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    • 3. 发明申请
    • ACCELERATION SENSOR CHIP PACKAGE
    • 加速传感器芯片包装
    • US20100043553A1
    • 2010-02-25
    • US12607407
    • 2009-10-28
    • Shunji ICHIKAWA
    • Shunji ICHIKAWA
    • G01P15/12
    • G01P1/023G01P15/123H01L2224/48091H01L2224/48465H01L2224/49175H01L2224/73265H01L2924/10253H01L2924/1461H01L2924/00014H01L2924/00
    • An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
    • 加速度传感器芯片封装包括加速度传感器芯片; 传感器控制芯片; 重新布线层; 外部终端; 密封部分; 和基材。 加速度传感器芯片包括框架部分; 可移动结构; 检测元件; 和电极垫。 再布线层具有连接到电极焊盘的布线部分。 电极焊盘电连接到导电凸块。 传感器控制芯片具有电连接到导电凸块的传感器控制电极焊盘。 外部端子连接到布线部分并且设置在外部区域中。 密封部密封传感器控制芯片,电极焊盘和再布线层,使得可移动结构是可移动的。 衬底附接到加速度传感器芯片以密封开口部分。