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    • 10. 发明授权
    • Resonant pressure sensor and method of manufacturing the same
    • 共振压力传感器及其制造方法
    • US09003889B2
    • 2015-04-14
    • US13593311
    • 2012-08-23
    • Yuusaku YoshidaTakashi YoshidaHiroshi SuzukiShuhei YoshitaHisashi Terashita
    • Yuusaku YoshidaTakashi YoshidaHiroshi SuzukiShuhei YoshitaHisashi Terashita
    • G01L11/00G01L9/00
    • G01L9/0016G01L9/0045
    • A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.
    • 包括设置在隔膜上的一个或多个谐振型应变计的共振压力传感器可以包括由硅制成的传感器基板,并且包括一个表面,一个表面上布置有一个或多个谐振型应变计元件,另一个表面抛光到 具有对应于隔膜的厚度,由硅制成的基底基板,其包括与传感器基板的另一表面直接接合的一个表面;凹部,形成在与传感器基板接合的基底部分的一部分中,基本上形成隔膜 并且包括预定的间隙,其不会由于异物而限制隔膜的可移动范围,并且抑制由共振型应变计元件的振动激励的隔膜的振动,一个或多个导电孔和 流体。