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1. 发明授权

US06874910B2 Light source device using LED, and method of producing same 有权
标题翻译：使用LED的光源装置及其制造方法
公开(公告)号：US06874910B2
公开(公告)日：2005-04-05
申请号：US10398660
申请日：2001-12-03
申请人： Masaru Sugimoto , Eiji Shiohama , Hideyoshi Kimura , Takuma Hashimoto , Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Jiro Hashizume
发明人： Masaru Sugimoto , Eiji Shiohama , Hideyoshi Kimura , Takuma Hashimoto , Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Jiro Hashizume
IPC分类号： H01L25/075 , H01L33/64 , F21V29/00 , H01L33/00
CPC分类号： H01L33/642 , H01L24/45 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/32188 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/20752
摘要： A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.
摘要翻译：一种具有导热性的散热板的光源装置和与散热板的至少一侧连接的绝缘构件，其具有设置在其面向散热板的一侧的通孔。所述光源装置还包括LED芯片，所述LED芯片安装并热耦合到所述辐射板的面向所述通孔的暴露部分，从所述绝缘构件的散热板端部在所述通孔向内突出的延伸部，以及布置在所述绝缘构件通过所述绝缘构件与所述散热板电隔离。光源装置还包括电连接延伸部上的布线图案和LED芯片的电极的接合线，以及填充用于完全封装LED芯片和接合线的通孔的透光密封材料。

2. 发明授权

US06796027B2 Method of manufacturing printed wiring board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US06796027B2
公开(公告)日：2004-09-28
申请号：US10146800
申请日：2002-05-17
申请人： Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Eiji Shiohama , Masaru Sugimoto , Hideyoshi Kimura , Takuma Hashimoto
发明人： Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Eiji Shiohama , Masaru Sugimoto , Hideyoshi Kimura , Takuma Hashimoto
IPC分类号： H05K310
CPC分类号： H05K3/242 , H05K1/0284 , H05K1/0293 , H05K3/045 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09127 , H05K2203/175 , H05K2203/308 , Y10T29/49117 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.
摘要翻译：提供一种有效地制造印刷电路板的方法。在该方法中，在具有突起的基板上形成金属薄膜。然后，通过图案化金属薄膜，在基板上形成初始电路图案。初始电路图案包括彼此隔离的第一和第二电路图案，以及形成在突起上的导电层，以在第一和第二电路图案之间进行临时电连接。通过电流通过初始电路图案进行电镀，以在初始电路图案上形成附加的金属膜。在电镀之后，去除突起上的导电层以在第一和第二电路图案之间提供电绝缘。

3. 发明申请

US20070007540A1 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US20070007540A1
公开(公告)日：2007-01-11
申请号：US10558360
申请日：2004-05-26
申请人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
发明人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15156 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/01005 , H01L2924/01033
摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
摘要翻译：发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光发光二极管芯片（5）。底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

4. 发明授权

US07495322B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US07495322B2
公开(公告)日：2009-02-24
申请号：US10558360
申请日：2004-05-26
申请人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
发明人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
IPC分类号： H01L21/00 , H01L23/495 , F21V29/00 , H05K1/11 , H05K5/02 , H05K7/18
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15156 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/01005 , H01L2924/01033
摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
摘要翻译：发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光发光二极管芯片（5）。底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

5. 发明授权

US06331063B1 LED luminaire with light control means 失效
标题翻译： LED灯具带灯光控制装置
公开(公告)号：US06331063B1
公开(公告)日：2001-12-18
申请号：US09199893
申请日：1998-11-25
申请人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
发明人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
IPC分类号： F21V704
CPC分类号： F21V5/02 , F21Y2105/00 , F21Y2107/00 , F21Y2107/10 , F21Y2107/50 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H05K1/0284 , H05K1/182 , H01L2924/00014 , H01L2924/00
摘要： An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.
摘要翻译：形成LED灯具，使得多个LED芯片以三维方式设置在矩形板状的MID（模制互连装置）基板上，通过在一个表面纵向和横向设置各个凹槽的底面上安装三个LED芯片的MID基板，包括至少两种相互不同的发光颜色的LED芯片，期望为红色，蓝色和绿色三种类型。由此可以根据基板的结构容易地获得任何可选的光分布特性，可以使灯具组件变薄，通过混合各个发光体的发光颜色，能够实现发光灯的白色和日光颜色的微妙色差 LED芯片

