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1. 发明申请

US20090242249A1 BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE 有权
标题翻译：粘接材料，电子元器件，粘结结构和电子器件
公开(公告)号：US20090242249A1
公开(公告)日：2009-10-01
申请号：US12302157
申请日：2007-05-18
申请人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
发明人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
IPC分类号： H05K1/02 , C22C12/00 , B23K35/34 , B32B15/04
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge.
摘要翻译：熔融温度为270℃以上且不含铅的接合材料成本低廉。电子元件和电子部件的电极使用含有以Bi为主成分的合金的接合材料接合，含有0.2〜0.8重量％的Cu和0.2重量％的Ge。

2. 发明授权

US08227090B2 Bonding material, electronic component, bonding structure and electronic device 有权
标题翻译：接合材料，电子部件，接合结构和电子设备
公开(公告)号：US08227090B2
公开(公告)日：2012-07-24
申请号：US12302157
申请日：2007-05-18
申请人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
发明人： Akio Furusawa , Kenichiro Suetsugu , Shigeki Sakaguchi , Kimiaki Nakaya
IPC分类号： B32B15/04
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.
摘要翻译：熔融温度为270℃以上且不含铅的接合材料成本低廉。电子元件和电子部件的电极使用包含含有Bi作为主要成分并且含有0.2〜0.8重量％的Cu和0.02〜0.2重量％的Ge的合金的接合材料接合。

3. 发明申请

US20100294550A1 BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE 审中-公开
标题翻译：连接材料，电子元器件和结合结构
公开(公告)号：US20100294550A1
公开(公告)日：2010-11-25
申请号：US12810415
申请日：2008-12-09
申请人： Akio Furusawa , Shigeki Sakaguchi , Kenichiro Suetsugu
发明人： Akio Furusawa , Shigeki Sakaguchi , Kenichiro Suetsugu
IPC分类号： H05K1/02 , C22C12/00
CPC分类号： C22C12/00 , B23K35/264 , B23K2101/36 , H01L23/49513 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/838 , H01L2924/0001 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10272 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2924/01029 , H01L2924/01028 , H01L2924/01032 , H01L2924/01083 , H01L2924/3512 , H01L2224/29099 , H01L2924/00012
摘要： A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni and 89.19 to 97.96% by weight of Bi has more superior heat resistance.
摘要翻译：含有2〜10.5重量％的Cu，0.02〜0.2重量％的Ge和89.3〜97.98重量％的Bi的粘合材料具有高达275℃的耐热性和优异的润湿性，以及含有2 至10.5重量％的Cu，0.02〜0.2重量％的Ge，0.02〜0.11重量％的Ni和89.19〜97.96重量％的Bi具有更优异的耐热性。

4. 发明申请

US20090166398A1 SOLDERING APPARATUS AND SOLDERING METHOD 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：US20090166398A1
公开(公告)日：2009-07-02
申请号：US12337826
申请日：2008-12-18
申请人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
发明人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
IPC分类号： B23K1/20
CPC分类号： B23K3/0653 , B23K2101/36 , H05K3/227 , H05K3/3468 , H05K3/3489 , H05K2203/081 , H05K2203/082
摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.
摘要翻译：焊接装置具有输送电子电路板的输送机，将具有水作为溶剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到电子电路板和冷却器。除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

5. 发明授权

US07780057B2 Soldering apparatus and soldering method 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：US07780057B2
公开(公告)日：2010-08-24
申请号：US12337826
申请日：2008-12-18
申请人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
发明人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
IPC分类号： B23K1/08
CPC分类号： B23K3/0653 , B23K2101/36 , H05K3/227 , H05K3/3468 , H05K3/3489 , H05K2203/081 , H05K2203/082
摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.
摘要翻译：焊接装置具有输送电子电路板的输送机，将具有水作为溶剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到电子电路板和冷却器。除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

6. 发明申请

US20110031297A1 FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD 失效
标题翻译：流动焊接装置和流动焊接方法
公开(公告)号：US20110031297A1
公开(公告)日：2011-02-10
申请号：US12867340
申请日：2009-04-10
申请人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
发明人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
IPC分类号： B23K1/19 , B23K31/12 , B23K1/20
CPC分类号： H05K3/3468 , B23K3/0653 , H05K3/3447 , H05K3/3489 , H05K2201/10151 , H05K2203/0126 , H05K2203/111 , H05K2203/163
摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
摘要翻译：本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

7. 发明授权

US08132707B2 Flow soldering apparatus and flow soldering method using a water content sensor 失效
标题翻译：流动焊接装置和使用含水量传感器的流焊方法
公开(公告)号：US08132707B2
公开(公告)日：2012-03-13
申请号：US12867340
申请日：2009-04-10
申请人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
发明人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
IPC分类号： B23K13/08 , B23K1/08 , B23K31/12 , B23K31/02
CPC分类号： H05K3/3468 , B23K3/0653 , H05K3/3447 , H05K3/3489 , H05K2201/10151 , H05K2203/0126 , H05K2203/111 , H05K2203/163
摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
摘要翻译：本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

8. 发明授权

US5962133A Solder, electronic component mounted by soldering, and electronic circuit board 失效
标题翻译：焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
申请人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
发明人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L23/495 , H05K3/24 , H05K3/34 , B32B5/16 , B32B15/00
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

9. 发明授权

US08598464B2 Soldering material and electronic component assembly 有权
标题翻译：焊料和电子元器件组装
公开(公告)号：US08598464B2
公开(公告)日：2013-12-03
申请号：US12999411
申请日：2010-04-19
申请人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
发明人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
IPC分类号： H05K1/16 , B23K31/00 , C22C13/02
CPC分类号： H05K3/3463 , B23K35/262 , B23K2101/36 , B32B15/01 , C22C13/00 , H05K3/3442 , H05K2201/10992 , Y02P70/613
摘要： A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.
摘要翻译：焊料材料包括1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。当通过使用该焊料将电子部件的含铜电极部分连接到基板的含铜电极焊盘时，可以在焊料连接部分中形成具有优异的应力松弛特性的部分， Sn金属间化合物可以从电极焊盘和电极部分快速生长，形成强阻挡结构。

10. 发明授权

US07176402B2 Method and apparatus for processing electronic parts 有权
标题翻译：电子零件加工方法及装置
公开(公告)号：US07176402B2
公开(公告)日：2007-02-13
申请号：US10969274
申请日：2004-10-21
申请人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
发明人： Tomohiro Okumura , Kenichiro Suetsugu , Hiroshi Kawazoe , Mitsuo Saitoh , Akio Furusawa
IPC分类号： B23K10/00
CPC分类号： H05K3/3489 , H05K3/288 , H05K3/3447 , H05K2201/10287 , H05K2203/095
摘要： An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.
摘要翻译：一种用于剥离具有端子部分的电子部件的树脂涂层的电子部件处理方法。该方法包括以等离子体照射具有铜作为主要成分的涂覆线和涂覆有树脂的表面的步骤。

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