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1. 发明专利

JP2003037802A Content distribution system 有权
标题翻译：内容分配系统
公开(公告)号：JP2003037802A
公开(公告)日：2003-02-07
申请号：JP2001221495
申请日：2001-07-23
申请人： Toshiba Corp , 株式会社東芝
发明人： KATAOKA TSUTOMU , SATO KAZUHIDE , KURATA ATSUSHI , UTSUNOMIYA SHUNSAKU , AZUMA HIROSHI
IPC分类号： G06F13/00 , H04N5/76 , H04N5/765 , H04N7/173 , H04N21/4227 , H04N21/4363 , H04W4/06 , H04W88/18 , H04Q7/38
摘要： PROBLEM TO BE SOLVED: To provide a content distribution system for enabling a user to view content stored in a home server in his (her) home with a portable terminal at a place where he (she) has gone.
SOLUTION: In the content distribution system 1, the user receives the broadcast content with a home server 9 and stores it in a storing section 7. When the user wants the distribution of the stored content to the portable terminal 10, authentication data is transmitted from the terminal 10 to the server 9 and the server 9 checks whether the terminal 10 is registered by the user. Upon completion of this checking, the server 9 distributes the object content designated by the user to the terminal 10 from among the content stored in the section 7.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种内容分发系统，用于使得用户能够在他（她）所在的地方利用便携式终端来查看他（她）家中存储在家庭服务器中的内容。解决方案：在内容分发系统1中，用户使用家庭服务器9接收广播内容，并将其存储在存储部分7中。当用户想要将所存储的内容分发给便携式终端10时，将认证数据从终端10到服务器9和服务器9检查终端10是否由用户注册。在完成该检查后，服务器9从存储在部分7中的内容中将用户指定的对象内容分发给终端10。

2. 发明专利

JP2013148254A Air-conditioning apparatus, and method for controlling air conditioning 有权
标题翻译：空调设备和控制空调的方法
公开(公告)号：JP2013148254A
公开(公告)日：2013-08-01
申请号：JP2012008469
申请日：2012-01-18
申请人： Toshiba Corp , 株式会社東芝
发明人： HONDA MAKOTO , MORIMOTO HIROYUKI , SATO KAZUHIDE , OTANI HIDEYOSHI , KINOSHITA TOMOYUKI , MURAYAMA MASARU , TAKAGI YASUO
IPC分类号： F24F11/02 , F24F3/14
CPC分类号： H05K7/20709 , F24F1/0007 , F24F3/14 , F24F11/0001 , F24F2001/0051 , F24F2011/0002 , F24F2011/0006 , H05K7/20745 , H05K7/20836
摘要： PROBLEM TO BE SOLVED: To provide an air-conditioning apparatus and a method for controlling air conditioning, high in an energy-saving effect and efficiency.SOLUTION: An air-conditioning apparatus includes: a return air duct for passage of return air which is an air conditioning control object; an indoor unit for introducing at least one of outside air and return air and ejecting the air as air supply to the air conditioning control object; and an air conditioning control section. The indoor unit includes: a first space that has an outside air introducing device for introducing outside air, and a cooler; and a second space that has a return air introducing device for introducing return air from the air conditioning control object. When the air conditioning control section determines that air conditioning control is required for the air conditioning control object, outside air is introduced into the first space via the outside air introducing device, and at least one of cooling and dehumidification is performed by the cooler in the first space to obtain treated outside air. Further, return air is introduced into the second space via the return air introducing device, and the treated outside air and the return air are mixed in the second space and ejected as air supply to the air conditioning control object.
摘要翻译：要解决的问题：提供一种空调装置和空调控制方法，节能效果高，效率高。一种空调装置，包括：返回空气通道，其为回风，空调控制对象; 用于引入外部空气和回流空气中的至少一个并将空气作为空气供给到空调控制对象的室内单元; 和空调控制部。室内机包括：第一空间，具有用于引入外部空气的外部空气引入装置和冷却器; 以及第二空间，其具有用于从空调控制对象引入回流空气的返回空气导入装置。当空调控制部判定为空调控制对象需要空调控制时，外部空气经由外部空气导入装置被引入到第一空间，并且冷却器中的至少一个通过外部空气导入装置进行，获得处理外部空气的第一个空间。此外，返回空气经由回流空气导入装置被引入第二空间，并且经处理的外部空气和回流空气在第二空间中混合并作为空气供给被排出到空调控制对象。

