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1. 发明授权

US4755899A Magnetic transducer head having an alloy thin film of high saturation magnetic flux density slantly provided with respect to an operating magnetic gap formed therein 失效
标题翻译：具有相对于其中形成的工作磁隙倾斜地提供高饱和磁通密度的合金薄膜的磁性换能器头
公开(公告)号：US4755899A
公开(公告)日：1988-07-05
申请号：US686540
申请日：1984-12-26
申请人： Tomio Kobayashi , Heikichi Sato , Makoto Kubota , Shoichi Kano , Tatsuo Kumura , Kazushi Yamauchi , Yoshimi Takahashi , Junichi Saito
发明人： Tomio Kobayashi , Heikichi Sato , Makoto Kubota , Shoichi Kano , Tatsuo Kumura , Kazushi Yamauchi , Yoshimi Takahashi , Junichi Saito
IPC分类号： G11B5/147 , G11B5/127 , G11B5/187 , G11B5/23 , G11B5/245 , G11B5/31
CPC分类号： G11B5/1871 , G11B5/127 , G11B5/187 , G11B5/3116 , G11B5/3163
摘要： A magnetic transducer head comprising a first magnetic core element and a second magnetic core element, each of the first and second core elements comprising a magnetic ferrite block and a magnetic metal thin film integrated with the magnetic ferrite block. These core elements having a first planar surface and a second planar surface. The magnetic metal thin film being provided on the second planar surface and having an edge thereof facing to the first planar surface, and the second planar surface being slantly provided with respect to said first planar surface. These core elements being bonded together to form an operating magnetic gap between the edge of the magnetic metal thin film on the first core element and the edge of the magnetic metal thin film on the second core element. The magnetic metal thin film on the first core element or the magnetic thin film on the second core element is formed in one common plane.The magnetic metal thin film may be formed of the ferromagnetic metals including Fe--Al--Si alloys, amorphous metal alloys or permalloy. And the magnetic metal thin film having substantially uniform columnar grain structure or uniform magnetic anisotropy, over entire area of the film.
摘要翻译：一种磁传感器头，包括第一磁芯元件和第二磁芯元件，所述第一和第二芯元件中的每一个包括磁性铁氧体块和与所述磁性铁氧体块集成的磁性金属薄膜。这些芯元件具有第一平面和第二平面。所述磁性金属薄膜设置在所述第二平坦表面上并且具有面向所述第一平面的边缘，并且所述第二平面相对于所述第一平面倾斜地设置。这些芯元件结合在一起，以在第一芯元件上的磁性金属薄膜的边缘与第二芯元件上的磁性金属薄膜的边缘之间形成工作磁隙。第一芯体上的磁性金属薄膜或第二芯体上的磁性薄膜形成在一个公共平面中。磁性金属薄膜可以由包括Fe-Al-Si合金，非晶态金属合金或坡莫合金的铁磁性金属形成。并且在膜的整个区域上具有基本均匀的柱状晶粒结构或均匀磁各向异性的磁性金属薄膜。

2. 发明授权

US08278142B2 Combined metallic bonding and molding for electronic assemblies including void-reduced underfill 有权
标题翻译：用于电子组件的组合金属接合和模制，包括空隙减小的底部填充
公开(公告)号：US08278142B2
公开(公告)日：2012-10-02
申请号：US12469935
申请日：2009-05-21
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： H01L21/00
CPC分类号： H01L24/94 , H01L21/56 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/13009 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/753 , H01L2224/75303 , H01L2224/75314 , H01L2224/75315 , H01L2224/75501 , H01L2224/75744 , H01L2224/7598 , H01L2224/81203 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83907 , H01L2224/9205 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2224/81 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/3512
摘要： A method for forming electronic assemblies includes providing a plurality of IC die each having IC bonding conductors and a workpiece having workpiece bonding conductors. A curable dielectric film is applied to the IC bonding conductors or the workpiece surface. The plurality of IC die are placed on the workpiece surface so that the plurality of IC bonding conductors are aligned to and face the plurality of workpiece bonding conductors to provide a first bonding. The placing is performed at a vacuum level corresponding to a pressure
摘要翻译：一种用于形成电子组件的方法包括提供多个具有IC接合导体的IC芯片和具有工件接合导体的工件。将可固化电介质膜施加到IC接合导体或工件表面。将多个IC芯片放置在工件表面上，使得多个IC接合导体与多个工件接合导体对准并面对以提供第一接合。放置在对应于压力<1kPa的真空水平下进行，并且在足以提供可固化电介质膜的粘性的温度下进行。然后按压多个IC管芯以提供第二接合。压制期间的温度固化了可固化电介质膜以提供底部填充，并在多个IC接合导体和多个工件接合导体之间形成金属接头。