6. 发明申请

US20070120272A1 Electronic component and manufacturing method of the electronic component 失效
标题翻译：电子部件的电子部件和制造方法
公开(公告)号：US20070120272A1
公开(公告)日：2007-05-31
申请号：US10574017
申请日：2005-06-16
申请人： Kazuya Nakagawa , Yutaka Abe , Toshiyuki Suzuki
发明人： Kazuya Nakagawa , Yutaka Abe , Toshiyuki Suzuki
IPC分类号： H01L23/28
CPC分类号： H01L23/24 , H01L33/486 , H01L33/52 , H01L2924/0002 , H01L2924/15153 , H01L2924/15165 , H01L2924/00
摘要： In an electronic component in which a semiconductor device such as a light emitting diode is encapsulated by an encapsulation resin and a manufacturing method of the same, formation of flash on occasion of filling a resin is prevented. The semiconductor device (SIC) is mounted in a reception concavity of a base member, and the encapsulation resin is filled into the reception concavity. After mounting the semiconductor device in the reception concavity and before filling the encapsulation resin into the reception concavity, a stopper resin layer is formed on a top face of the base member along a circumference of an aperture of the reception concavity by applying a resin. Since the circumference of the aperture of the reception concavity including electric conductive patterns and the base member is covered by the stopper resin layer, even when the encapsulation resin having low viscosity is filled into the reception concavity, leakage or proceeding due to capillarity of the encapsulation resin is prevented by the stopper resin layer. As a result, no flash of leaked encapsulation resin is formed.
摘要翻译：在其中通过封装树脂封装诸如发光二极管的半导体器件的电子部件及其制造方法中，防止了在填充树脂时形成闪光。半导体器件（SIC）安装在基底的接收凹部中，并且将密封树脂填充到接收凹部中。在将半导体器件安装在接收凹部中并且在将封装树脂填充到接收凹部之前，通过施加树脂沿着接收凹部的孔的圆周在基底构件的顶面上形成止挡树脂层。由于包含导电图案和基底构件的接收凹部的孔径的圆周被塞子树脂层覆盖，所以即使当具有低粘度的密封树脂填充到接收凹部中时，由于封装的毛细管化而导致的漏电或进行通过阻挡树脂层防止树脂。结果，不形成泄漏的封装树脂的闪光。

7. 发明授权

US07348681B2 Electronic component and manufacturing method of the electronic component 失效
标题翻译：电子部件的电子部件和制造方法
公开(公告)号：US07348681B2
公开(公告)日：2008-03-25
申请号：US10574017
申请日：2005-06-16
申请人： Kazuya Nakagawa , Yutaka Abe , Toshiyuki Suzuki
发明人： Kazuya Nakagawa , Yutaka Abe , Toshiyuki Suzuki
IPC分类号： H01L23/28
CPC分类号： H01L23/24 , H01L33/486 , H01L33/52 , H01L2924/0002 , H01L2924/15153 , H01L2924/15165 , H01L2924/00
摘要： In an electronic component in which a semiconductor device such as a light emitting diode is encapsulated by an encapsulation resin and a manufacturing method of the same, formation of flash on occasion of filling a resin is prevented. The semiconductor device (SIC) is mounted in a reception concavity of a base member, and the encapsulation resin is filled into the reception concavity. After mounting the semiconductor device in the reception concavity and before filling the encapsulation resin into the reception concavity, a stopper resin layer is formed on a top face of the base member along a circumference of an aperture of the reception concavity by applying a resin. Since the circumference of the aperture of the reception concavity including electric conductive patterns and the base member is covered by the stopper resin layer, even when the encapsulation resin having low viscosity is filled into the reception concavity, leakage or proceeding due to capillarity of the encapsulation resin is prevented by the stopper resin layer. As a result, no flash of leaked encapsulation resin is formed.
摘要翻译：在其中通过封装树脂封装诸如发光二极管的半导体器件的电子部件及其制造方法中，防止了在填充树脂时形成闪光。半导体器件（SIC）安装在基底的接收凹部中，并且将密封树脂填充到接收凹部中。在将半导体器件安装在接收凹部中并且在将封装树脂填充到接收凹部之前，通过施加树脂沿着接收凹部的孔的圆周在基底构件的顶面上形成止挡树脂层。由于包含导电图案和基底构件的接收凹部的孔径的圆周被塞子树脂层覆盖，所以即使当具有低粘度的密封树脂填充到接收凹部中时，由于封装的毛细管化而导致的漏电或进行通过阻挡树脂层防止树脂。结果，不形成泄漏的封装树脂的闪光。

