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    • 5. 发明授权
    • Method of treating depression with certain triazine derivatives
    • 用某些三嗪衍生物治疗抑郁症的方法
    • US5789407A
    • 1998-08-04
    • US424397
    • 1995-04-25
    • Fumio SuzukiNobuaki KoikeJunichi ShimadaShigeto KitamuraShunji IchikawaJoji NakamuraShizuo Shiozaki
    • Fumio SuzukiNobuaki KoikeJunichi ShimadaShigeto KitamuraShunji IchikawaJoji NakamuraShizuo Shiozaki
    • A61K31/53C07D487/04A61K31/535
    • C07D487/04A61K31/53
    • The present invention relates to an antidepressant containing as an active ingredient a triazine derivative or a pharmaceutically acceptable salt thereof, the derivative being represented by the following Formula (I): ##STR1## in which, R.sup.1 represents hydrogen, substituted or unsubstituted lower alkyl, or substituted or unsubstituted lower alkanoyl; R.sup.2 represents hydrogen, substituted or unsubstituted lower alkyl, substituted or unsubstituted lower alkenyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, or a substituted or unsubstituted heterocyclic group; R.sup.3 represents a substituted or unsubstituted heterocyclic group; X represents a single bond, O, S, S(O), S(O).sub.2, or NR.sup.4 (in which R.sup.4 represents hydrogen, or substituted or unsubstituted lower alkyl; or R.sup.2 and NR.sup.4 are combined to form a substituted or unsubstituted 4 to 6-membered saturated heterocyclic group); and A represents N or CR.sup.5 (in which R.sup.5 represents hydrogen, or substituted or unsubstituted lower alkyl).
    • PCT No.PCT / JP94 / 01455 Sec。 371日期1995年04月25日 102(e)日期1995年4月25日PCT 1994年9月2日PCT公布。 公开号WO95 / 07282 日期:1995年3月16日本发明涉及含有作为活性成分的三嗪衍生物或其药学上可接受的盐的抗抑郁药,该衍生物由下式(I)表示:其中,R 1表示 氢,取代或未取代的低级烷基或取代或未取代的低级烷酰基; R 2表示氢,取代或未取代的低级烷基,取代或未取代的低级烯基,取代或未取代的环烷基,取代或未取代的芳基,取代或未取代的芳烷基或取代或未取代的杂环基; R3表示取代或未取代的杂环基; X表示单键,O,S,S(O),S(O)2或NR4(其中R4表示氢或取代或未取代的低级烷基;或R2和NR4组合形成取代或未取代的4 至6元饱和杂环基); A表示N或CR5(其中R5表示氢或取代或未取代的低级烷基)。
    • 6. 发明授权
    • Acceleration sensor chip package
    • 加速度传感器芯片封装
    • US07938005B2
    • 2011-05-10
    • US12607407
    • 2009-10-28
    • Shunji Ichikawa
    • Shunji Ichikawa
    • G01P15/08
    • G01P1/023G01P15/123H01L2224/48091H01L2224/48465H01L2224/49175H01L2224/73265H01L2924/10253H01L2924/1461H01L2924/00014H01L2924/00
    • An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
    • 加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基材。 加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。 再布线层具有连接到电极焊盘的布线部分。 电极焊盘电连接到导电凸块。 传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。 外部端子连接到布线部分并且设置在外部区域中。 密封部密封传感器控制芯片,电极焊盘和再布线层,使得可移动结构是可移动的。 衬底附接到加速度传感器芯片以密封开口部分。