3. 发明授权

US07971351B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07971351B2
公开(公告)日：2011-07-05
申请号：US12400474
申请日：2009-03-09
申请人： Yoshimi Takahashi , Masazumi Amagai
发明人： Yoshimi Takahashi , Masazumi Amagai
IPC分类号： H05K3/30
CPC分类号： H01L21/67126 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49146 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.
摘要翻译：本发明的目的是提供一种制造半导体器件的方法，该半导体器件允许单独模制承载在衬底表面上的多个半导体芯片。它包括以下工艺步骤：在衬底100的表面上布置多个半导体元件102的工艺步骤; 其中衬底102的内侧固定在下模130上的工艺步骤; 其中液体树脂114从喷嘴112供应到每个半导体元件上以覆盖每个半导体芯片102的至少一部分的工艺步骤; 将具有形成在一个表面上的多个空腔144的上模压在下模上的处理步骤，并且液态树脂114通过多个空腔144在规定温度下成型; 以及上模140的空腔144与基板分离的工序，单独形成多个成形树脂部。

4. 发明申请

US20050190506A1 Magnetic reproducing head, head drum apparatus, and magnetic recording-reproducing apparatus 失效
标题翻译：磁再现头，磁头鼓装置和磁记录再现装置
公开(公告)号：US20050190506A1
公开(公告)日：2005-09-01
申请号：US11117207
申请日：2005-04-28
申请人： Yutaka Souda , Yoshimi Takahashi , Susumu Sato , Seiji Onoe
发明人： Yutaka Souda , Yoshimi Takahashi , Susumu Sato , Seiji Onoe
IPC分类号： G11B5/39 , G11B5/10 , G11B5/40 , G11B5/53 , G11B5/52
CPC分类号： G11B5/10 , G11B5/3903 , G11B5/40 , G11B5/53
摘要： A head substrate and a protective substrate are formed of an electrostatic-discharge resistant conductive material having an electrical resistivity of 102 to 1010 Ωcm. These substrates are electrically connected to a base metal through the use of conductive paste and are set to a ground potential via the base metal and a rotating drum. This suppresses a discharge current flowing through an MR element when an electrostatically charged substance touches or approaches a magnetic reproducing head, a terminal, a conducting wire, etc. to generate an electrostatic discharge. The magnetic reproducing head including an MR element and the like is prevented against an electrostatic discharge damage. It is possible to provide the magnetic reproducing head, a head drum apparatus, and a magnetic recording-reproducing apparatus which can highly effectively prevent an electrostatic discharge damage.
摘要翻译：头基板和保护基板由电阻率为10〜10Ω·cm的静电电阻导电材料形成。这些基板通过使用导电膏电连接到基体金属，并且通过基底金属和旋转鼓被设置为接地电位。当静电充电物质接触或接近磁性再现头，端子，导线等产生静电放电时，这抑制流过MR元件的放电电流。包括MR元件等的磁性再现头被防止静电放电损坏。可以提供可以高度有效地防止静电放电损坏的磁性再现头，磁头鼓装置和磁记录重放装置。

5. 发明授权

US5671248A Spread spectrum communication equipment 失效
标题翻译：扩频通信设备
公开(公告)号：US5671248A
公开(公告)日：1997-09-23
申请号：US355773
申请日：1994-12-14
申请人： Kising Chau , Yoshimi Takahashi
发明人： Kising Chau , Yoshimi Takahashi
IPC分类号： H04B1/707 , H04B1/7073 , H04B1/7075 , H04B1/709 , H04B1/7103 , H04J13/00 , H04W76/00 , H04W76/02 , H04J11/00 , H04B1/06 , H04B5/00 , H04B7/00
CPC分类号： H04B1/70753 , H04B1/707 , H04B1/709 , H04B1/70735 , H04B1/70755
摘要： A spread spectrum communication equipment comprises a correlator outputting a correlation output signal, a timing generator generating two timing signals in response to a correlation peak value, detecting circuits for detecting information of a correlation output signal based on either one of the timing signals, receiving information detected in either one of the detecting circuits and checking whether the information coincides with the ID code, a switching circuit for selecting connection or disconnection between the detecting circuits and a demodulator, and a control circuit responsive to outputs of the checking circuits for selecting connection or disconnection with the switching circuit.
摘要翻译：扩展频谱通信设备包括输出相关输出信号的相关器，响应于相关峰值产生两个定时信号的定时发生器，用于基于定时信号中的任一个检测相关输出信号的信号的检测电路，接收信息在所述检测电路中的任一个中检测到，并且检查所述信息是否与所述ID码一致，用于选择所述检测电路与解调器之间的连接或断开的切换电路以及响应于所述检查电路的输出以选择连接或与开关电路断开连接。

