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1. 发明专利

JP2012212417A Semiconductor memory card 审中-公开
标题翻译：半导体存储卡
公开(公告)号：JP2012212417A
公开(公告)日：2012-11-01
申请号：JP2011242191
申请日：2011-11-04
申请人： Toshiba Corp , 株式会社東芝
发明人： DOI KAZUHIDE , OKUMURA NAOHISA , NISHIYAMA TAKU , WATANABE KATSUYOSHI , IKUTA TAKESHI
IPC分类号： G06K19/077 , H01L25/04 , H01L25/18
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L24/48 , H01L25/16 , H01L25/18 , H01L2224/451 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2225/06506 , H01L2924/00014 , H01L2924/01021 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor memory card that achieves a reduction in cost by using a lead frame and further enhances forming properties of a circuit of a semiconductor chip.SOLUTION: A semiconductor memory card 51 comprises: a lead frame 2 provided with an external connection terminal 3, a lead portion 4, chip component mounting sections 5A through 5C and a semiconductor chip mounting section 6; chip components 7A through 7D mounted on the chip component mounting section 5A through 5C; and a controller chip 8 and a memory chip 9 disposed on the semiconductor chip mounting section 6. A re-wiring layer 56 is formed on a surface of the memory chip 9. The lead frame 2 is sealed with resin. An electrical circuit of the controller chip 8 or the memory chip 9 on the lead frame 2 is constituted of the lead portion 4, the re-wiring layer 56 and metal wires 52 and 58.
摘要翻译：解决的问题：提供一种通过使用引线框架来实现成本降低的半导体存储卡，并且进一步提高半导体芯片的电路的成形性能。解决方案：半导体存储卡51包括：设置有外部连接端子3的引线框架2，引线部分4，芯片部件安装部分5A至5C和半导体芯片安装部分6; 安装在芯片部件安装部5A〜5C上的芯片部件7A〜7D; 以及设置在半导体芯片安装部分6上的控制器芯片8和存储器芯片9.在存储芯片9的表面上形成再布线层56.引线框架2用树脂密封。引线框架2上的控制器芯片8或存储芯片9的电路由引线部分4，再布线层56和金属线52和58构成。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011096131A Semiconductor storage device 有权
标题翻译：半导体存储设备
公开(公告)号：JP2011096131A
公开(公告)日：2011-05-12
申请号：JP2009251283
申请日：2009-10-30
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIYAMA TAKU
IPC分类号： G06K19/077 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： G06K19/07732 , H01L24/73 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/30107 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high-performance semiconductor storage device which can be efficiently produced.
SOLUTION: A circuit board 11 has a column of a plurality of external connection terminals 3 on a first side, and a memory chip and a controller chip are mounted on a second side. The column of a connection pad 15 is disposed outside the edge of the external connection terminal of the memory chip on the second side and connected to the controller chip. The column of a resistance element 22 is arranged on the opposite side of the memory chip on the column of the connection pad and connected to the connection pad at one end. A plug 32 is provided near outside of the edge of the memory chip of the external connection terminal and penetrates through the first and second sides. A first wiring 31 is provided on the second side, is connected to the other end of the resistance element at one end, and is connected to a portion of the first side of a plug at the other end through outside of the column of the resistance element and outside of the column of the connection pad. A second wiring 33 is provided on the second side and connects the plug and the external connection terminal.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供可以有效地制造的高性能半导体存储装置。解决方案：电路板11具有在第一侧上的多个外部连接端子3的列，并且存储芯片和控制器芯片安装在第二侧上。连接焊盘15的列设置在第二侧的存储芯片的外部连接端子的边缘的外侧，并连接到控制器芯片。电阻元件22的列布置在连接焊盘的列上的存储芯片的相对侧上，并在一端连接到连接焊盘。插头32设置在外部连接端子的存储芯片的边缘附近，并穿过第一和第二侧。第一配线31设置在第二侧，一端连接到电阻元件的另一端，另一端通过电阻柱的外部连接到插头的第一侧的一部分元件和连接垫的列之外。第二配线33设置在第二侧，并连接插头和外部连接端子。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2012053554A Semiconductor storage 有权
标题翻译：半导体存储
公开(公告)号：JP2012053554A
公开(公告)日：2012-03-15
申请号：JP2010194089
申请日：2010-08-31
申请人： Toshiba Corp , 株式会社東芝
发明人： ASADA JUNICHI , NISHIYAMA TAKU , SEKI ATSUKO
IPC分类号： G06K19/077 , B42D15/10 , H01L21/56 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49558 , H01L23/49575 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L25/0655 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/49171 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1434 , H01L2924/1438 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor storage with which the number of parts or the manufacturing cost can be reduced by making a resin mold part exposed to outside.SOLUTION: A semiconductor storage 10 according to an embodiment is a semiconductor storage which is obtained by molding of a semiconductor memory chip 15 by a resin mold part 18. The semiconductor storage has a plate 21 on which the semiconductor memory chip is put by molded with the resin mold part and an external connecting terminal 19 to be exposed to the outer circumference surface of the semiconductor storage. The plate has a plurality of exposure parts 21b to be exposed to the outer circumference surface of the resin mold part. The plurality of exposure parts are electrically isolated from each other within the resin mold part.
