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1. 发明授权

US06411510B1 Heat sink-equipped cooling apparatus 有权
公开(公告)号：US06411510B1
公开(公告)日：2002-06-25
申请号：US09778312
申请日：2001-02-07
申请人： Noriyasu Sasa , Toshiki Ogawara , Michinori Watanabe , Haruhisa Maruyama
发明人： Noriyasu Sasa , Toshiki Ogawara , Michinori Watanabe , Haruhisa Maruyama
IPC分类号： H05H720
摘要： A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween.

2. 发明授权

US06419007B1 Heat sink-equipped cooling apparatus 有权
标题翻译：散热装置冷却装置
公开(公告)号：US06419007B1
公开(公告)日：2002-07-16
申请号：US09864578
申请日：2001-05-24
申请人： Toshiki Ogawara , Haruhisa Maruyama , Michinori Watanabe , Noriyasu Sasa
发明人： Toshiki Ogawara , Haruhisa Maruyama , Michinori Watanabe , Noriyasu Sasa
IPC分类号： F28F700
CPC分类号： F28F13/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween. The inner edges of the radiation fins are connected in a manner to be heat-transferable or in a manner that a thermally conductive passage is formed between the inner edges.
摘要翻译：一种散热装置的冷却装置，其能够显示出增加的冷却性能和耐久性，并且其径向尺寸减小。散热器包括散热片单元，其包括多个辐射翅片，其布置成围绕虚拟中心线，同时保持其中心与中心线对齐。冷却风扇包括：叶轮，其包括多个叶片并通过马达旋转。冷却风扇以这样的方式安装在散热器上，使得叶轮位于散热器的辐射翅片单元上方。辐射翅片各自相对于虚拟垂直平面倾斜，以便在它们之间形成预定的倾斜角度θ。辐射翅片的内边缘以可热转印的方式连接，或以在内边缘之间形成导热通道的方式连接。

3. 外观设计

USD511326S1 Electronic component cooling apparatus 失效
标题翻译：电子部件冷却装置
公开(公告)号：USD511326S1
公开(公告)日：2005-11-08
申请号：US29196215
申请日：2003-12-23
申请人： Michinori Watanabe , Toshiki Ogawara , Masayuki Iijima , Haruhisa Maruyama
设计人： Michinori Watanabe , Toshiki Ogawara , Masayuki Iijima , Haruhisa Maruyama

4. 发明申请

US20050168946A1 Heat-emitting element cooling apparatus 有权
标题翻译：发光元件冷却装置
公开(公告)号：US20050168946A1
公开(公告)日：2005-08-04
申请号：US11097656
申请日：2005-04-01
申请人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama , Masayuki Iijima
发明人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama , Masayuki Iijima
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.
摘要翻译：提供一种可以在不增加其尺寸的情况下改善对发热元件的冷却效果的发热元件冷却装置。散热器被构造成使得从安装轴流风扇单元的一侧观察，散热片的全部或部分位于基座轮廓之外。然后，轴流风扇单元被构造成沿着位于基座轮廓外的辐射翅片的部分排出空气。

5. 发明申请

US20090218079A1 HEAT-EMITTING ELEMENT COOLING APPARATUS 审中-公开
标题翻译：发热元件冷却装置
公开(公告)号：US20090218079A1
公开(公告)日：2009-09-03
申请号：US12393354
申请日：2009-02-26
申请人： Michinori Watanabe , Haruhisa Maruyama , Toshiki Ogawara , Koji Ueno
发明人： Michinori Watanabe , Haruhisa Maruyama , Toshiki Ogawara , Koji Ueno
IPC分类号： H01L23/46
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： There is provided a heat-emitting element cooling apparatus capable of enhancing cooling effect on a heat-emitting element as well as reducing noise. A heat sink includes a core portion and a plurality of radiation fins fixed to the core portion. Dimensions of the core portion and the radiation fins are defined in such a manner that the diameter L1 of the core portion should be 37% to 45% of the diameter L2 of a shape depicted by a virtual connecting line which connects end portions of the radiation fins.
摘要翻译：提供了一种能够增强对发热元件的冷却效果以及降低噪音的发热元件冷却装置。散热器包括芯部和固定到芯部的多个散热片。芯部分和辐射翅片的尺寸被限定为使得芯部的直径L1应该是连接辐射端部的虚拟连接线所示形状的直径L2的37％至45％翅片。

6. 外观设计

USD570301S1 Electronic component cooling apparatus 有权
标题翻译：电子部件冷却装置
公开(公告)号：USD570301S1
公开(公告)日：2008-06-03
申请号：US29249886
申请日：2006-10-25
申请人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
设计人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama

7. 发明授权

US07331756B2 Axial-flow fan unit and heat-emitting element cooling apparatus 有权
标题翻译：轴流风机单元和发热元件冷却装置
公开(公告)号：US07331756B2
公开(公告)日：2008-02-19
申请号：US10879265
申请日：2004-06-29
申请人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
发明人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
IPC分类号： F04D29/54
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An axial-flow fan unit that produces less noise is provided. Blades 19 are exposed from a venturi 29. The shape of each of the blades 19 is so defined that a space formed between at least an inner surface 28a of each of web leg sections 28A to 28C and an edge 19a of each of the blades 19 located in the radially outward direction of the blades 19 expands toward the ends of the web leg sections 28A to 28C (or web bodies 30A to 30C). With this arrangement, noise produced when the blades 19 rotate along the web leg sections 28A to 28C is reduced.
摘要翻译：提供了产生较少噪音的轴流风扇单元。刀片19从文氏管29露出。每个叶片19的形状被限定为在每个腹板腿部分28A至28C的至少内表面28a和每个叶片19的位于径向外侧的边缘21a之间形成的空间叶片19的方向朝向腹板腿部28A至28C（或腹板体30A至30C）的端部扩张。利用这种布置，当叶片19沿着腹板腿部分28A至28C旋转时产生的噪声减小。

8. 外观设计

USD509483S1 Heat sink 失效
公开(公告)号：USD509483S1
公开(公告)日：2005-09-13
申请号：US29196214
申请日：2003-12-23
申请人： Michinori Watanabe , Toshiki Ogawara , Masayuki Iijima , Haruhisa Maruyama
设计人： Michinori Watanabe , Toshiki Ogawara , Masayuki Iijima , Haruhisa Maruyama

9. 发明授权

US06621699B2 Electronic component cooling apparatus 有权
公开(公告)号：US06621699B2
公开(公告)日：2003-09-16
申请号：US10185202
申请日：2002-06-28
申请人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
发明人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
IPC分类号： H05K720
CPC分类号： H01L23/40 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing force transferring sections 37 for transferring a pushing force from mounting tools 35 to a heat sink 3 through contact with leading ends of radiation fins 11 are integrally formed on a pair of wall sections 25a of a casing 21. The pushing force transfer sections 37 have a shape that can distribute the pushing force and transfer distributed force to the heat sink 3 so as to prevent a force applied to an electronic component MPU by the pushing force from being locally and extremely increased.

10. 外观设计

USD563910S1 Electronic component cooling apparatus 有权
公开(公告)号：USD563910S1
公开(公告)日：2008-03-11
申请号：US29249884
申请日：2006-10-25
申请人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama
设计人： Michinori Watanabe , Toshiki Ogawara , Haruhisa Maruyama

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