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1. 发明专利

JP2005282671A Attached pipe restoring method in renewing main pipe embedded in ground and its device 有权
标题翻译：地基嵌入式管道中的连接管道恢复方法及其设备
公开(公告)号：JP2005282671A
公开(公告)日：2005-10-13
申请号：JP2004095295
申请日：2004-03-29
申请人： Hideyoshi Kimura , 栄喜木村
发明人： KIMURA HIDEYOSHI
IPC分类号： E03F3/06 , F16L1/024
摘要： PROBLEM TO BE SOLVED: To give restoring treatment to an attached pipe belonging to a main pipe in no-excavating manner while rationalizing construction time and days when performing reconstruction promoting technique for renewing an old pipe for a sewage main pipe with a new main pipe in no-excavating manner. SOLUTION: A restoring device 1 having a temporary reclaiming material 17 wound on the outer periphery of a shell is inserted into the mounting pipe P close to the old main pipe P0, and the temporary reclaiming material 17 is set and hardened on the inner peripheral face of the attached pipe with the enlargement of the diameter of the shell of the restoring device 1. Then, the old main pipe P0 is renewed with the new main pipe P1 in the condition of enlarging the diameter of the shell of the restoring device 1, a ground around an outer peripheral portion of the renewed main pipe P1 at the end of the attached pipe P is improved by discharging chemicals from the restoring device 1 in the condition of enlarging the diameter of the shell of the restoring device 1, and a communication hole 24 communicating the main pipe P1 with the attached pipe P is formed in the side of the main pipe P1. After removing the restoring device with its diameter shrunk, the new main pipe P1 and the attached pipe P are made into one unit with a reclaiming material 30. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在以新的方式对主管道的附属管道进行恢复处理，同时使用新的污水主管更新旧管道的重建促进技术合理化施工时间和天数主管不挖掘。解决方案：将具有卷绕在壳体外周上的临时回收材料17的恢复装置1插入靠近旧主管P0的安装管P中，临时回收材料17在连接管的内周面随着恢复装置1的壳体直径的增大而增大。然后，在主复原管的外径扩大的情况下，用新的主管P1更新旧的主管P0 在装置1中，通过在恢复装置1的壳体的直径扩大的条件下，从恢复装置1排放化学药品，可以改善在安装管P的末端更新的主管P1的外周部周围的地面，并且在主管P1的侧面形成有连通主管P1与安装管P的连通孔24。在拆除其直径缩小的复原装置后，新的主管P1和连接管P与回收材料30制成一个单元。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004232329A Repairing method for drain installing pipe and using support carriage 有权
公开(公告)号：JP2004232329A
公开(公告)日：2004-08-19
申请号：JP2003021878
申请日：2003-01-30
申请人： Hideyoshi Kimura , 栄喜木村
发明人： KIMURA HIDEYOSHI
IPC分类号： E03F3/04 , B29C63/36 , B29L9/00 , B29L23/00 , E03F7/00 , F16L1/00 , F16L55/16
摘要： PROBLEM TO BE SOLVED: To reclaim and repair an installing part for a drain installing pipe and a main pipe by simultaneously performing reclaiming-repairing work for the buried drain installing pipe communicating with a sewerage main pipe from a house inlet and a street inlet without digging-up. SOLUTION: A repairing material 5 including a cylindrical repairing cloth material 51 impregnated with a synthetic resin and cylindrical reversing rubber 4 are linked, and are installed in a reversing guide 2. The reversing rubber 4 and the repairing material 5 are reversely inserted into the drain installing pipe P 1 from the reversing guide 2 by the action of a high pressure fluid A on the reversing rubber 4 so that the repairing material 5 becomes the outside of the reversing rubber 4, and the repairing cloth material tip 51 E is projected in the main pipe P o , and the reversing rubber 4 is pressurized and expanded in contact with a support plate 94 arranged in the main pipe P o , and a swelling