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1. 发明申请

US20110301362A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF 有权
标题翻译：新型液体四羧酸二糖及其制备方法
公开(公告)号：US20110301362A1
公开(公告)日：2011-12-08
申请号：US13202067
申请日：2009-12-08
申请人： Tooru Kikuchi , Hayato Kotani , Katsuyuki Masuda , Toshihiko Takasaki
发明人： Tooru Kikuchi , Hayato Kotani , Katsuyuki Masuda , Toshihiko Takasaki
IPC分类号： C07D307/77
CPC分类号： C07F7/0838
摘要： The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). [In formula (1) R1, R2, R3 and R4 each independently represent an alkyl group having from 1 to 5 carbon atoms, m represents a number from 1 to 30, all of the silicon atoms bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings, and all of the dicarboxylic anhydride groups bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings.]
摘要翻译：本发明涉及由下式（1）表示的四羧酸二酐。 [式（1）中，R 1，R 2，R 3和R 4各自独立地表示碳原子数1〜5的烷基，m表示1〜30的数，与降冰片烷环结合的全部硅原子为外 - 关于降冰片烷环的结构，并且与降冰片烷环结合的所有二羧酸酐基都相对于降冰片烷环具有外部构型。

2. 发明授权

US08524921B2 Liquid tetracarboxylic dianhydrides and process for the preparation thereof 有权
标题翻译：液体四羧酸二酐及其制备方法
公开(公告)号：US08524921B2
公开(公告)日：2013-09-03
申请号：US13202067
申请日：2009-12-08
申请人： Tooru Kikuchi , Hayato Kotani , Katsuyuki Masuda , Toshihiko Takasaki
发明人： Tooru Kikuchi , Hayato Kotani , Katsuyuki Masuda , Toshihiko Takasaki
IPC分类号： C07D493/00 , C07D307/77 , C07F7/08
CPC分类号： C07F7/0838
摘要： The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). [In formula (1) R1, R2, R3 and R4 each independently represent an alkyl group having from 1 to 5 carbon atoms, m represents a number from 1 to 30, all of the silicon atoms bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings, and all of the dicarboxylic anhydride groups bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings.]
摘要翻译：本发明涉及由下式（1）表示的四羧酸二酐。 [式（1）中，R 1，R 2，R 3和R 4各自独立地表示碳原子数1〜5的烷基，m表示1〜30的数，与降冰片烷环结合的全部硅原子为外 - 关于降冰片烷环的结构，并且与降冰片烷环结合的所有二羧酸酐基都相对于降冰片烷环具有外部构型。

3. 发明授权

US08592546B2 Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same 有权
标题翻译：含硅脂环族聚酰亚胺树脂，聚酰胺酸树脂及其制造方法
公开(公告)号：US08592546B2
公开(公告)日：2013-11-26
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G77/452
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 与降冰片烷环结合的酰胺基和羧基中的任何一个相对于降冰片烷环都处于外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

4. 发明申请

US20130158225A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：新型含硅聚合物聚酰胺树脂，聚酰胺树脂及其制造方法
公开(公告)号：US20130158225A1
公开(公告)日：2013-06-20
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G73/10 , C08G69/42
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的酰胺基和羧基中的任一个相对于降冰片烷环具有外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

5. 发明授权

US07781896B2 Semiconductor device and process for fabrication thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07781896B2
公开(公告)日：2010-08-24
申请号：US12138637
申请日：2008-06-13
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

6. 发明授权

US07078094B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07078094B2
公开(公告)日：2006-07-18
申请号：US10891090
申请日：2004-07-15
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： B32B15/04 , H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

