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1. 发明专利

JP2003041400A Apparatus and method for manufacturing printed wiring board 有权
标题翻译：印刷电路板制造装置及方法
公开(公告)号：JP2003041400A
公开(公告)日：2003-02-13
申请号：JP2001233928
申请日：2001-08-01
申请人： Learonal Japan Inc , Meltex Inc , Toppan Printing Co Ltd , メルテックス株式会社 , 凸版印刷株式会社 , 日本リーロナール株式会社
发明人： HASEGAWA TAKESHI , AMAMIYA HIROYASU , SUZUKI TATSUO , MINAKI KENICHI , HAMAZAKI MASASHI , KIYOTA MASARU , TSUCHIDA HIDEKI , HAYASHI SHINJIRO , WATANABE AKIHIRO
IPC分类号： C25D7/00 , C25D21/18 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a printed wiring board which efficiently regenerates additives in a plating bath, so that the plated layer can fill a hole of the printed wiring board into a desired filling shape.
SOLUTION: This apparatus is characterized by arranging an electrolytic plating tank for accommodating an electrolytic plating bath including additives, and an electrolytic regeneration tank for regenerating the electrolytic plating bath used for electrolytic plating of the printed wiring board in the electrolytic plating tank; by immersing a dummy substrate as a cathode and an insoluble electrode as an anode, in the plating bath in the above electrolytic regeneration tank; and by regenerating the additives in the above electrolytic plating bath, while electrolytically plating the above dummy substrate, by passing regeneration current between the above anode and the cathode.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于制造印刷线路板的装置，其有效地再生镀浴中的添加剂，使得镀层可以将印刷线路板的孔填充到所需的填充形状。解决方案：该设备的特征在于布置用于容纳包括添加剂的电解电镀浴的电解槽，以及用于再生用于电解镀槽中的印刷线路板的电解电镀的电解电镀浴的电解再生槽; 通过在上述电解再生槽的电镀槽中浸渍作为阴极的虚设基板和不溶性电极作为阳极，并且通过在上述阳极和阴极之间通过再生电流，在上述电解镀浴中再生添加剂，同时对上述虚设基板进行电解镀覆。

2. 发明专利

JP2003008238A Drilling machine for multilayer printed wiring board, and manufacturing method using the same 审中-公开
标题翻译：用于多层印刷线路板的钻孔机及其制造方法
公开(公告)号：JP2003008238A
公开(公告)日：2003-01-10
申请号：JP2001188631
申请日：2001-06-21
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , MINAKI KENICHI
IPC分类号： G01B11/00 , B23B35/00 , B23K26/00 , B23K26/02 , B23K26/03 , B23K26/38 , B23K101/42 , G01B15/00 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To solve the problem of registration defects, such as a multilayer land cut or the like, being generated due to an effect of increasing the accuracy of a drilling position, by optimizing a correction means equipped at a drilling machine, in order to enhance the accuracy of the drilling position in the drilling machine for a multilayer printed wiring board and in a manufacturing method. SOLUTION: In order to enhance accuracy of the drilling position, a target is measured by the correction means equipped at the drilling machine and by a length-measuring means by a CCD camera or an X-ray measuring system, and a drilling operation is performed on the basis of the working data corrected by a calculation expression (1), to which a correction item is newly added. By optimizing correction value, accuracy of the drilling position is increased, and the accuracy of the formation position of an outer-layer land diameter is improved.
摘要翻译：要解决的问题：为了解决由于提高钻孔位置的精度而产生的诸如多层土地切割等的配准缺陷的问题，通过优化在钻机上装备的校正装置，为了提高多层印刷线路板的钻孔机的钻孔位置的精度，以及制造方法。解决方案：为了提高钻孔位置的精度，通过在钻孔机上配备的校正装置和通过CCD照相机或X射线测量系统的长度测量装置测量目标，并执行钻孔操作基于通过计算表达式（1）校正的工作数据，其中新添加了校正项目。通过优化校正值，提高钻孔位置的精度，提高外层地面直径的形成位置的精度。

