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1. 发明专利

JP2003008238A Drilling machine for multilayer printed wiring board, and manufacturing method using the same 审中-公开
标题翻译：用于多层印刷线路板的钻孔机及其制造方法
公开(公告)号：JP2003008238A
公开(公告)日：2003-01-10
申请号：JP2001188631
申请日：2001-06-21
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , MINAKI KENICHI
IPC分类号： G01B11/00 , B23B35/00 , B23K26/00 , B23K26/02 , B23K26/03 , B23K26/38 , B23K101/42 , G01B15/00 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To solve the problem of registration defects, such as a multilayer land cut or the like, being generated due to an effect of increasing the accuracy of a drilling position, by optimizing a correction means equipped at a drilling machine, in order to enhance the accuracy of the drilling position in the drilling machine for a multilayer printed wiring board and in a manufacturing method. SOLUTION: In order to enhance accuracy of the drilling position, a target is measured by the correction means equipped at the drilling machine and by a length-measuring means by a CCD camera or an X-ray measuring system, and a drilling operation is performed on the basis of the working data corrected by a calculation expression (1), to which a correction item is newly added. By optimizing correction value, accuracy of the drilling position is increased, and the accuracy of the formation position of an outer-layer land diameter is improved.
摘要翻译：要解决的问题：为了解决由于提高钻孔位置的精度而产生的诸如多层土地切割等的配准缺陷的问题，通过优化在钻机上装备的校正装置，为了提高多层印刷线路板的钻孔机的钻孔位置的精度，以及制造方法。解决方案：为了提高钻孔位置的精度，通过在钻孔机上配备的校正装置和通过CCD照相机或X射线测量系统的长度测量装置测量目标，并执行钻孔操作基于通过计算表达式（1）校正的工作数据，其中新添加了校正项目。通过优化校正值，提高钻孔位置的精度，提高外层地面直径的形成位置的精度。

2. 发明专利

JP2002190658A CIRCUIT FORMING METHOD ON PRINTED-WIRING BOARD 失效
公开(公告)号：JP2002190658A
公开(公告)日：2002-07-05
申请号：JP2000387993
申请日：2000-12-21
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , SUZUKI HARUHIRO , FUKUDA ATSUSHI
IPC分类号： H05K3/42 , H05K3/00 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method for inexpensively forming a circuit on a printed- wiring board by reducing defect in a circuit pattern due to dirt, and by shortening processes in circuit formation and exposure time. SOLUTION: A resin layer 13A is provided on the copper surface of a copper- clad, a portion other than the circuit pattern of the resin layer is eliminated with a laser beam 14, copper at the portion other than the circuit pattern is exposed, a circuit pattern 13A' of the resin layer is formed, the circuit pattern of the resin layer is used as a etching resist, the copper at the portion other than the exposed circuit pattern is dissolved and removed by etching, and the circuit pattern on the resin layer is eliminated, thus forming the circuit on the copper-clad.

3. 发明专利

JP2002314254A MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002314254A
公开(公告)日：2002-10-25
申请号：JP2001112424
申请日：2001-04-11
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , HASEGAWA TAKESHI , MINAKI KENICHI
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high-precision and high-density multilayer printed wiring board in which respective wiring layers are electrically connected through via holes, and the via holes are formed in an insulated layer in which a glass cross exists internally, and which is superior in electric reliability. SOLUTION: In a wiring substrate 10 in which a first wiring layer 12 is formed on both faces of an insulated substrate 11, a prepreg obtained by impregnating an insulated resin 15 is laminated in a glass cross 14 to form an insulated layer 21, and a hole 16 for a via hole is formed at a predetermined position of the insulated layer 21. After a desmear processing, a conductive layer is formed on the insulated layer 21 and in the hole 16 for the via hole, and is subjected to a patterning process to form a second wiring layer 18 and a via hole 17. A solder resist layer 19 is formed to obtain a multilayer printed wiring board 100.

4. 发明专利

JP2002232150A LASER-BORING MACHINE FOR MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2002232150A
公开(公告)日：2002-08-16
申请号：JP2001029244
申请日：2001-02-06
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , HASEGAWA TAKESHI
IPC分类号： B23K26/064 , B23K26/067 , B23K26/382 , B23K101/42 , H05K3/00 , H05K3/46 , B23K26/00 , B23K26/06
摘要： PROBLEM TO BE SOLVED: To provide a laser-boring machine for multilayer printed wiring board, in which interlayer connection reliability of via is enhanced by completely removing remaining resin on the surface at the land part of an inner layer copper foil at boring of a via for interlayer connection. SOLUTION: A laser optical system comprises a first short-wavelength laser optical system for boring an upper layer copper foil, a CO2 laser optics for boring a resin layer beneath a hole in the copper foil made by the first short wavelength laser optical system, and a second short wavelength laser optics for removing remaining resin on an inner layer copper foil beneath a hole in the resin layer made by the CO2 laser optical system.

5. 发明专利

JP2002361462A LASER DRILLING DEVICE WITH AUTOMATIC MEASUREMENT CORRECTION FUNCTION FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD BY USING THE DEVICE 失效
公开(公告)号：JP2002361462A
公开(公告)日：2002-12-18
申请号：JP2001164566
申请日：2001-05-31
申请人： TOPPAN PRINTING CO LTD
发明人： SUZUKI TATSUO , ISHIGURO KINYA , KIMURA TADAO , MINAKI KENICHI
IPC分类号： B23K26/382 , B23K26/046 , B23K101/42 , H05K3/00 , H05K3/46 , B23K26/00 , B23K26/04
摘要： PROBLEM TO BE SOLVED: To provide a laser drilling device and a method for manufacturing a printed wiring board with which device and method the printed wiring board is made high density, multilayer and the size of the board is made larger. SOLUTION: A distance is measured with an automatic distance measurement means fitted in the vicinity of a lens, or successively read out of a database, a holder jig of the lens is driven in z-direction on the basis of the corrected value, the focal position of the lens is located at the position of the surface (F2) of the insulation resin layer 5 of the work sheet and the insulation resin layer 5 is drilled.

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