摘要翻译：要解决的问题：提供一种半导体存储器，通过使树脂模具部件暴露于外部，能够减少部件数量或制造成本。解决方案：根据实施例的半导体存储器10是通过用树脂模制部件18模制半导体存储器芯片15而获得的半导体存储器。半导体存储器具有放置半导体存储器芯片的板21 通过与树脂模具部件模制并且暴露于半导体存储器的外周表面的外部连接端子19。板具有多个暴露于树脂模具部的外周面的曝光部21b。多个曝光部在树脂模具部内彼此电隔离。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011129894A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2011129894A
公开(公告)日：2011-06-30
申请号：JP2010251942
申请日：2010-11-10
申请人： Toshiba Corp , 株式会社東芝
发明人： OKUMURA NAOHISA , NISHIYAMA TAKU
IPC分类号： H01L25/065 , H01L23/12 , H01L25/00 , H01L25/07 , H01L25/18
CPC分类号： H01L24/48 , H01L23/3128 , H01L23/5389 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/32145 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/484 , H01L2224/48599 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device such as a solid-state drive (SSD) that can be loaded to a compact module like a mobile phone. SOLUTION: The semiconductor device includes a base board 1, a memory chip 11, a controller chip 12, and a plurality of passive elements 8. The base board 1 has a bonding pad 16. The memory chip 11 is provided on the base board 1 and is connected to the bonding pad 16 with a wire to electrically store data. The controller chip 12 is provided in a memory area MA including the memory chip 11 for a direction toward the base board 1 from the memory chip 11 in order to control operations of the memory chip 11. The plurality of passive elements 8 are provided in the memory areas MA, respectively. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供可以加载到诸如移动电话的紧凑模块的诸如固态驱动器（SSD）的半导体器件。解决方案：半导体器件包括基板1，存储芯片11，控制器芯片12和多个无源元件8.基板1具有接合焊盘16.存储芯片11设置在基板1并且用导线连接到焊盘16以电存储数据。为了控制存储芯片11的动作，控制器芯片12设置在包含存储芯片11的存储芯片11的存储区域MA中，用于从存储芯片11向基板1的方向。多个无源元件8设置在记忆区域MA。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010109206A Semiconductor memory card 有权
标题翻译：半导体存储卡
公开(公告)号：JP2010109206A
公开(公告)日：2010-05-13
申请号：JP2008280713
申请日：2008-10-31
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIYAMA TAKU , OKUMURA NAOHISA , OKADA KIYOKAZU
IPC分类号： H01L25/065 , G06K19/077 , H01L25/07 , H01L25/18
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/115 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor memory card with an increased number of memory elements mounted on a wiring board while assuring the connection between the wiring board and the memory elements with the increased number of electrodes. SOLUTION: The semiconductor memory card 1 includes a wiring board 2 having a first pad region 10A along a first long side 5A and a second pad region 10B along a second long side 5B. On the wiring board 2, first memory elements 11 for constituting a first element group 13 are stacked stepwise. On the first element group 13, second memory elements 12 for constituting a second element group 14 are stacked stepwise toward the reverse direction. The electrode pad 16 of the first memory element 11 is connected to a connection pad 9 arranged in the first pad region 10A. The electrode pad 19 of the second memory element 12 is connected to the connection pad 9 arranged in the second pad region 10B. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种半导体存储卡，其具有安装在布线板上的增加数量的存储元件，同时确保布线板和存储元件之间的连接增加了电极数量。解决方案：半导体存储卡1包括具有沿第一长边5A的第一焊盘区域10A和沿着第二长边5B的第二焊盘区域10B的布线板2。在布线基板2上，构成第一元件组13的第一存储元件11层叠。在第一元件组13上，用于构成第二元件组14的第二存储元件12朝向相反方向逐级堆叠。第一存储元件11的电极焊盘16连接到布置在第一焊盘区域10A中的连接焊盘9。第二存储元件12的电极焊盘19连接到布置在第二焊盘区域10B中的连接焊盘9。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2014056370A Semiconductor memory card 有权
标题翻译：半导体存储卡
公开(公告)号：JP2014056370A
公开(公告)日：2014-03-27
申请号：JP2012200159
申请日：2012-09-12
申请人： Toshiba Corp , 株式会社東芝
发明人： DOI KAZUHIDE , HONMA SOICHI , WATANABE KATSUYOSHI , NISHIYAMA TAKU , IKUTA TAKESHI , OKUMURA NAOHISA
IPC分类号： G06K19/077 , B42D25/305
CPC分类号： H01L23/495 , G06K19/07732 , H01L21/0201 , H01L23/3107 , H01L23/49551 , H01L23/49558 , H01L23/49575 , H01L23/49589 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/01029 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor memory card that improves an exposure property of an external connection terminal after achieving a reduction in costs by using a lead frame.SOLUTION: A semiconductor memory card 1 according to an embodiment includes: a lead frame 2 provided with an external connection terminal 3, a lead part 4, a chip component mounting part 5 and a semiconductor chip mounting part 6; a chip component 7 mounted on the chip component mounting part 5; and a controller chip 8 and a memory chip 9 mounted on the semiconductor chip mounting part 6. The lead frame 2 is sealed with resin. A sealing resin layer 10 has a recessed part 15 provided on a first plane 10a so as to surround a circumference of the external connection terminal 3 while exposing a surface of the external connection terminal 3 and a portion of a side face.
