peripheral section of the top plate, wherein an annular protrusion 53 whose upper end is bent inward is formed on the upper surface of the top plate 30, and the IC tag 55 in which the product information is stored is locke on the upper face of the top plate by the annular protrusion 53. A top plate pushup section X configured of a thin section 57 or a concave section 60 recessed downward is formed so that at least the central part of the top plate can be included in a region surrounded by the annular protrusion 53 of the top late 30, and the top plate pushup section X is pushed up upward so that the IC tag 55 can be removed from the upper face of the top plate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有IC标签的盖体，可以容易地去除存储有产品信息的IC标签。解决方案：具有IC标签的盖体设置有从顶板的周边部分向下的顶板30和裙壁31，其中上端向内弯曲的环形突起53形成在顶板30的上表面和存储产品信息的IC标签55通过环形突起53锁定在顶板的上表面上。顶板上推部分X由薄部分57或形成为向下凹陷的凹部60，使得至少顶板的中心部分可以包围在由顶部末端30的环状突起53包围的区域中，并且顶板上推部分X被向上推，使得 IC标签55可以从顶板的上表面去除。版权所有（C）2008，JPO＆INPIT

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