3. 发明专利

JP2013030027A Module and modular data center 审中-公开
标题翻译：模块和模块化数据中心
公开(公告)号：JP2013030027A
公开(公告)日：2013-02-07
申请号：JP2011166089
申请日：2011-07-28
申请人： Toshiba Corp , 株式会社東芝
发明人： OTANI HIDEYOSHI , SATO KAZUHIDE , HONDA MAKOTO , HASHIMOTO KOICHI , KINOSHITA TOMOYUKI , YAMAMOTO MASATERU , TAKAHASHI YASUFUMI , MORIMOTO HIROYUKI
IPC分类号： G06F1/20 , F24F3/044 , G06F1/16 , H05K7/20
CPC分类号： F24F3/044 , H05K7/1497 , H05K7/20745
摘要： PROBLEM TO BE SOLVED: To provide a module and a modular data center with high durability which can cope with a shake by an earthquake and a shake by a wave in the case of being installed on the sea.SOLUTION: A module and a modular data center include a housing, a cooled medium installed at a first position in the housing, and a curtain which is fixed at least one point to the cooled medium or the housing, and extends or contracts according to a change of the cooled medium from the first position to divided the inside of the housing.
摘要翻译：要解决的问题：提供具有高耐久性的模块和模块化数据中心，其可以在安装在海上的情况下通过地震和波浪来应对震动。解决方案：模块和模块化数据中心包括壳体，安装在壳体中的第一位置的冷却介质，以及至少固定在冷却介质或壳体上的一个窗帘，并延伸或收缩根据冷却的介质从第一位置到壳体内部的变化。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2007018773A Illumination control device, illumination system and method 审中-公开
标题翻译：照明控制装置，照明系统和方法
公开(公告)号：JP2007018773A
公开(公告)日：2007-01-25
申请号：JP2005196630
申请日：2005-07-05
申请人： Toshiba Corp , Toshiba Solutions Corp , 東芝ソリューション株式会社 , 株式会社東芝
发明人： UENO HIDEKI , SUZUKI KATSUNOBU , FUSHIYA NOBUHIRO , ORIHARA CHIE , HISHIKI TAIGA , AOKI HISASHI , SUZUKI KAZUHIRO , MASAOKA TOSHIHIKO , SATO KAZUHIDE , SUZUKI SATOSHI , EHATA SUSUMU
IPC分类号： H05B37/02
CPC分类号： Y02B20/44
摘要： PROBLEM TO BE SOLVED: To provide an illumination control device and an illumination system capable of providing not only simple turning-on or off of illumination but also various illumination forms. SOLUTION: Each lighting system 1 has a sensor 12 for detecting a person and has a function for executing illumination control following movement of a passenger. A server 4 causes the respective lighting systems 1 connected to one another via a network to link to one another and to execute illumination control, whereby this illumination system capable of providing various illumination forms can be constructed. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种照明控制装置和照明系统，其不仅能够提供照明的简单的接通或关闭，还可以提供各种照明形式。解决方案：每个照明系统1具有用于检测人的传感器12，并且具有在乘客移动之后执行照明控制的功能。服务器4使得经由网络彼此连接的各个照明系统1彼此链接并执行照明控制，从而可以构建能够提供各种照明形式的该照明系统。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2001084239A METHOD FOR ANALYZING AND PREDICTING MERCHANDISE SALES QUANTITY, METHOD FOR DECIDING MERCHANDISE ORDER QUANTITY AND STORAGE MEDIUM WITH PROGRAM STORED THEREIN 失效
公开(公告)号：JP2001084239A
公开(公告)日：2001-03-30
申请号：JP25888199
申请日：1999-09-13
申请人： TOSHIBA CORP
发明人： WASEDA HIROSHI , SAKAI HIROSHI , KAKIMOTO MITSURU , NAKAMURA SADAO , KAWAKITA JUNPEI , SATO KAZUHIDE
IPC分类号： G07G1/12 , G06F17/00 , G06Q10/04 , G06Q30/06 , G06Q50/00 , G06Q50/10
摘要： PROBLEM TO BE SOLVED: To obtain accurate sales quantity even though there is stockout. SOLUTION: This analyzing method is provided with a time series data generation step 10, in which the sales quantity of a merchandise group A accumulated by every prescribed time interval within a time band on the basis of each sales time data and the existence/absence of stockout of all the group A decided on the basis of the inventory quantity of each merchandise by each time interval as time series data from the start time to end time of the time band, and a time series data clustering step 11, in which distance between two pieces of time series data X and Y is clustered with respect to difference in sales quantity for time intervals, when the stockout of the group A does not exit with respect to a set of time series data generated in the time series data generation step by each of a plurality of time bands is clustered, and a representative pattern of the sales quantity of all of the group A and a date, when each time series data belonging to the representative pattern is generated are outputted.

