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1. 发明授权

US06498307B2 Electronic component package, printing circuit board, and method of inspecting the printed circuit board 失效
标题翻译：电子元件封装，印刷电路板以及检查印刷电路板的方法
公开(公告)号：US06498307B2
公开(公告)日：2002-12-24
申请号：US09124509
申请日：1998-07-29
申请人： Yasuhiro Ichihara , Seiji Kogure , Hiroshi Iimura , Fumio Arase
发明人： Yasuhiro Ichihara , Seiji Kogure , Hiroshi Iimura , Fumio Arase
IPC分类号： H05K116
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2224/16 , H05K3/3436 , H05K2201/09781 , H05K2201/10969 , H05K2201/2018 , Y02P70/613
摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.
摘要翻译：一种球栅阵列（BGA）电子部件封装，具有能够提高安装效率的结构，并且防止在电子部件封装的电路连接部分处的占用空间。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。因此，即使对BGA封装施加冲击也是如此。当在制造工作期间安装其上具有BGA封装的印刷电路板时，在对这种冲击最敏感的BGA封装的外部或周边部分处，不小心掉落了冲击，该冲击被加强凸块和加强脚印吸收它们与电子部件封装的电路没有电连接。因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。

2. 发明授权

US06402920B1 Concentrating compartment and spacer construction for electrodeionization apparatus 有权
标题翻译：集电室和隔离器构造用于电去电离装置
公开(公告)号：US06402920B1
公开(公告)日：2002-06-11
申请号：US09657462
申请日：2000-09-07
申请人： Shin Sato , Fumio Arase , Takayuki Moribe
发明人： Shin Sato , Fumio Arase , Takayuki Moribe
IPC分类号： C25B1300
CPC分类号： B01J47/08 , B01D61/48 , B01D61/52
摘要： The electrodeionization apparatus is improved in concentration polarization of the ingredients including ions in the concentrating compartment so as to obtain the produced water with high purity. The electrodeionization apparatus has a spacer composed of a mesh and a frame-shaped gaskets superposed on the periphery of the mesh. The mesh has a thickness of 0.2 to 0.5 mm and the gaskets have thicknesses of equal to or less than 0.1 mm.
摘要翻译：电去离子装置改善了包括浓缩室中的离子的成分的浓度极化，以获得高纯度的产生的水。电去离子装置具有由网状物构成的间隔物和叠置在网眼周围的框状垫片。网格的厚度为0.2〜0.5mm，垫片的厚度为0.1mm以下。

3. 发明授权

US06727718B2 Electronic component package, printed circuit board, and method of inspecting the printed circuit board 失效
标题翻译：电子元件封装，印刷电路板以及检查印刷电路板的方法
公开(公告)号：US06727718B2
公开(公告)日：2004-04-27
申请号：US10298640
申请日：2002-11-19
申请人： Yasuhiro Ichihara , Seiji Kogure , Hiroshi Iimura , Fumio Arase
发明人： Yasuhiro Ichihara , Seiji Kogure , Hiroshi Iimura , Fumio Arase
IPC分类号： G01R3126
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2224/16 , H05K3/3436 , H05K2201/09781 , H05K2201/10969 , H05K2201/2018 , Y02P70/613
摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.
摘要翻译：一种球栅阵列（BGA）电子部件封装，其具有能够提高安装效率以及防止在电子部件封装的电路连接部分处的占用空隙的构造。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。因此，即使在BGA封装的外部或周边部分对BGA封装施加冲击，对于这种冲击最为敏感，冲击也被不受电连接的加强凸起和加强覆盖物吸收电子部件封装的电路。因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。

4. 发明授权

US4621419A Automatic IC mounting process and apparatus for performing the process 失效
标题翻译：自动IC安装过程和执行该过程的设备
公开(公告)号：US4621419A
公开(公告)日：1986-11-11
申请号：US687283
申请日：1984-12-28
申请人： Toshikatsu Hino , Fumio Arase , Takashi Ohshima
发明人： Toshikatsu Hino , Fumio Arase , Takashi Ohshima
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04 , H05K13/08 , H05K3/30 , B23P23/00
CPC分类号： H05K13/0404 , H05K13/08 , Y10T29/5137 , Y10T29/53183
摘要： An automatic IC mounting process for mounting a plurality of ICs on an upper surface of a printed circuit board in accordance with a predetermined sequence program. Each of the ICs has a plurality of leads, each of which is to be inserted into a predetermined corresponding through-hole of the printed circuit board. The process includes: (i) a step for inserting the leads of an IC into the through-holes of the printed circuit board; (ii) a step for detecting whether or not each lead of the IC is correctly inserted into the corresponding through-hole after every step (i); (iii) a step for removing a misinserted IC having a misinserted lead from the printed circuit board and discarding the misinserted IC into a predetermined reject place immediately after a misinsertion is detected in the step (ii); (iv) a step for memorizing the information for identifying the misinserted IC; (v) a step for mounting a predetermined number of subsequent ICs on the printed circuit board in accordance with the predetermined sequence program, leaving the position of the misinserted IC unmounted; (vi) a step for searching for whether or not the information was memorized in the step (iv); and, (vii) a step for preparing a new IC identified by that information and remounting it on the printed circuit board at the position of the misinserted IC.
摘要翻译：一种用于根据预定顺序程序将多个IC安装在印刷电路板的上表面上的自动IC安装过程。每个IC具有多个引线，每个引线被插入到印刷电路板的预定对应的通孔中。该方法包括：（i）将IC的引线插入印刷电路板的通孔中的步骤; （ii）在每个步骤（i）之后检测IC的每个引线是否被正确地插入到相应的通孔中的步骤; （iii）在步骤（ii）中检测到错误插入之后，立即将从印刷电路板移除具有错误插入的引线的错误插入的IC并将错误插入的IC丢弃到预定的拒绝位置的步骤; （iv）记录识别错误插入的IC的信息的步骤; （v）根据预定的顺序程序将预定数量的后续IC安装在印刷电路板上的步骤，使错误插入的IC的位置不被安装; （vi）在步骤（iv）中搜索该信息是否被记住的步骤; 和（vii）准备由该信息确定的新的IC并将其重新安装在印刷电路板上的错误插入IC位置的步骤。

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