摘要翻译：要解决的问题：提供一种半导体存储卡，其通过使用引线框在实现成本降低之后提高外部连接终端的曝光特性。解决方案：根据实施例的半导体存储卡1包括：引线框架2 设置有外部连接端子3，引线部4，芯片部件安装部5和半导体芯片安装部6; 安装在芯片部件安装部5上的芯片部件7; 以及安装在半导体芯片安装部分6上的控制器芯片8和存储芯片9.引线框架2用树脂密封。密封树脂层10具有设置在第一平面10a上的凹部15，以便在暴露外部连接端子3的表面和侧面的一部分的同时围绕外部连接端子3的周围。

7. 发明专利

JP2012015185A Semiconductor storage device 有权
标题翻译：半导体存储设备
公开(公告)号：JP2012015185A
公开(公告)日：2012-01-19
申请号：JP2010147869
申请日：2010-06-29
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHII HITOSHI , OKUMURA NAOHISA , NISHIYAMA TAKU
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/49855 , H01L23/49861 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/01079 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor storage device which reduces manufacturing cost by reducing an used amount of an organic substrate.SOLUTION: The semiconductor storage device 10 comprises an organic substrate 11 provided with an external connection terminal 19 on one face and a semiconductor memory chip 15 thereby enabling the semiconductor storage device 10 to be inserted into an external device. The semiconductor storage device 10 further comprises a lead frame 13 and a resin mold part 18. The lead frame has a mount part 21 on which the semiconductor memory chip 15 is mounted and an adhesive part 22 formed to extend from the mount part 21 in an insertion direction to the external device and adhered to the other face of the organic substrate 11. The organic substrate 11 is singulated into a shape, viewed from above, substantially not overlapping the mount part 21. An end part in the insertion direction of the adhesive part 22 is formed in the resin mold part 18. The lead frame 13 further has first extension part 13b formed on the adhesive part 22 to extend to face regions of the resin mold part 18 other than a face region of the resin mold part 18 on the insertion direction side.
摘要翻译：解决的问题：提供一种通过减少有机基板的使用量来降低制造成本的半导体存储装置。解决方案：半导体存储装置10包括在一个面上设置有外部连接端子19的有机基板11和半导体存储芯片15，从而使半导体存储装置10能够插入到外部装置中。半导体存储装置10还包括引线框架13和树脂模具部分18.引线框架具有安装部分21，半导体存储芯片15安装在该安装部分21上，并且形成为从安装部分21延伸的粘合部分22 插入到外部装置的方向并粘附到有机基板11的另一面。有机基板11从上方观察到基本上不与安装部21重叠的形状。粘合剂的插入方向的端部部分22形成在树脂模制部分18中。引线框架13还具有形成在粘合部分22上的第一延伸部分13b，以延伸到除了树脂模制部件18的面部区域之外的树脂模制部件18的面对区域插入方向侧。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2009259207A Semiconductor memory card, and semiconductor memory device used therefor 有权
标题翻译：半导体存储卡及其使用的半导体存储器件
公开(公告)号：JP2009259207A
公开(公告)日：2009-11-05
申请号：JP2008315489
申请日：2008-12-11
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIYAMA TAKU , YAMAMOTO TETSUYA , OKUMURA NAOHISA , FUTAYAMA TAKUYA
IPC分类号： G06K19/077
CPC分类号： H01L23/5388 , H01L23/50 , H01L24/45 , H01L24/48 , H01L25/18 , H01L2224/05554 , H01L2224/32145 , H01L2224/451 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To enlarge a size of a memory device mounted on a wiring board for a memory card, while securing connection between the wiring board and the memory device. SOLUTION: This semiconductor memory card 1t is provided with the wiring board 2 having an outer shape provided with a cut-out part 6 in the first long side 5A. The second face 2b of the wiring board 2 has a connection pad 10 arranged along a portion excepting the cut-out part 6 in the first long side 5A. The memory device 12 is mounted on the second face 2b of the wiring board 2. The memory device 12 has an electrode pad 13 arrayed shiftedly to correspond to an arrangement position of the connection pad 10, along a long side 12a positioned in the vicinity of the first long side 5A of the wiring board 2. A controller device 18 is layered on the memory device 12. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了扩大安装在存储卡的布线板上的存储装置的尺寸，同时确保布线板和存储装置之间的连接。解决方案：该半导体存储卡1t设置有在第一长边5A中具有切口部分6的外形的布线板2。布线基板2的第二面2b具有沿第一长边侧5A的切口部6以外的部分配置的连接垫10。存储器件12安装在布线板2的第二面2b上。存储器件12具有电极焊盘13，该电极焊盘13沿着位于连接焊盘10附近的长边12a 布线板2的第一长边5A。控制器装置18层叠在存储装置12上。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009158738A Semiconductor device and semiconductor memory device 有权
