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1. 发明授权

US07810955B2 Linear LED illumination system 有权
标题翻译：线性LED照明系统
公开(公告)号：US07810955B2
公开(公告)日：2010-10-12
申请号：US11780154
申请日：2007-07-19
申请人： Tomislav Stimac , Shawn Du , Matthew S. Mrakovich , Mark Mayer
发明人： Tomislav Stimac , Shawn Du , Matthew S. Mrakovich , Mark Mayer
IPC分类号： F21V29/00
CPC分类号： F21V23/005 , F21S2/005 , F21S4/28 , F21V5/043 , F21V7/005 , F21V7/0091 , F21V13/04 , F21V21/005 , F21V23/009 , F21V23/06 , F21V29/70 , F21V29/75 , F21V29/76 , F21V29/89 , F21Y2103/10 , F21Y2115/10 , Y10S362/80
摘要： A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor. The second connector has a configuration that complements the first connector so that the second connector can connect to an associated adjacent first connector of an associated adjacent LED module to allow a plurality of similar LED modules to be mechanically and electrically connected to one another. The power supply is disposed in the power supply housing and in electrical communication with the circuitry of the PCB and the electrical conductor. The power supply is configured to receive the AC line voltage from the electrical conductor and to convert the received AC line voltage to a lower DC voltage for delivery to the circuitry of the PCB to drive the LEDs mounted on the PCB.
摘要翻译：线性LED灯模块和系统包括散热器，印刷电路板，多个LED，电源壳体，柔性电导体，第一电连接器，第二电连接器和电源。散热器沿着与散热器的最大尺寸平行的纵向轴线在轴向方向上伸长。 PCB与散热片热连通，并包括电路。多个LED安装到PCB并且与PCB的电路电连通。电源外壳连接到散热器。柔性电导体包括被配置成适应至少120VAC的AC线电压的至少两根导线。第一电连接器位于电导体的第一端。第二电连接器位于电导体的第二端。第二连接器具有补充第一连接器的配置，使得第二连接器可以连接到相关联的相邻LED模块的相关联的相邻的第一连接器，以允许多个相似的LED模块彼此机械地和电连接。电源设置在电源壳体中并与PCB和电导体的电路电连通。电源被配置为从电导体接收AC线路电压并将接收到的AC线路电压转换成较低的DC电压，以便传送到PCB的电路以驱动安装在PCB上的LED。

2. 发明申请

US20090021936A1 LINEAR LED ILLUMINATION SYSTEM 有权
标题翻译：线性LED照明系统
公开(公告)号：US20090021936A1
公开(公告)日：2009-01-22
申请号：US11780154
申请日：2007-07-19
申请人： Tomislav Stimac , Shawn Du , Matthew S. Mrakovich , Mark Mayer
发明人： Tomislav Stimac , Shawn Du , Matthew S. Mrakovich , Mark Mayer
IPC分类号： F21V21/00
CPC分类号： F21V23/005 , F21S2/005 , F21S4/28 , F21V5/043 , F21V7/005 , F21V7/0091 , F21V13/04 , F21V21/005 , F21V23/009 , F21V23/06 , F21V29/70 , F21V29/75 , F21V29/76 , F21V29/89 , F21Y2103/10 , F21Y2115/10 , Y10S362/80
摘要： A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor. The second connector has a configuration that complements the first connector so that the second connector can connect to an associated adjacent first connector of an associated adjacent LED module to allow a plurality of similar LED modules to be mechanically and electrically connected to one another. The power supply is disposed in the power supply housing and in electrical communication with the circuitry of the PCB and the electrical conductor. The power supply is configured to receive the AC line voltage from the electrical conductor and to convert the received AC line voltage to a lower DC voltage for delivery to the circuitry of the PCB to drive the LEDs mounted on the PCB.
摘要翻译：线性LED灯模块和系统包括散热器，印刷电路板，多个LED，电源壳体，柔性电导体，第一电连接器，第二电连接器和电源。散热器沿着与散热器的最大尺寸平行的纵向轴线在轴向方向上伸长。 PCB与散热片热连通，并包括电路。多个LED安装到PCB并且与PCB的电路电连通。电源外壳连接到散热器。柔性电导体包括被配置成适应至少120VAC的AC线电压的至少两根导线。第一电连接器位于电导体的第一端。第二电连接器位于电导体的第二端。第二连接器具有补充第一连接器的配置，使得第二连接器可以连接到相关联的相邻LED模块的相关联的相邻的第一连接器，以允许多个相似的LED模块彼此机械地和电连接。电源设置在电源壳体中并与PCB和电导体的电路电连通。电源被配置为从电导体接收AC线路电压并将接收到的AC线路电压转换成较低的DC电压，以便传送到PCB的电路以驱动安装在PCB上的LED。

