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1. 发明专利

JP2012144727A Adhesive tape for manufacturing electronic component 审中-公开
标题翻译：胶带用于制造电子元件
公开(公告)号：JP2012144727A
公开(公告)日：2012-08-02
申请号：JP2012004095
申请日：2012-01-12
申请人： Toray Advanced Materials Korea Inc , トレイアドバーンストマテリアルズコリアインコーポレイティッド
发明人： IM MIN-HO , KIM SANG PILL , MOON KI-JEONG , SIM CHANG-HOON , CHOI SUNG-HWAN
IPC分类号： C09J7/00 , B32B27/00 , C09J11/06 , C09J133/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for manufacturing an electronic component, which satisfies conditions and characteristics required in a manufacturing process of a semiconductor device.SOLUTION: The adhesive tape for manufacturing an electronic component includes: an adhesive layer; and a non-adhesive layer, which is applied onto the adhesive. The adhesive layer and the non-adhesive layer are composed of compositions including a phenoxy resin, a thermal curing agent, an energy beam-curable acrylic resin and a photoinitiator, wherein the compositions of the adhesive layer and the non-adhesive layer are different in composition ratio.
摘要翻译：解决的问题：提供一种满足半导体器件的制造工艺中所需的条件和特性的电子部件的制造用胶带。解决方案：用于制造电子部件的胶带包括：粘合剂层; 以及施加到粘合剂上的非粘合剂层。粘合剂层和非粘合剂层由包括苯氧树脂，热固化剂，能量束固化丙烯酸树脂和光引发剂的组合物组成，其中粘合剂层和非粘合剂层的组成不同组成比。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011061174A Method of laminating adhesive tape, and lead frame 审中-公开
标题翻译：粘合胶带和引线框架的方法
公开(公告)号：JP2011061174A
公开(公告)日：2011-03-24
申请号：JP2009266478
申请日：2009-11-24
申请人： Toray Advanced Materials Korea Inc , トレイアドバーンストマテリアルズコリアインコーポレイティッド
发明人： IM MIN-HO , CHOI SUNG-HWAN , SIM CHANG-HOON , MOON KI-JEONG , JEON HAE-SANG
IPC分类号： H01L23/50
CPC分类号： C09J5/06 , B32B37/0015 , B32B37/06 , B32B2457/14 , C08G2650/56 , C08L31/06 , C08L75/14 , C08L2205/05 , C09J7/35 , C09J171/00 , C09J2433/00 , C09J2463/00 , H01L21/568 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/32245 , H01L2224/48175 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/30107 , H01L2924/3511 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To provide a method of laminating an adhesive tape and a lead frame, in more specific that can reduce the warpage phenomenon of the lead frame, after a heating lamination process in which the adhesive tape for manufacturing a semiconductor device is attached to the lead frame, is able to satisfy all required characteristics of lamination process conditions, and is able to improve the limit, that is, the residue of the adhesive tape that has been used in the manufacturing process of existing semiconductor devices and leakage of sealing resin.
SOLUTION: In the method of laminating the adhesive tape and the lead frame 4, the lamination temperatures of the adhesive tape surface and the lead frame surface are made to be different in the lamination process of the adhesive tape for manufacturing electronic components and the lead frame. Preferably, the lamination temperature of the lead frame face is set lower than that of the adhesive tape face by approximately 1 to 200°C.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种层压粘合带和引线框架的方法，更具体地说可以减少引线框架的翘曲现象，在其中用于制造半导体的胶带的加热层压工艺装置连接到引线框架，能够满足层压工艺条件的所有要求的特性，并且能够提高限制，即已经用于现有半导体器件的制造过程中的粘合带的残留物密封树脂泄漏。解决方案：在粘合带和引线框架4的层叠方法中，使粘合带表面和引线框架表面的层压温度在用于制造电子部件的胶带的层压工艺中不同，引线框架。优选地，将引线框架面的层压温度设定为低于胶带面的层压温度约1〜200℃。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011057956A Adhesive sheet for plating 审中-公开
标题翻译：涂料胶粘剂
公开(公告)号：JP2011057956A
公开(公告)日：2011-03-24
申请号：JP2009238644
申请日：2009-10-15
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： UM SANG-JUNE , CHOI SUNG HWAN , SIM CHANG-HOON , MOON KI JEONG , JEON HAE SANG
IPC分类号： C09J7/02 , B32B15/08 , B32B27/00 , C09J4/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a highly-reliable and easily-operable adhesive sheet (tape) for plating, particularly a removable adhesive sheet protecting one surface from penetration of a plating liquid in plating of the other surface of a lead frame during a QFN process for securing high chemical resistance and obtaining high dimension stability of components during plating and easily separating without leaving any residue on an adherend surface in removing.
SOLUTION: The adhesive sheet for plating includes a base material, and an adhesive layer, which is formed on at least one surface of the base material and coated with an adhesive composition comprising a thermosetting adhesive resin and a thermosetting agent. Preferably, the adhesive composition additionally comprises an energy ray curable acrylic oligomer resin and an energy ray initiator.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供用于电镀的高可靠性和易于操作的粘合片（带），特别是可防止引线框架的另一表面镀覆中的电镀液的一个表面的可移除的粘合片在QFN工艺期间，确保高耐化学性，并在电镀期间获得组件的高维度稳定性，并且易于分离，而不会在被除去的被粘物表面上留下残留物。解决方案：用于电镀的粘合片包括基材和粘合剂层，其形成在基材的至少一个表面上并涂覆有包含热固性粘合树脂和热固性剂的粘合剂组合物。优选地，粘合剂组合物另外包含能量射线固化丙烯酸低聚物树脂和能量射线引发剂。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010271682A High-efficiency light diffusing polymeric film and method of manufacturing the same 有权
标题翻译：高分子聚合物薄膜的制造方法及其制造方法
公开(公告)号：JP2010271682A
公开(公告)日：2010-12-02
申请号：JP2009151273
申请日：2009-06-25
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： SIM CHANG-HOON , MOON KI-JEONG , JUN HAE-SANG
IPC分类号： G02B5/02 , C08J5/18 , C08K5/101 , C08L101/00 , F21V3/00 , F21V3/04
CPC分类号： G02B1/04 , C08J5/18 , C08J2323/06 , C08J2371/12 , G02B5/0242 , G02B5/0278
摘要： PROBLEM TO BE SOLVED: To provide a high-efficiency light diffusing polymeric film which provides a high level of light transmittance and light diffusion compatibility and is obtained by a relatively simple method, such as coating or extrusion; and to provide a method for manufacturing the same.
SOLUTION: The high-efficiency light diffusing polymeric film comprises: a first polymer which is a light transmissible medium, and a second polymer which is light scattering particles, wherein two different polymers are immiscible and have a low refractive index difference of 0.001 to 0.5; and the polymeric film comprises 30 to 70 pts.wt of the second polymer based on 100 pts.wt of the first polymer. The method for manufacturing the high-efficiency light diffusing polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供高效率的光漫射聚合物膜，其提供高水平的透光性和光扩散相容性，并且通过相对简单的方法如涂布或挤出获得; 并提供其制造方法。解决方案：高效率光扩散聚合物膜包括：第一聚合物，其是透光介质，和第二聚合物，其是光散射颗粒，其中两种不同的聚合物是不混溶的并且具有0.001的低折射率差至0.5; 并且基于100重量份的第一聚合物，聚合物膜包含30至70重量份的第二聚合物。进行高效率光扩散性聚合物膜的制造方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。版权所有（C）2011，JPO＆INPIT

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