标题翻译：半导体器件和半导体存储器件
公开(公告)号：JP2009158738A
公开(公告)日：2009-07-16
申请号：JP2007335665
申请日：2007-12-27
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIYAMA TAKU , YAMAMOTO TETSUYA
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/01037 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To prevent contact of a metal wire between element groups in a semiconductor device where semiconductor elements are arranged in multistage on a wiring board.
SOLUTION: A plurality of semiconductor elements 9A-9D constituting a first element group 12 are stacked stepwise on a wiring board 2 while directing the pad arrangement sides toward the same direction. On the first element group 12, a plurality of semiconductor elements 9E-9H constituting a second element group 13 are stacked stepwise to expose electrode pads 11 while directing the pad arrangement sides toward the same direction as that of the first element group. The second element group 13 is arranged while being shifted from the first element group 12 in the arrangement direction of the electrode pads 11. Each semiconductor element 9 is electrically connected with the connection pad 7 of the wiring board 2 through a metal wire 14.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止半导体元件中的元件组之间的金属线接触，其中半导体元件被布置在布线板上的多级中。解决方案：构成第一元件组12的多个半导体元件9A-9D分层地叠置在布线板2上，同时将焊盘配置侧朝向相同的方向。在第一元件组12上，构成第二元件组13的多个半导体元件9E-9H被逐层堆叠，以使焊盘排列侧朝与第一元件组的方向相同的方向露出电极焊盘11。第二元件组13沿着电极焊盘11的排列方向从第一元件组12移位而布置。每个半导体元件9通过金属线14与布线板2的连接焊盘7电连接。 P>版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2013182291A Semiconductor memory card 有权
标题翻译：半导体存储卡
公开(公告)号：JP2013182291A
公开(公告)日：2013-09-12
申请号：JP2012043680
申请日：2012-02-29
申请人： Toshiba Corp , 株式会社東芝
发明人： INAGAKI HIROSHI , KAWAMURA HIDEKI , OKADA TAKASHI , NISHIYAMA TAKU
IPC分类号： G06K19/077 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor memory card for shortening wiring length from an external connection terminal to a controller chip.SOLUTION: A semiconductor memory card includes a semiconductor storage device 11 with an SiP structure having a memory chip 24 disposed on a wiring board 12, a controller chip 29 laminated on the memory chip 24 and a sealing resin layer. Electrode pads 301 of the controller chip 29 to be electrically connected to external connection terminals are arrayed in parallel with the array direction of the external connection terminals, and along the outer shape side of the controller chip 29 positioned at a first outer shape side S1 side of the wiring board 12 on which the external connection terminals are arrayed so as to be positioned in a terminal correspondence area X1 on a second face 12b of the wiring board 12.
摘要翻译：要解决的问题：提供一种用于缩短从外部连接端子到控制器芯片的布线长度的半导体存储卡。解决方案：半导体存储卡包括具有SiP结构的半导体存储装置11，其具有布置在布线上的存储芯片24 板12，层叠在存储芯片24上的控制芯片29和密封树脂层。与外部连接端子电连接的控制器芯片29的电极焊盘301与外部连接端子的排列方向平行地排列，并且沿着位于第一外部形状侧S1侧的控制器芯片29的外形侧布线基板12的外部连接端子排列在布线基板12的第二面12b上的端子对应区域X1内。

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