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1. 发明专利

JP2012149210A Adhesive masking tape for molded underfill process of die exposed flip-chip package (defcp) 有权
标题翻译：用于模具底漆过程的胶粘带（DEFCP）
公开(公告)号：JP2012149210A
公开(公告)日：2012-08-09
申请号：JP2011128433
申请日：2011-06-08
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： CHOI SUNG HWAN , KIM SANG-PIL , MOON KI JUNG
IPC分类号： C09J7/02 , C09J11/06 , C09J133/00 , C09J175/16 , C09J183/07 , H01L21/56
CPC分类号： H01L21/566 , H01L2224/16227 , H01L2924/18161
摘要： PROBLEM TO BE SOLVED: To provide an adhesive masking tape for a molded underfill process of die exposed flip-chip packages, which exhibits improved reliability and can prevent contamination.SOLUTION: The adhesive masking tape for a molded underfill process of die exposed flip-chip packages comprises a heat resistant substrate and an adhesive layer applied on the heat resistant substrate, wherein the heat resistant substrate is a PEN film and has a thickness of 25-50 μm.
摘要翻译：要解决的问题：提供一种用于裸露的倒装芯片封装的模制底部填充工艺的粘合剂胶带，其显示出可靠性提高并且可以防止污染。解决方案：用于裸露的倒装芯片封装的模制底部填充工艺的粘合掩模胶带包括耐热基材和施加在耐热基材上的粘合剂层，其中耐热基材是PEN膜，并且具有厚度为25-50μm。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2013040276A Pressure-sensitive adhesive tape for electronic part production 有权
标题翻译：用于电子零件生产的压敏胶带
公开(公告)号：JP2013040276A
公开(公告)日：2013-02-28
申请号：JP2011178023
申请日：2011-08-16
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： IM MIN HO , KIM SANG PILL , MOON KI JUNG , SIM CHANG HOON , CHOI SUNG HWAN
IPC分类号： C09J7/02 , C09J11/06 , C09J133/00 , C09J171/12 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for electronic part production which enables detaping of the pressure-sensitive adhesive tape for electronic part production at normal temperature after a tight resin sealing process without an additional heating process, and satisfies any demand characteristics of a lamination processing condition, and can improve the limit of adhesive residues and sealing resin leakage of the pressure-sensitive adhesive tape used in a production process of an existing electronic part.SOLUTION: The pressure-sensitive adhesive tape for electronic part production includes a heat-resistant base material, and a pressure-sensitive adhesive layer obtained by applying a pressure-sensitive adhesive composition on the heat-resistant base material, wherein the pressure-sensitive adhesive composition contains a phenoxy resin, an acrylic resin, a heat curing agent, an energy ray-curable acrylic resin and a photoinitiator, and the pressure-sensitive adhesive layer is cured by heat curing and an energy ray.
摘要翻译：要解决的问题：提供一种用于电子部件生产的压敏粘合带，其能够在紧密的树脂密封过程之后在常温下脱离用于电子部件生产的压敏胶带而不需要额外的加热工艺，以及满足层压处理条件的任何需求特性，并且可以改善在现有电子部件的生产过程中使用的压敏粘合带的粘合残留物的限制和密封树脂的泄漏。解决方案：用于电子部件生产的压敏粘合带包括耐热基材和通过在耐热基材上施加压敏粘合剂组合物获得的压敏粘合剂层，其中压力敏感性粘合剂组合物含有苯氧基树脂，丙烯酸树脂，热固化剂，能量射线固化性丙烯酸树脂和光引发剂，并且通过热固化和能量射线固化该粘合剂层。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2014063971A Adhesive composition for masking tape in mold underfill process, and masking tape using the same 有权
标题翻译：用于在模具过程中掩模胶带的胶粘组合物，以及使用其的掩模胶带
公开(公告)号：JP2014063971A
公开(公告)日：2014-04-10
申请号：JP2013026884
申请日：2013-02-14
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： JEON KYONG YEON , CHOI SUNG HWAN , KIM SUNG JIN , KIM YONG-SOO
IPC分类号： H01L21/56 , B32B27/16 , B32B27/18 , B32B27/30 , C09J4/06 , C09J7/02 , C09J11/04 , C09J11/06 , C09J11/08 , C09J133/00 , C09J161/28 , C09J175/04 , C09J175/16 , C09J183/04 , C09J183/07
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape in a mold underfill process, and a masking tape using the adhesive composition for a masking tape in a mold underfill process.SOLUTION: An adhesive composition for a masking tape in a mold underfill process according to the present invention includes: (a) an acrylic copolymer; (b) a thermosetting agent; (c) an energy-ray curable urethane resin; (d) an energy-ray curable silicone resin; (e) an energy-ray initiator; and (f) chemical particles.
摘要翻译：要解决的问题：在模具底部填充工艺中提供用于遮蔽胶带的粘合剂组合物，以及在模具底部填充工艺中使用用于遮蔽胶带的粘合剂组合物的胶带。解决方案：用于模具中的胶带的粘合剂组合物根据本发明的底部填充方法包括：（a）丙烯酸共聚物; （b）热固性剂; （c）能量射线固化型聚氨酯树脂; （d）能量射线固化性有机硅树脂; （e）能量射线引发剂; 和（f）化学颗粒。