8. 发明授权

US08802334B2 Surface treatment method for a mask blank, method of manufacturing a mask blank, and method of manufacturing a mask 有权
标题翻译：面罩坯料的表面处理方法，掩模坯料的制造方法以及掩模的制造方法
公开(公告)号：US08802334B2
公开(公告)日：2014-08-12
申请号：US13440539
申请日：2012-04-05
申请人： Takeyuki Yamada , Toshiyuki Suzuki , Masahiro Hashimoto , Yasunori Yokoya
发明人： Takeyuki Yamada , Toshiyuki Suzuki , Masahiro Hashimoto , Yasunori Yokoya
IPC分类号： G03F1/00
CPC分类号： G03F1/68 , G03F1/80
摘要： Provided is a mask blank surface treatment method for surface-treating, using a treatment liquid, a surface of a thin film, to be formed into a transfer pattern, of a mask blank having the thin film on a substrate. The thin film is made of a material that can be etched by ion-based dry etching. The concentration of an etching inhibitor contained in the treatment liquid is 0.3 ppb or less.
摘要翻译：提供了一种掩模坯料表面处理方法，用于将具有薄膜的掩模坯料在基板上进行表面处理，使用处理液，形成转印图案的薄膜表面。该薄膜由可以通过基于离子的干蚀刻蚀刻的材料制成。包含在处理液中的蚀刻抑制剂的浓度为0.3ppb以下。

9. 发明授权

US08777347B2 Liquid discharging apparatus, inspection method, and medium having recorded program 有权
标题翻译：液体排放装置，检查方法和记录程序的介质
公开(公告)号：US08777347B2
公开(公告)日：2014-07-15
申请号：US13445992
申请日：2012-04-13
申请人： Osamu Shinkawa , Toshiyuki Suzuki
发明人： Osamu Shinkawa , Toshiyuki Suzuki
IPC分类号： B41J29/38
CPC分类号： B41J2/0451 , B41J2/04581
摘要： A printer has a plurality of dischargers for discharging ink, a detector for detecting an electric signal SW, and an inspector unit for inspecting the dischargers on the basis of the electric signal SW; and a grounding terminal connecting a drive element of a discharger being inspected is electrically disconnected from another grounding terminal and a grounding line GL when the electric signal SW is detected by the detector.
摘要翻译：打印机具有用于排出墨的多个放电器，用于检测电信号SW的检测器和用于基于电信号SW检查放电器的检查单元; 并且当检测器检测到电信号SW时，连接被检查的放电器的驱动元件的接地端子与另一接地端子和接地线GL电连接。

10. 发明授权

US08663876B2 Photomask blank, method of manufacturing the same, photomask, and method of manufacturing the same 有权
标题翻译：光掩模坯料，其制造方法，光掩模及其制造方法
公开(公告)号：US08663876B2
公开(公告)日：2014-03-04
申请号：US13201368
申请日：2010-02-04
申请人： Masahiro Hashimoto , Toshiyuki Suzuki , Hiroyuki Iwashita
发明人： Masahiro Hashimoto , Toshiyuki Suzuki , Hiroyuki Iwashita
IPC分类号： C23C16/34 , G03F1/22
CPC分类号： G03F1/50 , G03F1/32 , G03F1/54
摘要： A photomask blank for use in the manufacture of a photomask adapted to be applied with exposure light having a wavelength of 200 nm or less has a thin film on a transparent substrate. The thin film is made of a material containing a transition metal, silicon, and carbon and comprising silicon carbide and/or a transition metal carbide.
摘要翻译：用于制造适用于具有200nm以下的波长的曝光光的光掩模的光掩模坯料在透明基板上具有薄膜。薄膜由含有过渡金属，硅和碳的材料制成，并且包含碳化硅和/或过渡金属碳化物。

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