balloon 4B is formed on the tip of the reversing rubber 4. The repairing material 5 is brought into pressure contact with an inner peripheral surface of an installing pipe P 1 , and the impregnated synthetic resin is hardened in a state of expansively opening the repairing cloth material tip 51 E in pressure contact in the form of a collar R for covering an installing pipe port PE, and the reversing rubber 4 is extracted after hardening, and a repairing-reclaiming pipe is formed of one repairing cloth material 51. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2006307989A Regenerated pipe of underground embedded pipe and its method 有权
标题翻译：地下嵌入管再生管及其方法
公开(公告)号：JP2006307989A
公开(公告)日：2006-11-09
申请号：JP2005131801
申请日：2005-04-28
申请人： Hideyoshi Kimura , 栄喜木村
发明人： KIMURA HIDEYOSHI
IPC分类号： F16L55/16 , F16L1/00 , F16L9/22
摘要： PROBLEM TO BE SOLVED: To provide a regenerated pipe to be constructed with good water running performance by carrying into an underground embedded pipe segments into which a circular pipe is divided in the peripheral direction and joining the segments to each other in their peripheral and longitudinal directions with less bolts so that the inner peripheral face abuts only on the inner face plate of each segment to be flush therewith. SOLUTION: The segment 3 has shaft flanges 16 at both side edges and front and rear circumferential flanges 15A, 15B protruded outward from the inner face plate 29 in a curved shape, and a fitting plate 30 arranged at the front end of the inner face plate 29 and a fitting groove G3 arranged at the rear end. The mutual circumferential connection of the segments 3 are carried out by connecting the shaft flanges 16 at both side edges to each other with a short bolt 19 and the mutual longitudinal connection of the segments 3 are carried out by fitting the fitting plate 30 at the front end of the segment 3 into the fitting groove G3 at the rear end of the segment 3 and fastening the front and rear segments to each other via the rear circumferential flange 15B with a long bolt 17. Thus, the regenerated pipe has such a flush and smooth form that the inner peripheral face abuts only on the inner face plate 29 of each segment. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有良好的水运行性能的再生管道，通过携带在圆周方向上被分割成圆形管的地下嵌入管段，并在其周边部分彼此连接以及具有较少螺栓的纵向方向，使得内周面仅与每个区段的内表面板抵接以与其齐平。 <3>解决方案：段3在两侧边缘处具有轴凸缘16，在弯曲形状的内表面板29的外侧突出的前后周向凸缘15A，15B，以及配置板30 内面板29和配置在后端的配合槽G3。通过用短螺栓19将两个侧边缘处的轴凸缘16相互连接来实现节段3的相互圆周连接，并且通过将配合板30装配在前部来实现节段3的相互纵向连接将段3的端部插入到段3的后端处的装配槽G3中，并且通过长螺栓17经由后周向凸缘15B将前段和后段彼此紧固。因此，再生管具有这样的冲洗和内周面仅与每个片段的内面板29邻接的平滑形状。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2014206209A 地下埋設管更生用管材有权
标题翻译：地下管道再生管材料
公开(公告)号：JP2014206209A
公开(公告)日：2014-10-30
申请号：JP2013083601
申请日：2013-04-12
申请人：栄喜木村 , Hideyoshi Kimura , 栄喜木村
发明人： KIMURA HIDEYOSHI
IPC分类号： F16L1/00 , B29C65/78
摘要：【課題】部品点数が少なく構造が簡単で製造が容易であり、その管材の接続作業も周辺事情に左右されずに煩雑性を伴わず円滑にでき、しかも裏込め作業に際して裏込め材を満遍なく充填させることができ、高強度で且つ耐薬品性に優れた地下埋設管更生用管材を提供する。【解決手段】地下に埋設された既成管内に多数本の短尺の管材を順次導入し、それらの管材を長さ方向に順次接続して上記既成管内に更生用管材を敷設一体化する既成管更生用の管材11であって、その接続端部の一方の第1端部11の外周面が先細状の第1テーパ面11aに形成された第1テーパ部を構成し、他の接続端部である第2端部の内周面が前記第1テーパ部を密嵌する第2テーパ面12aを有してなる。【選択図】図1
摘要翻译：要解决的问题：为了提供一种数量少的部件的地下埋管再生管材料，结构简单，可以容易地制造，可以顺利地进行管材的连接工作而不受周围环境的影响，没有伴随的复杂性，而且可以在填充后的工作中均匀填充填充材料，具有高强度和优异的耐化学腐蚀性。解决方案：在用于现有管再生的管材1中，用于连续引入少量短将管道材料放入地下埋设的现有管道中，连续沿长度方向连接管材，并在现有管道中铺设并整合用于再生的管材，连接端部的一侧第一端部11的外周面的管材构成形成在锥形的第一锥形表面11a和内部的第一锥形部分作为另一连接端部的第二端部的圆周表面具有与第一锥形部紧密配合的第二锥形表面12a。

