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1. 发明申请

US20070148900A1 SURFACE-MOUNT CAPACITOR AND METHOD OF PRODUCING THE SAME 有权
标题翻译：表面安装电容器及其制造方法
公开(公告)号：US20070148900A1
公开(公告)日：2007-06-28
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01L21/20
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分以及连接到阴极部分的阴极端子。阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

2. 发明授权

US07326261B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07326261B2
公开(公告)日：2008-02-05
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G9/00
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分以及连接到阴极部分的阴极端子。阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

3. 发明授权

US07206193B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07206193B2
公开(公告)日：2007-04-17
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G2/10 , H01G9/08
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由条状板14和连接到阴极部分12的阴极端子19。阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

4. 发明申请

US20060087795A1 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US20060087795A1
公开(公告)日：2006-04-27
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G4/228
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由条状板14和连接到阴极部分12的阴极端子19。阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

5. 发明授权

US07312978B2 Electrically conductive polymer composition and solid electrolytic capacitor using the same 有权
公开(公告)号：US07312978B2
公开(公告)日：2007-12-25
申请号：US11356676
申请日：2006-02-17
申请人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
发明人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
IPC分类号： H01G9/00
摘要： An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitor 101 or a surface-mount transmission line element 102 has a polypyrrole conductive polymer layer 3 as a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layer 4 as a second solid electrolyte.

6. 发明授权

US06906912B2 Solid electrolytic capacitor and method of producing the same 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US06906912B2
公开(公告)日：2005-06-14
申请号：US10620084
申请日：2003-07-14
申请人： Shinji Arai , Masahiko Tanaka , Kenji Araki
发明人： Shinji Arai , Masahiko Tanaka , Kenji Araki
IPC分类号： H01G9/028 , H01G9/00 , H01G9/02 , H01G9/025 , H01G9/032 , H01G9/04 , H01G9/14 , H01G9/15
CPC分类号： H01G9/0036 , H01G9/025 , Y10T29/417
摘要： A solid electrolytic capacitor is provided in which non-conductive particles are made to be present between a dielectric layer and an electrolyte layer. A second electrolyte layer is formed of a conductive polymer including graphite particles and non-conductive particles.
摘要翻译：提供了一种固体电解电容器，其中使非导电颗粒存在于电介质层和电解质层之间。第二电解质层由包括石墨颗粒和非导电颗粒的导电聚合物形成。

7. 发明授权

US06671167B2 Solid electrolytic capacitor, and method for preparing the same 有权
标题翻译：固体电解电容器及其制备方法
公开(公告)号：US06671167B2
公开(公告)日：2003-12-30
申请号：US10300748
申请日：2002-11-21
申请人： Kenji Araki , Osamu Funaya , Shinji Arai
发明人： Kenji Araki , Osamu Funaya , Shinji Arai
IPC分类号： H01G406
CPC分类号： H01G9/025 , H01G11/48 , H01G11/56 , Y02E60/13
摘要： A solid electrolytic capacitor is disclosed which combines low LC with Low ESR and which has good characteristics even in a high frequency range, and a method for preparing the same is also disclosed. In the solid electrolytic capacitor whose electrolytic layer contains electrically conductive particles, non-conductive particles are present in at least a part of an interface between a dielectric layer and the electrolyte layer. By employing the structure, local intensifications of field strength in the dielectric layer are prevented to enable a problem of increase in LC to be overcome while keeping ESR low. By the method which comprised a step of applying a colloidal dispersion containing the non-conductive particles in the form of colloidal particles to the post-electrolytic layer formation step product, the solid electrolytic capacitor having the above-mentioned structure can be prepared efficiently.
摘要翻译：公开了一种固体电解电容器，其结合了低LC和低ESR，并且即使在高频范围内也具有良好的特性，并且还公开了制备该方法。在其电解质层含有导电粒子的固体电解电容器中，介电层与电解质层的界面的至少一部分中存在非导电性粒子。通过采用这种结构，可以防止电介质层中的场强的局部集中化，从而能够在保持ESR低的同时克服LC的增加的问题。通过包括将含有胶体粒子形式的非导电性粒子的胶态分散体施加到后电解质层形成工序的工序的方法，可以有效地制备具有上述结构的固体电解电容器。

8. 发明授权

US07379290B2 Electrically conductive polymer composition and solid electrolytic capacitor using the same 有权
标题翻译：导电聚合物组合物和使用其的固体电解电容器
公开(公告)号：US07379290B2
公开(公告)日：2008-05-27
申请号：US11356676
申请日：2006-02-17
申请人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
发明人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
IPC分类号： H01G9/00
CPC分类号： H01G9/028 , H01G9/042 , H01G11/48 , H01G11/56 , Y02E60/13 , Y10T29/41 , Y10T29/417
摘要： An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitor 101 or a surface-mount transmission line element 102 has a polypyrrole conductive polymer layer 3 as a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layer 4 as a second solid electrolyte.
摘要翻译：导电聚合物组合物含有通过使用由3,4-亚乙基二氧噻吩和聚苯乙烯磺酸的重复结构单元构成的阳离子形式的聚合物作为阴离子而得到的导电聚合物，并且还含有萘磺酸作为添加剂。固体电解电容器101或表面安装传输线元件102具有作为第一固体电解质的聚吡咯导电聚合物层3和作为第二固体电解质的聚（3,4-乙烯二氧噻吩）导电聚合物层4。

9. 发明申请

US20060187617A1 Electrically conductive polymer composition and solid electrolytic capacitor using the same 有权
标题翻译：导电聚合物组合物和使用其的固体电解电容器
公开(公告)号：US20060187617A1
公开(公告)日：2006-08-24
申请号：US11356676
申请日：2006-02-17
申请人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
发明人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
IPC分类号： H01G9/00
CPC分类号： H01G9/028 , H01G9/042 , H01G11/48 , H01G11/56 , Y02E60/13 , Y10T29/41 , Y10T29/417
摘要： An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitor 101 or a surface-mount transmission line element 102 has a polypyrrole conductive polymer layer 3 as a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layer 4 as a second solid electrolyte.
摘要翻译：导电聚合物组合物含有通过使用由3,4-亚乙基二氧噻吩和聚苯乙烯磺酸的重复结构单元构成的阳离子形式的聚合物作为阴离子而得到的导电聚合物，并且还含有萘磺酸作为添加剂。固体电解电容器101或表面安装传输线元件102具有作为第一固体电解质的聚吡咯导电聚合物层3和作为第二固体电解质的聚（3,4-乙烯二氧噻吩）导电聚合物层4。

10. 发明授权

US06457632B1 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy 有权
标题翻译：焊料合金及焊接方法与电焊或焊接合金电子部件
公开(公告)号：US06457632B1
公开(公告)日：2002-10-01
申请号：US09619445
申请日：2000-07-19
申请人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
发明人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要翻译：公开了用于粘接电子或电子部件的焊料合金，其包含：3至12重量％的锌组分; 和锡组分。焊料合金的氧含量降低到100ppm以下。使用焊料合金，在基板上形成接合部，并且将电子部件安装在其上，以获得用于安装电子部件的基板和安装有电子部件的基板。由上述焊料合金制成的接合部可以防止迁移。

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