3. 发明申请

US20070236956A1 Super bright LED power package 审中-公开
标题翻译：超亮LED电源包
公开(公告)号：US20070236956A1
公开(公告)日：2007-10-11
申请号：US11394895
申请日：2006-03-31
申请人： Boris Kolodin , Shawn Du , Emil Radkov , Mark Mayer , Ivan Eliashevich
发明人： Boris Kolodin , Shawn Du , Emil Radkov , Mark Mayer , Ivan Eliashevich
IPC分类号： G02B6/00 , F21V9/00
CPC分类号： G02B6/0008 , F21S41/00 , F21Y2115/10 , G02B3/00 , G02B6/04
摘要： At least two light emitting diodes emit a non-parallel light beam. A condensing system, operationally coupled with the light emitting diodes, receives the emitted non-parallel light beam and converts the received non-parallel light beam into a parallel light beam. A non-imaging concentrator includes an input surface which collects the parallel light beam, and an output surface, which includes phosphor material and outputs light.
摘要翻译：至少两个发光二极管发射非平行光束。与发光二极管可操作地耦合的冷凝系统接收所发射的非平行光束并将接收到的非平行光束转换为平行光束。非成像集中器包括收集平行光束的输入表面和包括磷光体材料并输出光的输出表面。

4. 发明申请

US20060071329A1 Power led package 失效
标题翻译：电源led封装
公开(公告)号：US20060071329A1
公开(公告)日：2006-04-06
申请号：US10949929
申请日：2004-09-24
申请人： Shawn Du
发明人： Shawn Du
IPC分类号： H01L23/34
CPC分类号： H01L23/50 , H01L23/5386 , H01L25/0655 , H01L25/0753 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： In a chip package (10, 10′, 110, 210), first and second electrical power buses (14, 14′, 16, 16′, 114, 116, 214, 216) are each formed of an electrical conductor having a chip bonding portion (20, 22, 120, 122, 220, 222) and a lead portion (26, 26′, 28, 28′, 126, 128, 226, 228) extending away from the chip bonding portion. The chip bonding portions of the first and second electrical power buses have edges (32, 34, 132, 134, 232, 234) spaced apart from one another to define an extended electrical isolation gap (40, 140, 240). A plurality of chips (42, 44, 46, 142, 143, 144, 145, 146, 147, 148, 242) straddle the extended electrical isolation gap and are electrically connected with the first and second electrical power buses to receive electrical power from the first and second electrical power buses.
摘要翻译：在芯片封装（10,10'，110,210）中，第一和第二电力总线（14,14'，16,16'，114,116,214,216）分别由具有芯片接合部分（20,22,120,122,220,222）以及远离芯片接合部分延伸的引线部分（26,26'，28,28'，126,128,226,228）。第一和第二电力总线的芯片接合部分具有彼此间隔开以限定延伸的电气隔离间隙（40,140,240）的边缘（32,34,132,134,232,234）。多个芯片（42,44,46,142,143,144,145,146,147,148,242）跨越扩展的电隔离间隙并与第一和第二电力总线电连接以从第一和第二电力总线。

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