5. 发明授权

US06874910B2 Light source device using LED, and method of producing same 有权
标题翻译：使用LED的光源装置及其制造方法
公开(公告)号：US06874910B2
公开(公告)日：2005-04-05
申请号：US10398660
申请日：2001-12-03
申请人： Masaru Sugimoto , Eiji Shiohama , Hideyoshi Kimura , Takuma Hashimoto , Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Jiro Hashizume
发明人： Masaru Sugimoto , Eiji Shiohama , Hideyoshi Kimura , Takuma Hashimoto , Toshiyuki Suzuki , Kazuya Nakagawa , Mitsuru Kobayashi , Jiro Hashizume
IPC分类号： H01L25/075 , H01L33/64 , F21V29/00 , H01L33/00
CPC分类号： H01L33/642 , H01L24/45 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/32188 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/20752
摘要： A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.
摘要翻译：一种具有导热性的散热板的光源装置和与散热板的至少一侧连接的绝缘构件，其具有设置在其面向散热板的一侧的通孔。所述光源装置还包括LED芯片，所述LED芯片安装并热耦合到所述辐射板的面向所述通孔的暴露部分，从所述绝缘构件的散热板端部在所述通孔向内突出的延伸部，以及布置在所述绝缘构件通过所述绝缘构件与所述散热板电隔离。光源装置还包括电连接延伸部上的布线图案和LED芯片的电极的接合线，以及填充用于完全封装LED芯片和接合线的通孔的透光密封材料。

6. 发明申请

US20070007540A1 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US20070007540A1
公开(公告)日：2007-01-11
申请号：US10558360
申请日：2004-05-26
申请人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
发明人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15156 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/01005 , H01L2924/01033
摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
摘要翻译：发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光发光二极管芯片（5）。底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

7. 发明授权

US07717589B2 Light emitting device using light emitting diode chip 有权
标题翻译：发光装置采用发光二极管芯片
公开(公告)号：US07717589B2
公开(公告)日：2010-05-18
申请号：US10596019
申请日：2004-11-25
申请人： Kouji Nishioka , Masaru Sugimoto , Hideyoshi Kimura , Ryoji Yokotani , Yutaka Iwahori , Takuma Hashmoto , Shinya Ishizaki , Satoshi Mori , Hiroyuki Sekii , Eiji Shiohama
发明人： Kouji Nishioka , Masaru Sugimoto , Hideyoshi Kimura , Ryoji Yokotani , Yutaka Iwahori , Takuma Hashmoto , Shinya Ishizaki , Satoshi Mori , Hiroyuki Sekii , Eiji Shiohama
IPC分类号： F21V9/00 , F21V9/16 , H01J1/62
CPC分类号： H01L33/507 , H01L33/508 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/3025 , Y10S362/80 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.
摘要翻译：发光装置包括：安装在形成于安装基板上的凹部中的LED芯片; 波长转换部件被设置为覆盖凹部和围绕凹部的边缘区域并被从LED芯片发射的光激发以发射与激发波长不同的波长的光; 以及发射控制部件，其设置在所述波长转换部件的光输出侧，以便发射来自与所述凹部对应的所述波长转换部件的区域的光，并且防止来自所述波长的区域的光的发射转换构件对应于凹部周围的边缘区域。这可以防止从波长转换构件的中心部分发出的光和位于安装基板的凹部周围的边缘区域上的波长转换构件的部分发射的光的颜色变化，从而减少颜色的不均匀性照射面。