6. 发明授权

US4566323A Liquid helium level indicating gauge 失效
标题翻译：液氦液位指示仪
公开(公告)号：US4566323A
公开(公告)日：1986-01-28
申请号：US518523
申请日：1983-07-29
申请人： Tsuyoshi Masumoto , Akihisa Inoue , Yoshimi Takahashi , Akira Hoshi , Uichiro Mizutani
发明人： Tsuyoshi Masumoto , Akihisa Inoue , Yoshimi Takahashi , Akira Hoshi , Uichiro Mizutani
IPC分类号： G01F23/24 , H01L39/12
CPC分类号： H01L39/12 , G01F23/246 , Y10S505/842
摘要： Improved liquid helium level gauge is described. The gauge includes a resistance wire sustained vertically within a liquid helium container and an electrical indicating device for producing an indication which varies with the electric resistance of said resistance wire. The resistance wire is made of a new superconductive amorphous material such as Zr.sub.80 Nb.sub.5 Al.sub.8 Si.sub.7. The amorphous material has a superconductivity transition temperature between 4.2.degree. and 5.0.degree. K., a relatively high normal electric resistance and a high mechanical strength.
摘要翻译：描述了改进的液氦液位计。仪表包括在液氦容器内垂直延伸的电阻丝和用于产生随着所述电阻丝的电阻而变化的指示的电指示装置。电阻丝由新型超导非晶材料如Zr80Nb5Al8Si7制成。无定形材料的超导转变温度在4.2°至5.0°K之间，相对较高的正常电阻和较高的机械强度。

7. 发明申请

US20120157898A1 MASSAGER 审中-公开
标题翻译：马萨诸塞州
公开(公告)号：US20120157898A1
公开(公告)日：2012-06-21
申请号：US13393971
申请日：2010-09-24
申请人： Tomohiko Watanabe , Koji Terada , Akihiro Takaya , Taichi Hamatsuka , Yoshimi Takahashi
发明人： Tomohiko Watanabe , Koji Terada , Akihiro Takaya , Taichi Hamatsuka , Yoshimi Takahashi
IPC分类号： A61H9/00
CPC分类号： A61H9/0078 , A61H2201/0149 , A61H2201/1614 , A61H2201/1628 , A61H2201/1638 , A61H2201/1654 , A61H2201/1669 , A61H2205/06 , A61H2205/062 , A61H2205/081 , A61H2205/086
摘要： Provided is a massager which enables armrests to be used effectively even with a backrest in a reclined state. The massager includes: a backrest having a massaging mechanism for massaging the back of a user; a frame which supports the backrest in such a manner that the backrest can be reclined backwards; a pair of armrests which extend forward respectively from left and right side positions of the backrest; and a linking mechanism which changes an attitude of the pair of armrests in conjunction with a reclining operation of the backrest, in such a manner that a rear part of each armrest falls lower than the front part of each armrest, when the backrest is reclined backward.
摘要翻译：本发明提供一种按摩器，即使靠背处于倾斜状态也能有效地使用扶手。按摩器包括：靠背，具有用于按摩使用者背部的按摩机构; 支撑靠背的框架，使得靠背可以向后倾斜; 一对扶手分别从靠背的左侧和右侧位置向前延伸; 以及连接机构，其结合靠背的倾斜操作改变一对扶手的姿态，使得当靠背靠后时，每个扶手的后部比每个扶手的前部落下的方式下降。

8. 发明申请

US20110316316A1 MASSAGE CHAIR 审中-公开
标题翻译：按摩椅
公开(公告)号：US20110316316A1
公开(公告)日：2011-12-29
申请号：US13148634
申请日：2010-02-16
申请人： Toshiaki Nanno , Akihiro Takaya , Nobuyuki Nishitani , Yoshimi Takahashi
发明人： Toshiaki Nanno , Akihiro Takaya , Nobuyuki Nishitani , Yoshimi Takahashi
IPC分类号： A47C7/62
CPC分类号： A61H2201/0149 , A61H2201/1669 , A61H2205/081
摘要： A massage chair includes a main frame, a seat, and a backrest. The main frame includes a back frame configured to support the backrest and a base frame configured to support the seat. The base frame is formed by combining a plurality of structural members. The plurality of structural members are arranged on positions corresponding to edges of a hexahedron. Part of the back frame serves as part of the structural members of the base frame.
摘要翻译：按摩椅包括主框架，座椅和靠背。主框架包括被配置为支撑靠背的后框架和构造成支撑座椅的基架。基架通过组合多个结构构件而形成。多个结构构件布置在与六面体的边缘相对应的位置上。后框架的一部分用作底架的结构构件的一部分。

