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1. 发明授权

US5513285A Compact optical switching module including thin-film heaters and trimmed thick-film fixed resistors 失效
标题翻译：紧凑型光开关模块，包括薄膜加热器和修剪的厚膜固定电阻
公开(公告)号：US5513285A
公开(公告)日：1996-04-30
申请号：US216040
申请日：1994-06-14
申请人： Toshiyuki Kawashima , Jiro Utsunomiya , Kiyoshi Kurosawa , Iida Saburo , Ryo Nagase , Akira Himeno , Ken-ichi Yukimatsu , Masayuki Okyno , Kuniharu Kato , Masao Kawachi
发明人： Toshiyuki Kawashima , Jiro Utsunomiya , Kiyoshi Kurosawa , Iida Saburo , Ryo Nagase , Akira Himeno , Ken-ichi Yukimatsu , Masayuki Okyno , Kuniharu Kato , Masao Kawachi
IPC分类号： G02B6/12 , G02F1/01 , G02F1/313 , G02B6/26
CPC分类号： G02F1/3132 , G02F1/0147 , G02B2006/12135 , G02B2006/12145
摘要： An optical switching module has an optical waveguide substrate mounted on an electronic circuit substrate. According to a first aspect of the invention, the optical waveguide substrate has thin-film heaters, and the electronic circuit substrate has trimmable thick-film resistors for adjusting current fed to the thin-film heaters. According to a second aspect of the invention, the optical switching module also has a pair of fiber pigtails butt-coupled to the optical waveguide substrate. The fiber pigtails are secured to the ends of a supporter, which is attached to a heat sink fastened below the electronic circuit substrate. According to a third aspect of the invention, the optical waveguide substrate is mounted in a depression in the electronic circuit substrate. The invention reduces the size of the optical switching module.
摘要翻译：光开关模块具有安装在电子电路基板上的光波导基板。根据本发明的第一方面，光波导基板具有薄膜加热器，并且电子电路基板具有用于调节馈送到薄膜加热器的电流的可调节厚膜电阻器。根据本发明的第二方面，光开关模块还具有一对与光波导基板对接的光纤尾纤。纤维尾纤固定到支撑件的端部，该支撑件附接到紧固在电子电路基板下方的散热器。根据本发明的第三方面，光波导基板安装在电子电路基板的凹部中。本发明减小了光开关模块的尺寸。

2. 发明授权

US6087194A Composite unit of optical semiconductor device and supporting substrate and method for mounting optical semiconductor device on supporting substrate 失效
标题翻译：光学半导体器件和支撑衬底的复合单元以及将光学半导体器件安装在支撑衬底上的方法
公开(公告)号：US6087194A
公开(公告)日：2000-07-11
申请号：US959855
申请日：1997-10-29
申请人： Hisao Matsukura , Yasuhiko Kudou , Hajime Hotta , Akio Hirakawa , Masaki Sugawara , Jiro Utsunomiya , Kiyoshi Kurosawa
发明人： Hisao Matsukura , Yasuhiko Kudou , Hajime Hotta , Akio Hirakawa , Masaki Sugawara , Jiro Utsunomiya , Kiyoshi Kurosawa
IPC分类号： H01L31/0203 , H01L33/38 , H01L33/62 , H01L21/00
CPC分类号： H01L33/62 , H01L31/0203 , H01L2224/16
摘要： Composite units of an optical semiconductor device and a supporting substrate are disclosed, in which the rear surface of the optical semiconductor device is provided with one or more electrode patterns and the top surface of the supporting substrate is provided with one or more electrode patterns. The optical semiconductor device and the supporting substrate are fixed to each other by once melting and solidifying one or more solder bumps which intervene between the one or more electrode patterns provided on the rear surface of the optical semiconductor device and the one or more electrode patterns provided on the top surface of the supporting substrate. A good grade of accuracy in the mutual geometric position of the optical semiconductor device and the supporting substrate is obtained in a horizontal direction due to a phenomenon called "the self alignment results" in this specification, in which a molten metal is inclined to become a ball based on surface tension. Methods for mounting an optical semiconductor device on a supporting substrate with a good grade of accuracy in the mutual geometric position therebetween in the horizontal direction, based on the same technical principle, are also disclosed. To realize the foregoing results, each of the composite units of an optical semiconductor device and supporting substrate in accordance with this invention is given various structures specific to each of them, and each of the methods in accordance with this invention is given various steps or processes specific to each of them.
摘要翻译：公开了光半导体器件和支撑衬底的复合单元，其中光学半导体器件的后表面设置有一个或多个电极图案，并且支撑衬底的顶表面设置有一个或多个电极图案。光学半导体器件和支撑衬底通过一次熔化和凝固一个或多个介于设置在光学半导体器件的后表面上的一个或多个电极图案和提供的一个或多个电极图案之间的焊料凸块彼此固定在支撑基板的顶面上。由于在本说明书中称为“自对准结果”的现象，在水平方向上获得了光半导体装置和支撑基板的相互几何位置的良好的精度等级，其中熔融金属倾向于变为基于表面张力的球。还公开了基于相同的技术原理将光学半导体器件在水平方向上在相互几何位置之间以相互几何位置准确地准确地安装在支撑基板上的方法。为了实现上述结果，根据本发明的光学半导体器件和支撑衬底的复合单元中的每一个被给予各自特定的各种结构，并且根据本发明的每个方法被给予各种步骤或过程具体到每个人。

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