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1. 发明授权

US5231271A Management method of printed circuit boards in assembling process and management system therefor 失效
标题翻译：印刷电路板组装过程管理方法及管理系统
公开(公告)号：US5231271A
公开(公告)日：1993-07-27
申请号：US709516
申请日：1991-06-03
申请人： Toshikatsu Hino , Nobukatsu Wakabayashi , Koji Kobayashi , Kazuhide Toyoda
发明人： Toshikatsu Hino , Nobukatsu Wakabayashi , Koji Kobayashi , Kazuhide Toyoda
IPC分类号： B23P21/00 , B65G1/00 , B65G1/02 , B65G1/04 , B65G1/137 , B65G43/08 , B65G47/49 , B65G61/00 , B66F9/07
CPC分类号： G06Q10/06 , G06Q10/08
摘要： Finished printed circuit boards and their identity data are stored in an automatic warehouse and in a stock file, respectively. It is determined whether all necessary printed circuit boards inserted into the shelf of an electronic apparatus are stored in the automatic warehouse by examining the identity data of the printed circuit boards, and if the all necessary printed circuit boards are found to be stored in the automatic warehouse, the identity data of all the necessary printed circuit boards are stored in a delivery file, and the printed circuit boards are delivered according to contents of the delivery file. Employing this method, an amount of "goods in process" and their retention time are decreased, and information about individual parts used in a dispatched apparatus is easily obtained.
摘要翻译：成品印刷电路板及其身份数据分别存储在自动仓库和库存文件中。通过检查印刷电路板的身份数据确定插入电子设备的架子中的所有必要的印刷电路板是否被存储在自动仓库中，并且如果发现所有必需的印刷电路板被存储在自动仓库中仓库，所有必要的印刷电路板的身份数据存储在传送文件中，并且印刷电路板根据传送文件的内容传送。采用这种方法，减少了“正在处理的货物”及其保留时间，并且容易地获得关于在被派遣的装置中使用的各个部件的信息。

2. 发明授权

US5321885A Method and apparatus for manufacturing printed wiring boards 失效
标题翻译：制造印刷电路板的方法和装置
公开(公告)号：US5321885A
公开(公告)日：1994-06-21
申请号：US945659
申请日：1992-11-12
申请人： Toshikatsu Hino , Masakazu Kobayashi , Shozo Suzuki , Satomi Furukawa
发明人： Toshikatsu Hino , Masakazu Kobayashi , Shozo Suzuki , Satomi Furukawa
IPC分类号： B23P21/00 , B23Q7/10 , H05K13/00 , H05K13/02 , H05K13/08 , H05K3/30 , B23P23/00
CPC分类号： B23Q7/10 , B23P21/004 , H05K13/0061 , H05K13/02 , H05K13/08 , Y10T29/4913 , Y10T29/49144 , Y10T29/5136 , Y10T29/5137 , Y10T29/5196
摘要： A system for manufacturing printed circuit board units having facilities for automatically performing a component replacement work or component replenishment work which may take place during the changeover of products and ensuring an effective flexible manufacture of the printed wiring board units includes a plurality of the processing cells. Conveyance passages, on which automatic conveying vehicles travel, extend across the processing cells. Along the conveyances passages, there are provided storages opposite to the processing cells. Predetermined electronic components are arranged in advance onto a pallet in a predetermined sequence by an automatic on-pallet arranging unit provided separately from the processing cells, and the pallet is supplied into the processing cells.
摘要翻译： PCT No.PCT / JP92 / 00291 Sec。 371日期：1992年11月12日 102（e）日期1992年11月12日PCT 1991年3月11日PCT公布。第WO92 / 17047号公报日本1992年1月10日。一种用于制造印刷电路板单元的系统，其具有用于自动执行可在产品切换期间发生的部件更换工作或部件补充工作的设施，并确保印刷线路板单元的有效柔性制造包括多个处理单元。自动输送车辆行驶的输送通道延伸穿过处理室。沿着运送通道，提供与处理室相对的存储器。预先确定的电子部件通过与处理单元分开设置的自动托盘排列单元，以预定顺序预先布置在托盘上，并且将托盘供应到处理单元中。

3. 发明授权

US4621419A Automatic IC mounting process and apparatus for performing the process 失效
标题翻译：自动IC安装过程和执行该过程的设备
公开(公告)号：US4621419A
公开(公告)日：1986-11-11
申请号：US687283
申请日：1984-12-28
申请人： Toshikatsu Hino , Fumio Arase , Takashi Ohshima
发明人： Toshikatsu Hino , Fumio Arase , Takashi Ohshima
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04 , H05K13/08 , H05K3/30 , B23P23/00
CPC分类号： H05K13/0404 , H05K13/08 , Y10T29/5137 , Y10T29/53183
摘要： An automatic IC mounting process for mounting a plurality of ICs on an upper surface of a printed circuit board in accordance with a predetermined sequence program. Each of the ICs has a plurality of leads, each of which is to be inserted into a predetermined corresponding through-hole of the printed circuit board. The process includes: (i) a step for inserting the leads of an IC into the through-holes of the printed circuit board; (ii) a step for detecting whether or not each lead of the IC is correctly inserted into the corresponding through-hole after every step (i); (iii) a step for removing a misinserted IC having a misinserted lead from the printed circuit board and discarding the misinserted IC into a predetermined reject place immediately after a misinsertion is detected in the step (ii); (iv) a step for memorizing the information for identifying the misinserted IC; (v) a step for mounting a predetermined number of subsequent ICs on the printed circuit board in accordance with the predetermined sequence program, leaving the position of the misinserted IC unmounted; (vi) a step for searching for whether or not the information was memorized in the step (iv); and, (vii) a step for preparing a new IC identified by that information and remounting it on the printed circuit board at the position of the misinserted IC.
摘要翻译：一种用于根据预定顺序程序将多个IC安装在印刷电路板的上表面上的自动IC安装过程。每个IC具有多个引线，每个引线被插入到印刷电路板的预定对应的通孔中。该方法包括：（i）将IC的引线插入印刷电路板的通孔中的步骤; （ii）在每个步骤（i）之后检测IC的每个引线是否被正确地插入到相应的通孔中的步骤; （iii）在步骤（ii）中检测到错误插入之后，立即将从印刷电路板移除具有错误插入的引线的错误插入的IC并将错误插入的IC丢弃到预定的拒绝位置的步骤; （iv）记录识别错误插入的IC的信息的步骤; （v）根据预定的顺序程序将预定数量的后续IC安装在印刷电路板上的步骤，使错误插入的IC的位置不被安装; （vi）在步骤（iv）中搜索该信息是否被记住的步骤; 和（vii）准备由该信息确定的新的IC并将其重新安装在印刷电路板上的错误插入IC位置的步骤。

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