6. 发明专利

JP2002024736A METHOD FOR PROVIDING TV COMMERCE PAYMENT EXECUTION SERVICE, SYSTEM THEREFOR, STORAGE MEDIUM FOR STORING PROGRAM USED TEHREFOR, AND COMPUTER 失效
公开(公告)号：JP2002024736A
公开(公告)日：2002-01-25
申请号：JP2000200035
申请日：2000-06-30
申请人： TOSHIBA CORP , TOSHIBA ENGINEERING CO
发明人： AOTA KENJI , MITSUI TAKAHIRO , SATO KAZUHIDE , AZUMA HIROSHI , NISHIKAWA YUKINOBU
IPC分类号： G07F7/08 , G06Q10/00 , G06Q20/00 , G06Q20/16 , G06Q20/26 , G06Q30/06 , G06Q50/00 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide a TV commerce settlement execution service as a digital broadcasting applied technique allowing the expansion from the needs of both an entrepreneur and a consumer to a business while utilizing the advantage of digitalization of TV broadcasting to the maximum. SOLUTION: This method and system for providing a TV commerce payment execution service is executed by a network system NS having a server 1. The server 1 performs the execution of a program 40 on a storage medium 6a and the retrieval and reference of a database 50 by the processing of a CPU 40, thereby receiving a user's request of a payment by debit card using the cash card of the user's financial institution account, from a TV terminal 21 of digital broadcasting, in addition to the order from the user to the commodity and service of a content providing company B1 broadcasted in the program, and pays the price from the user's financial institute account on the basis of the requested payment by debit card.

7. 发明专利

JPS62256446A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62256446A
公开(公告)日：1987-11-09
申请号：JP9970686
申请日：1986-04-30
申请人： TOSHIBA CORP
发明人： SATO KAZUHIDE
IPC分类号： H01L21/60
摘要： PURPOSE:To reduce the cost of a carrier tape and obtain parallelism by means of a bonding machine easily by a method wherein conductive paste is attached to the front surfaces of bumps formed on the top surface of a semiconductor chip or to the rear surfaces of base ends of leads, and the bumps and the leads are bonded together by the adhesive force of the conductive paste. CONSTITUTION:Pads 2 made of conductive material such as aluminum are formed on both side edges on the top surface of a semiconductor chip 1 and three-layer bimetals composed of chrome/steel/gold or titanium/tungsten/gold are evaporated on the pads 2 and gold plating is applied to the bimetals to form bumps 3. Conductive paste layers 5 made of conductive paste which is usually used in semiconductor devices are provided between the front surfaces of the bumps 3 and the rear surfaces of the base ends if leads 4 and the bumps 3 and the leads 4 are bonded together by the conductive paste layer 5. With this constitution, bonding at the lower temperature and under the lower load can be realized and creation of bonding strain can be fully suppressed by the viscosity of the conductive paste and the alignment can be performed easily.

8. 发明专利

JPS62176138A WIRE BONDING DEVICE 失效
公开(公告)号：JPS62176138A
公开(公告)日：1987-08-01
申请号：JP1736686
申请日：1986-01-29
申请人： TOSHIBA CORP
发明人： SATO KAZUHIDE
IPC分类号： H01L21/60 , B23K20/00 , H01L21/00
摘要： PURPOSE:To improve a bonding speed, to implement high density and to extend the life of a device, by passing a plurality of bonding wires through a capillary, and simultaneously bonding a plurality of the wires. CONSTITUTION:A capillary 6' has two through holes 7a and 7b. Bonding wires 5a and 5b are made to pass through the holes 7a and 7b. It is designed that the distance between the centers of both through holes, i.e., a pitch P, is equal to a bonding pad pitch on a semiconductor pellet and an inner lead pitch. When the bonding wires are compressed and connected on a bonding pad 3, the two neighboring pieces of the bonding wires 5a and 5b are simultaneously supplied. The two pieces of the wires are simultaneously compressed and connected with a tip part 8'. Therefore, two spools (not shown in the Figure) are constituted in the capillary 6' so that the two pieces of the bonding wires are supplied at the same timing.