4. 发明专利

JP2011057956A Adhesive sheet for plating 审中-公开
标题翻译：涂料胶粘剂
公开(公告)号：JP2011057956A
公开(公告)日：2011-03-24
申请号：JP2009238644
申请日：2009-10-15
申请人： Toray Advanced Materials Korea Inc , 東レ先端素材株式会社
发明人： UM SANG-JUNE , CHOI SUNG HWAN , SIM CHANG-HOON , MOON KI JEONG , JEON HAE SANG
IPC分类号： C09J7/02 , B32B15/08 , B32B27/00 , C09J4/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a highly-reliable and easily-operable adhesive sheet (tape) for plating, particularly a removable adhesive sheet protecting one surface from penetration of a plating liquid in plating of the other surface of a lead frame during a QFN process for securing high chemical resistance and obtaining high dimension stability of components during plating and easily separating without leaving any residue on an adherend surface in removing.
SOLUTION: The adhesive sheet for plating includes a base material, and an adhesive layer, which is formed on at least one surface of the base material and coated with an adhesive composition comprising a thermosetting adhesive resin and a thermosetting agent. Preferably, the adhesive composition additionally comprises an energy ray curable acrylic oligomer resin and an energy ray initiator.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供用于电镀的高可靠性和易于操作的粘合片（带），特别是可防止引线框架的另一表面镀覆中的电镀液的一个表面的可移除的粘合片在QFN工艺期间，确保高耐化学性，并在电镀期间获得组件的高维度稳定性，并且易于分离，而不会在被除去的被粘物表面上留下残留物。解决方案：用于电镀的粘合片包括基材和粘合剂层，其形成在基材的至少一个表面上并涂覆有包含热固性粘合树脂和热固性剂的粘合剂组合物。优选地，粘合剂组合物另外包含能量射线固化丙烯酸低聚物树脂和能量射线引发剂。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2014019869A Adhesive composition improved in electric reliability at high voltage, and adhesive tape for semiconductor packaging using the same 有权
标题翻译：在高电压下改善电可靠性的胶粘组合物和使用其的半导体包装的胶粘带
公开(公告)号：JP2014019869A
公开(公告)日：2014-02-03
申请号：JP2013125152
申请日：2013-06-14
申请人： Toray Advanced Materials Korea Inc , トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッドToray Advanced Materials Korea Incorporated
发明人： HONG SEUNG WOO , CHOI SUNG HWAN , KIM SUNG JIN , KIM YOUNG SOO
IPC分类号： C09J163/00 , C09J7/02 , C09J11/00 , C09J11/06 , C09J135/00 , C09J161/06 , C09J201/00
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition improved in electric reliability at high voltage, and an adhesive tape for semiconductor packaging using the same.SOLUTION: The adhesive composition of the present invention contains an epoxy hardener optimal for heightening fracture toughness of a hardened network by heightening a crosslink density in an epoxy resin base material, so that electric reliability is secured at a high voltage of not less than 30 V, and entanglement between molecules in the hardened network is strong to satisfy excellent adhesive strength at a high temperature of not less than 200°C. Thus, the adhesive composition, according to the present invention, is useful for an adhesive tape useful for a semiconductor-packaging field accompanying a high temperature process of not less than 200°C such as wire bonding and soldering, and can be usefully applied to a field such as elevator industry and semiconductor packaging for automobiles where high voltage is impressed.
摘要翻译：要解决的问题：提供改善高电压可靠性的粘合剂组合物和使用其的半导体封装用胶带。本发明的粘合剂组合物含有最佳的用于提高硬化的断裂韧性的环氧固化剂网络通过提高环氧树脂基材中的交联密度，使得在不低于30V的高电压下确保电可靠性，并且硬化网络中的分子之间的缠结强，以在高温下满足优异的粘合强度不低于200°C。因此，根据本发明的粘合剂组合物可用于伴随着诸如引线键合和焊接等不低于200℃的高温工艺的半导体封装领域的粘合带，并且可以有用地应用于诸如电梯行业和汽车的半导体封装领域，其中高压被印象深刻。

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