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1. 发明专利

JP2010232415A Substrate heat treatment apparatus 有权
标题翻译：基材热处理设备
公开(公告)号：JP2010232415A
公开(公告)日：2010-10-14
申请号：JP2009078160
申请日：2009-03-27
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKAGI YASUHIRO , KAWAMICHI TATSUYA , FUKUDA YOSHITERU
IPC分类号： H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus facilitating the connection of a suction pipe with a heat treatment plate, maintaining heat uniformity within the surface of the heat treatment plate, and improving maintainability such as the inspection and exchange of the heat treatment plate. SOLUTION: This substrate heat treatment apparatus is equipped with: a heat plate 70 where a semiconductor wafer W is placed and heat-treated; a plurality of suction openings 76 formed on the wafer mounting surface of the heat plate 70 to suck the wafer; and a suction pipe 78 that connects each suction opening 76 and a suction means. At one end of the suction pipe 78, a connecting member 77 made of thermally insulated and flexible synthetic rubber is equipped. Then, the connecting member 77 is closely attached to the lower surface of the heat plate 70, and the suction opening 76 and the suction pipe 78 are connected airtightly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种便于吸引管与热处理板连接的基板热处理装置，保持热处理板表面内的热均匀性，提高可维护性，例如检查和更换热处理板。解决方案：该基板热处理装置配备有：放置半导体晶片W并进行热处理的加热板70; 形成在加热板70的晶片安装表面上的多个吸入口76，以吸收晶片; 以及连接每个吸入口76和抽吸装置的吸入管78。在吸入管78的一端设有由绝热柔性合成橡胶制成的连接部件77。然后，连接构件77紧密地附接到加热板70的下表面，并且吸入开口76和吸入管78气密地连接。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2008177494A Heater, heating method, and storage medium 有权
标题翻译：加热器，加热方法和储存介质
公开(公告)号：JP2008177494A
公开(公告)日：2008-07-31
申请号：JP2007011707
申请日：2007-01-22
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KAWAMICHI TATSUYA , SAKAI YUICHI , KANEDA MASATOSHI
IPC分类号： H01L21/027 , B05C9/14 , B05D3/02
CPC分类号： H01L21/67109 , H01L21/6838 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To restrain precipitation of a sublimated product produced from a coating film of the substrate in a passage for attracting the substrate at the time of attracting to a heating plate side and heating a substrate with a coating film applied on the surface while supporting the same with a plurality of projections provided on the heating plate.
SOLUTION: A ring-like member is provided for sectioning a gas flow on the front side and the rear side of a substrate. A gas supply opening is provided in the ring-like member for supplying a pure gas between the substrate and a heating plate so that the pure gas is vacuumed from the passage for attracting the substrate.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了抑制在吸附到加热板侧时吸附基板的通道中由基板的涂膜产生的升华产物的沉淀，并且涂覆涂布膜的基板加热该表面同时支撑设置在加热板上的多个突起。解决方案：提供一种环状构件，用于在衬底的前侧和后侧上划分气流。气体供给开口设置在环状构件中，用于在基板和加热板之间提供纯气体，使得纯净气体从用于吸引基板的通道被抽真空。版权所有（C）2008，JPO＆INPIT

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