9. 发明专利

JPS61274333A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61274333A
公开(公告)日：1986-12-04
申请号：JP11568285
申请日：1985-05-29
申请人： TOSHIBA CORP
发明人： SATO KAZUHIDE , SAKURAI HISAHARU , IKEBE KIMIHIRO
IPC分类号： H01L23/50 , H01L21/60 , H01L23/13 , H01L23/495 , H01L23/498
摘要： PURPOSE:To enable the firm connection and to eliminate the possibility of short or the like by providing an intermediate lead formed on an insulating substrate more thinly than the lead, one end of which is bonded to a semiconductor chip through a bump and another end of which is connected to a lead. CONSTITUTION:A semiconductor chip 4' is directed downward and it is connected to the lower plane of internal end of a lead 3' corresponding to its electrode through an intermediate lead 12. On the electrode of the semiconductor chip 4' or on the internal end of the intermediate lead 12, a projection (bump) 13 of 20 of 50mum thickness is formed by a partly gold-plating technique, etc. and the corresponding parts are bonded to each other by heat-pressure bonding. Meanwhile, an external end of the intermediate lead 12 and an internal end of the lead 13' can be bonded by any technique such as heat-pressure bonding, soldering, and laser welding. After the connection using the intermediate lead 12, the whole device is sealed with a sealing resin 6 consisting of a heat-curable resin such as epoxy resin and the semiconductor device is completed.

10. 发明专利

JPS61114541A Wire-bonding 失效
标题翻译：电线连接
公开(公告)号：JPS61114541A
公开(公告)日：1986-06-02
申请号：JP23616584
申请日：1984-11-09
申请人： Toshiba Corp
发明人： SATO KAZUHIDE
IPC分类号： H01L21/60
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/48 , H01L2224/48225 , H01L2224/48227 , H01L2224/48463 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85148 , H01L2224/8518 , H01L2224/85375 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/00014 , H01L2224/05556 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To speed up a speed of wire-bonding into a higher speed by a method wherein, after the level of the point of the tool exceeds the level of the surface of the electrode part of a semiconductor pellet, the search speed during a period of time, through which the tool reaches a level to be made to sink in the electrode part, is made into a variable speed. CONSTITUTION:The tool is made to descend at a high speed as indicated by a curve (a) before the capillary 3 and the ball 4 of the point of the tool come to the vinicity of the electrode part 2 of a pellet 1. As the point of the tool approaches the electrode 2, the search speed is turned into a low speed [curve (b)]. The point of the tool reaches the oxide coated film 5 of the electrode 2 and immediately before the ball 4 breaks through the coated film 5, that is, when the height of the tool becomes the level l2, the descending speed of the tool is made to slow down to the search speed or less [curve (c)], and the tool is made to sink in the coated film 5 at this speed and is made to descend to the level l1. By this way, the impact to be inflicted on the electrode part 2 by the ball 4 when the coated film 5 is broken through can be lessened. As a result, a higher-speed operation of wire-bonding can be contrived without making a crack in the pellet generate.
摘要翻译：目的：通过以下方法将线接合速度加快到更高的速度：在刀具的点的高度超过半导体芯片的电极部分的表面的水平之后，期间的搜索速度的时间，通过该时间，工具达到要在电极部分中沉降的水平，被制成可变速度。构成：使工具在毛细管3之前以曲线（a）所示的高速下降，并且工具点的球4达到丸粒1的电极部分2的长度。作为点的位置接近电极2，搜索速度变为低速[曲线（b）]。该工具的点到达电极2的氧化物被膜5，并且在球4突破涂膜5之前，即当刀具的高度达到水平l2时，刀具的下降速度减速到搜索速度或较少[曲线（c）]，并且使工具以这种速度下沉到涂膜5中，并使其下降到水平l1。通过这种方式，可以减少当涂覆膜5破裂时由球4对电极部分2造成的冲击。结果，可以在不产生颗粒的裂纹的情况下进行更高速的引线接合操作。

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