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1. 发明授权

US07176402B2 Method and apparatus for processing electronic parts 有权
标题翻译：电子零件加工方法及装置
公开(公告)号：US07176402B2
公开(公告)日：2007-02-13
申请号：US10969274
申请日：2004-10-21
申请人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
发明人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
IPC分类号： B23K10/00
CPC分类号： H05K3/3489 , H05K3/288 , H05K3/3447 , H05K2201/10287 , H05K2203/095
摘要： An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.
摘要翻译：一种用于剥离具有端子部分的电子部件的树脂涂层的电子部件处理方法。该方法包括以等离子体照射具有铜作为主要成分的涂覆线和涂覆有树脂的表面的步骤。

2. 发明申请

US20050179171A1 Method and apparatus for processing electronic parts 有权
标题翻译：电子零件加工方法及装置
公开(公告)号：US20050179171A1
公开(公告)日：2005-08-18
申请号：US10969274
申请日：2004-10-21
申请人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
发明人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
IPC分类号： H01F41/10 , B23K10/00 , H05K3/28 , H05K3/34
CPC分类号： H05K3/3489 , H05K3/288 , H05K3/3447 , H05K2201/10287 , H05K2203/095
摘要： An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section, which includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.
摘要翻译：一种用于剥离具有端子部分的电子部件的树脂涂层的电子部件处理方法，该电子部件处理方法包括用等离子体照射以铜为主要成分的涂覆线和涂覆有树脂的表面的步骤。

3. 发明授权

US5962133A Solder, electronic component mounted by soldering, and electronic circuit board 失效
标题翻译：焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
申请人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
发明人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L23/495 , H05K3/24 , H05K3/34 , B32B5/16 , B32B15/00
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

4. 发明授权

US08598464B2 Soldering material and electronic component assembly 有权
标题翻译：焊料和电子元器件组装
公开(公告)号：US08598464B2
公开(公告)日：2013-12-03
申请号：US12999411
申请日：2010-04-19
申请人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
发明人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
IPC分类号： H05K1/16 , B23K31/00 , C22C13/02
CPC分类号： H05K3/3463 , B23K35/262 , B23K2101/36 , B32B15/01 , C22C13/00 , H05K3/3442 , H05K2201/10992 , Y02P70/613
摘要： A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.
摘要翻译：焊料材料包括1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。当通过使用该焊料将电子部件的含铜电极部分连接到基板的含铜电极焊盘时，可以在焊料连接部分中形成具有优异的应力松弛特性的部分， Sn金属间化合物可以从电极焊盘和电极部分快速生长，形成强阻挡结构。

5. 发明申请

US20090242249A1 BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE 有权
标题翻译：粘接材料，电子元器件，粘结结构和电子器件
公开(公告)号：US20090242249A1
公开(公告)日：2009-10-01
申请号：US12302157
申请日：2007-05-18
申请人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
发明人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
IPC分类号： H05K1/02 , C22C12/00 , B23K35/34 , B32B15/04
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge.
摘要翻译：熔融温度为270℃以上且不含铅的接合材料成本低廉。电子元件和电子部件的电极使用含有以Bi为主成分的合金的接合材料接合，含有0.2〜0.8重量％的Cu和0.2重量％的Ge。

6. 发明申请

US20100294550A1 BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE 审中-公开
标题翻译：连接材料，电子元器件和结合结构
公开(公告)号：US20100294550A1
公开(公告)日：2010-11-25
申请号：US12810415
申请日：2008-12-09
申请人： Akio Furusawa , Shigeki Sakaguchi , Kenichiro Suetsugu
发明人： Akio Furusawa , Shigeki Sakaguchi , Kenichiro Suetsugu
IPC分类号： H05K1/02 , C22C12/00
CPC分类号： C22C12/00 , B23K35/264 , B23K2101/36 , H01L23/49513 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/838 , H01L2924/0001 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10272 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2924/01029 , H01L2924/01028 , H01L2924/01032 , H01L2924/01083 , H01L2924/3512 , H01L2224/29099 , H01L2924/00012
摘要： A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni and 89.19 to 97.96% by weight of Bi has more superior heat resistance.
摘要翻译：含有2〜10.5重量％的Cu，0.02〜0.2重量％的Ge和89.3〜97.98重量％的Bi的粘合材料具有高达275℃的耐热性和优异的润湿性，以及含有2 至10.5重量％的Cu，0.02〜0.2重量％的Ge，0.02〜0.11重量％的Ni和89.19〜97.96重量％的Bi具有更优异的耐热性。

7. 发明授权

US06428745B2 Solder, solder paste and soldering method 有权
标题翻译：焊锡，焊膏和焊接方法
公开(公告)号：US06428745B2
公开(公告)日：2002-08-06
申请号：US09818905
申请日：2001-03-28
申请人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
发明人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
IPC分类号： C22C1302
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译：公开了用于将电子部件焊接到电路板的焊料和焊膏。该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

8. 发明授权

US06267823B1 Solder, solder paste and soldering method 失效
标题翻译：焊锡，焊膏和焊接方法
公开(公告)号：US06267823B1
公开(公告)日：2001-07-31
申请号：US09125013
申请日：1998-11-12
申请人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
发明人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译：公开了用于将电子部件焊接到电路板的焊料和焊膏。该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

9. 发明授权

US08227090B2 Bonding material, electronic component, bonding structure and electronic device 有权
标题翻译：接合材料，电子部件，接合结构和电子设备
公开(公告)号：US08227090B2
公开(公告)日：2012-07-24
申请号：US12302157
申请日：2007-05-18
申请人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
发明人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
IPC分类号： B32B15/04
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.
摘要翻译：熔融温度为270℃以上且不含铅的接合材料成本低廉。电子元件和电子部件的电极使用包含含有Bi作为主要成分并且含有0.2〜0.8重量％的Cu和0.02〜0.2重量％的Ge的合金的接合材料接合。

10. 发明申请

US20110120769A1 SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY 有权
标题翻译：焊接材料和电子元器件组件
公开(公告)号：US20110120769A1
公开(公告)日：2011-05-26
申请号：US12999411
申请日：2010-04-19
申请人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
发明人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
IPC分类号： H01R4/00 , B23K31/02
CPC分类号： H05K3/3463 , B23K35/262 , B23K2101/36 , B32B15/01 , C22C13/00 , H05K3/3442 , H05K2201/10992 , Y02P70/613
摘要： A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop.A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure. Thus, even in a severe temperature environment, cleavage can be prevented from generating and extending, a high thermal fatigue resistance can be attained, and occurrence of connection failure can be reduced.
摘要翻译：提供了一种无铅焊料，其显示出高耐热疲劳性，并且能够有效地减少导致产品功能停止的连接故障的发生。焊料材料包含1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。当使用该焊料将电子部件（3）的含铜电极部（3a）与基板（1）的含铜电极焊盘（1a）连接时，具有优异应力的部分（5b）可以在焊料连接部中形成松弛性，并且可以从电极接合区（1a）和电极部（3a）迅速地生长Cu-Sn金属间化合物（5a），形成强阻挡结构。因此，即使在严酷的温度环境下，也可以防止产生和延伸的裂纹，可以获得高耐热疲劳性，并且可以降低连接故障的发生。

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