8. 发明授权

US07495322B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US07495322B2
公开(公告)日：2009-02-24
申请号：US10558360
申请日：2004-05-26
申请人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
发明人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
IPC分类号： H01L21/00 , H01L23/495 , F21V29/00 , H05K1/11 , H05K5/02 , H05K7/18
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15156 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/01005 , H01L2924/01033
摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
摘要翻译：发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光发光二极管芯片（5）。底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

9. 发明申请

US20070085103A1 Light emitting device using light emitting diode chip 有权
标题翻译：发光装置采用发光二极管芯片
公开(公告)号：US20070085103A1
公开(公告)日：2007-04-19
申请号：US10596019
申请日：2004-11-25
申请人： Kouji Nishioka , Masaru Sugimoto , Hideyoshi Kimura , Ryoji Yokotani , Yutaka Iwahori , Takuma Hashmoto , Shinya Ishizaki , Satoshi Mori , Hiroyuki Sekii , Eiji Shiohama
发明人： Kouji Nishioka , Masaru Sugimoto , Hideyoshi Kimura , Ryoji Yokotani , Yutaka Iwahori , Takuma Hashmoto , Shinya Ishizaki , Satoshi Mori , Hiroyuki Sekii , Eiji Shiohama
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/508 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/3025 , Y10S362/80 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.
摘要翻译：发光装置包括：安装在形成于安装基板上的凹部中的LED芯片; 波长转换部件被设置为覆盖凹部和围绕凹部的边缘区域并被从LED芯片发射的光激发以发射与激发波长不同的波长的光; 以及发射控制部件，其设置在所述波长转换部件的光输出侧，以便发射来自与所述凹部对应的所述波长转换部件的区域的光，并且防止来自所述波长的区域的光的发射转换构件对应于凹部周围的边缘区域。这可以防止从波长转换构件的中心部分发射的光和位于安装基板的凹部周围的边缘区域上的波长转换构件的部分发射的光之间的颜色变化，从而减少颜色的不均匀性照射面。

10. 发明授权

US07084435B2 Light emitting device using LED 有权
标题翻译：使用LED的发光装置
公开(公告)号：US07084435B2
公开(公告)日：2006-08-01
申请号：US10483995
申请日：2003-01-06
申请人： Masaru Sugimoto , Masao Yamaguchi , Takuma Hashimoto , Koji Nishioka , Ryoji Yokotani , Hideyoshi Kimura , Tadashi Murakami , Eiji Shiohama
发明人： Masaru Sugimoto , Masao Yamaguchi , Takuma Hashimoto , Koji Nishioka , Ryoji Yokotani , Hideyoshi Kimura , Tadashi Murakami , Eiji Shiohama
IPC分类号： H01L29/22 , H01L29/24
CPC分类号： H01L33/507 , F21K9/64 , F21V29/677 , F21V29/83 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/16225
摘要： A light-emitting device which uses and LED having a light-emitting element being placed on a package substrate. The light-emitting element has a light-extracting surface. A fluorescent element which is formed by dispersing a fluorescent material in a transparent substance and is placed face to face with the light-extracting surface of the light emitting element and comprises a clearance gap in between. The light-emitting element generates light of a certain wavelength that emanates through the light-extracting surface into the fluorescent element where the wavelength is changed. The device further comprises an optical element which receives light from the light-emitting element through the fluorescent element and directs the light to the outside of the device.
摘要翻译：一种发光装置，其使用具有发光元件的LED，该发光元件放置在封装基板上。发光元件具有光提取面。荧光元件，其通过将荧光材料分散在透明物质中并且与发光元件的光提取表面面对面并且在其间包括间隙而形成。发光元件产生通过光提取表面发射到波长变化的荧光元件的一定波长的光。该装置还包括光学元件，其通过荧光元件接收来自发光元件的光并将光引导到装置的外部。

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