3. 发明专利

JP2002368425A Printed circuit board and its manufacturing method 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2002368425A
公开(公告)日：2002-12-20
申请号：JP2001173861
申请日：2001-06-08
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： HASEGAWA TAKESHI , AMAMIYA HIROYASU , SUZUKI TATSUO , MINAKI KENICHI , NAOI KOKUKO
IPC分类号： H05K1/09 , H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board having no cavity or the like by eliminating a difference in heights between a non-penetration via and other part, and enriching in an electroplating layer even in the non-penetration via in the board having the non-penetration via for connecting a conductive layer between insulating layers. SOLUTION: The printed circuit board comprises the non-penetration via for connecting the conductive layer between the insulating layers 13. The conductive layer on the insulating layer has an electroless plating layer 14, a first electroplating layer 15, and a second electroplating layer. The board further comprises the non-penetration via for connecting the conductive layer between the insulating layers in such a manner that the conductive layer on the insulating layer has an electroless plating layer, a first electroplating layer and a second electroplating layer, and further a third electroplating layer.
摘要翻译：要解决的问题：通过消除非穿透通孔和其他部分之间的高度差异来提供不具有空腔等的印刷电路板，并且即使在具有电镀层的板中的非穿透通孔中也富集电镀层，用于在绝缘层之间连接导电层的非穿透通孔。解决方案：印刷电路板包括用于连接绝缘层13之间的导电层的非穿透通孔。绝缘层上的导电层具有化学镀层14，第一电镀层15和第二电镀层。该板还包括非穿透通孔，用于以绝缘层上的导电层具有化学镀层，第一电镀层和第二电镀层的方式连接绝缘层上的导电层，电镀层

4. 发明专利

JP2002314254A MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002314254A
公开(公告)日：2002-10-25
申请号：JP2001112424
申请日：2001-04-11
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , HASEGAWA TAKESHI , MINAKI KENICHI
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high-precision and high-density multilayer printed wiring board in which respective wiring layers are electrically connected through via holes, and the via holes are formed in an insulated layer in which a glass cross exists internally, and which is superior in electric reliability. SOLUTION: In a wiring substrate 10 in which a first wiring layer 12 is formed on both faces of an insulated substrate 11, a prepreg obtained by impregnating an insulated resin 15 is laminated in a glass cross 14 to form an insulated layer 21, and a hole 16 for a via hole is formed at a predetermined position of the insulated layer 21. After a desmear processing, a conductive layer is formed on the insulated layer 21 and in the hole 16 for the via hole, and is subjected to a patterning process to form a second wiring layer 18 and a via hole 17. A solder resist layer 19 is formed to obtain a multilayer printed wiring board 100.

5. 发明专利

JP2002361462A LASER DRILLING DEVICE WITH AUTOMATIC MEASUREMENT CORRECTION FUNCTION FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD BY USING THE DEVICE 失效
公开(公告)号：JP2002361462A
公开(公告)日：2002-12-18
申请号：JP2001164566
申请日：2001-05-31
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , MINAKI KENICHI
IPC分类号： B23K26/382 , B23K26/046 , B23K101/42 , H05K3/00 , H05K3/46 , B23K26/00 , B23K26/04
摘要： PROBLEM TO BE SOLVED: To provide a laser drilling device and a method for manufacturing a printed wiring board with which device and method the printed wiring board is made high density, multilayer and the size of the board is made larger. SOLUTION: A distance is measured with an automatic distance measurement means fitted in the vicinity of a lens, or successively read out of a database, a holder jig of the lens is driven in z-direction on the basis of the corrected value, the focal position of the lens is located at the position of the surface (F2) of the insulation resin layer 5 of the work sheet and the insulation resin layer 5 is drilled.

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