9. 发明申请

US20110183464A1 DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS 有权
标题翻译：双向承载器将晶圆或晶圆加入TSV波形
公开(公告)号：US20110183464A1
公开(公告)日：2011-07-28
申请号：US12694012
申请日：2010-01-26
申请人： Yoshimi Takahashi , Masood Murtuza , Rajiv Dunne , Satyendra Singh Chauhan
发明人： Yoshimi Takahashi , Masood Murtuza , Rajiv Dunne , Satyendra Singh Chauhan
IPC分类号： H01L21/60
CPC分类号： H01L21/6836 , C09J5/06 , C09J2203/326 , C09J2205/302 , H01L21/561 , H01L21/565 , H01L21/76898 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/6834 , H01L2221/68381 , H01L2224/0401 , H01L2224/0557 , H01L2224/13009 , H01L2224/81001 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01043 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/20105 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： A method of forming stacked electronic articles using a through substrate via (TSV) wafer includes mounting a first carrier wafer to a top side of the TSV wafer using a first adhesive material that has a first debonding temperature. The TSV wafer is thinned from a bottom side of the TSV wafer to form a thinned TSV wafer. A second carrier wafer is mounted to the bottom side of the TSV wafer using a second adhesive material that has a second debonding temperature that is higher as compared to the first debonding temperature. The thinned TSV wafer is heated to a temperature above the first debonding temperature to remove the first carrier wafer from the thinned TSV wafer. At least one singulated IC die is bonded to TSV die formed on the top surface of the thinned TSV wafer to form the stacked electronic article.
摘要翻译：使用贯通基板通孔（TSV）晶片形成堆叠的电子产品的方法包括使用具有第一剥离温度的第一粘合材料将第一载体晶片安装到TSV晶片的顶侧。 TSV晶片从TSV晶片的底侧变薄以形成薄的TSV晶片。使用第二粘合剂材料将第二载体晶片安装到TSV晶片的底侧，第二粘合材料具有与第一脱粘温度相比更高的第二剥离温度。将薄化的TSV晶片加热到高于第一脱粘温度的温度，以从稀薄的TSV晶片去除第一载体晶片。至少一个单片IC芯片被结合到形成在薄化的TSV晶片的顶表面上的TSV模具，以形成堆叠的电子制品。

10. 发明授权

US07632945B2 Cyanine dye 失效
标题翻译：花青染料
公开(公告)号：US07632945B2
公开(公告)日：2009-12-15
申请号：US10565592
申请日：2004-07-21
申请人： Akira Shinpo , Yoshimi Takahashi , Kentaro Yano , Yasushi Aizawa
发明人： Akira Shinpo , Yoshimi Takahashi , Kentaro Yano , Yasushi Aizawa
IPC分类号： C07F1/08 , C07D213/89 , C07F15/00
CPC分类号： C09B69/06 , C09B23/00 , C09B23/0016 , C09B23/0066 , C09B23/086
摘要： An objective of this invention is to extend the range of choosing organic dye compounds as light-absorbing agent in a variety of fields of, for example, information storage, information display, solar energy generation, electric machinery apparatus, electric communicating apparatus, optical apparatus, cloth, building/bedding/decorating product, sanitary and health goods, and agricultural material by providing an organic dye compound which is superior in light-absorbing property, light resistance, and solubility in the near-infrared region: The objective is attainable by providing a cyanine dye that bears within the same molecule a plurality of cyanine dye skeletons bound to a divalent group(s) and an organometallic complex as counter ion, as well as substantially absorbing a light with a wavelength longer than 700 nm.
摘要翻译：本发明的目的是在例如信息存储，信息显示，太阳能发电，电机装置，电通信装置，光学装置等各种领域中扩大选择有机染料化合物作为光吸收剂的范围，布，建筑物/床上用品/装饰品，卫生用品和农用材料，通过提供在近红外区域的光吸收性，耐光性和溶解性优异的有机染料化合物。该目的可通过提供在相同分子内具有与二价基团结合的多个花青染料骨架和作为抗衡离子的有机金属络合物的花青染料，以及基本上吸收波长长于700nm的光。

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