7. 发明申请

US20070225438A1 Resin Paste for Die Bonding 审中-公开
标题翻译：用于模具粘合的树脂浆料
公开(公告)号：US20070225438A1
公开(公告)日：2007-09-27
申请号：US11587049
申请日：2005-02-15
申请人： Yuji Hasegawa , Yasuhisa Odagawa , Tooru Kikuchi
发明人： Yuji Hasegawa , Yasuhisa Odagawa , Tooru Kikuchi
IPC分类号： C08L79/08
CPC分类号： H01L24/83 , C08G73/106 , C09J179/08 , H01L24/29 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512
摘要： A resin paste for die bonding that can be supplied and applied easily by a printing method. The resin paste for die bonding of the present invention comprises: a polyimide resin (PI), which is obtained by reacting a tetracarboxylic dianhydride (A) comprising a tetracarboxylic dianhydride represented by the formula (I) shown below: (wherein, n represents an integer from 2 to 20), with a diamine (B) comprising a siloxane-based diamine represented by the formula (II) shown below: (wherein, Q1 and Q2 each represent, independently, an alkylene group of 1 to 5 carbon atoms or a phenylene group, Q3, Q4, Q5 and Q6 each represent, independently, an alkyl group of 1 to 5 carbon atoms, a phenyl group, or a phenoxy group, and p represents an integer from 1 to 50); a filler (F); and a printing solvent (S), wherein the resin paste has been adjusted to have a solid fraction from 20 to 70% by weight, a thixotropic index from 1.5 to 8.0, and a viscosity (25° C.) from 5 to 1,000 Pa·s.
摘要翻译：用于芯片接合的树脂糊剂，其可以通过印刷方法容易地供应和应用。本发明的芯片接合用树脂膏包括：将由下述式（I）表示的四羧酸二酐的四羧酸二酐（A）反应得到的聚酰亚胺树脂（PI）：其中，n表示与二胺（B）包含由下式（II）表示的硅氧烷基二胺的二胺（B）：（其中，Q 1和Q 2 各自独立地表示1〜5个碳原子的亚烷基或亚苯基，Q 3，Q 4，Q 5和 Q 6各自独立地表示1〜5个碳原子的烷基，苯基或苯氧基，p表示1〜50的整数）。填料（F）; 和印刷溶剂（S），其中将树脂糊调节至固体成分为20〜70重量％，触变指数为1.5〜8.0，粘度（25℃）为5〜1000Pa .s。

8. 发明授权

US07057265B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07057265B2
公开(公告)日：2006-06-06
申请号：US10428126
申请日：2003-05-02
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/495 , H01L29/40
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

9. 发明申请

US20060180903A1 SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20060180903A1
公开(公告)日：2006-08-17
申请号：US11379921
申请日：2006-04-24
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

10. 发明授权

US06825249B1 Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device 失效
标题翻译：膜状有机芯片接合材料的层压方法，芯片接合方法，层压机和芯片接合装置，半导体装置以及半导体装置的制造方法
公开(公告)号：US06825249B1
公开(公告)日：2004-11-30
申请号：US09616943
申请日：2000-07-14
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Yasuo Miyadera , Mituo Yamasaki , Iwao Maekawa , Akio Kotato , Yuusuke Miyamae , Tadaji Satou , Makoto Saitou , Tooru Kikuchi , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Yasuo Miyadera , Mituo Yamasaki , Iwao Maekawa , Akio Kotato , Yuusuke Miyamae , Tadaji Satou , Makoto Saitou , Tooru Kikuchi , Akira Kageyama , Aizou Kaneda
IPC分类号： C08K300
CPC分类号： H01L24/27 , H01L21/4821 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/75 , H01L2224/7565 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.
摘要翻译：提供了一种用于在引线框上依次加热和压接薄膜状有机芯片接合材料的层压方法和机器。将框架7放置在行进台8上并在那里被加热。将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。然后将其上粘贴有胶片的引线框架通过移动台移动到位置B. 在位置B的压接元件压制薄膜后，将薄片状的有机芯片接合材料2安装在芯片上。因此，可以将薄膜状的有机模片接合材料压缩引导框架，生产效率高，但没有空隙，并进一步避免了在安装芯片时的封装破裂。

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