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    • 2. 发明专利
    • Power converting circuit
    • 电源转换电路
    • JP2007329509A
    • 2007-12-20
    • JP2007229208
    • 2007-09-04
    • Toshiba Corp株式会社東芝
    • HAGIWARA KEIZOKIMURA TOYOJIKOBAYASHI RYUICHI
    • H01L25/07H01L25/18H02M7/00
    • PROBLEM TO BE SOLVED: To actualize, inexpensively, a power converting circuit in accordance with the required capacitance using a plurality of resin-molded semiconductor module units. SOLUTION: The semiconductor module 101 is made to have a structure that a rectangular parallelepiped resin mold 10 is formed by mounting and resin-molding a switching element and a free wheel diode as the principal circuit elements on the common substrate, a first principal circuit terminal 3 and a second principal circuit terminal 4 of the switching element are protruded in one side surface of the resin mold part to the directions perpendicular to the side surface. The M phase power converting circuit 410 having the required capacity is configured by arranging the semiconductor modules 101 in a formation comprising M colums × N rows. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了实现廉价地使用多个树脂模制半导体模块单元根据所需电容的功率转换电路。 解决方案:半导体模块101具有通过将开关元件和续流二极管作为主电路元件安装在树脂上而形成的长方体形的树脂模具10,第一 开关元件的主电路端子3和第二主电路端子4在树脂模具部件的一个侧表面中垂直于侧表面的方向突出。 具有所需容量的M相功率转换电路410通过将半导体模块101布置成包括M列×N行的形式来配置。 版权所有(C)2008,JPO&INPIT