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1. 发明专利

JP2013179257A Substrate treatment apparatus, substrate treatment method and storage medium 有权
标题翻译：基板处理设备，基板处理方法和存储介质
公开(公告)号：JP2013179257A
公开(公告)日：2013-09-09
申请号：JP2012249521
申请日：2012-11-13
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEDA MASATOSHI
IPC分类号： H01L21/027 , H01L21/677
CPC分类号： H01L22/12 , H01L21/02104 , H01L21/324 , H01L21/67115 , H01L21/67178 , H01L21/67276 , H01L21/67288 , H01L22/10
摘要： PROBLEM TO BE SOLVED: To prolong a replacement period of a light source of an ultraviolet irradiation part and suppress decrease in throughput when performing processing by irradiating a wafer W with ultraviolet light.SOLUTION: A substrate treatment apparatus includes a solution treatment module and an ultraviolet irradiation module. Wafers W are separately delivered to a plurality of unit blocks for performing the same series of processing. After an illuminance detection value of the ultraviolet irradiation module of the one unit block becomes a set value or less, another unit block is used. Irradiation with an irradiation time adjusted to a length according to the illuminance detection value is performed to the wafer W which has already been delivered to the one unit block. Then, a light source of the irradiation module is replaced. When use time of the light source for irradiating one unit block reaches set time, delivery of the wafer W to the unit block is stopped, and normal irradiation processing is performed to the wafer W which has already been delivered to the one unit block.
摘要翻译：要解决的问题：延长紫外线照射部分的光源的更换周期，并且在通过用紫外线照射晶片W进行处理时抑制通过量的降低。解决方案：基板处理装置包括固溶处理模块和紫外线照射模块。晶片W分别传送到多个单元块，以执行相同的一系列处理。在一个单位块的紫外线照射模块的照度检测值变为设定值以下之后，使用另一单位块。对已经传送到一个单位块的晶片W执行根据照度检测值调整到长度的照射时间的照射。然后，更换照射模块的光源。当照射一个单位块的光源的使用时间达到设定时间时，晶片W向单元块的传送停止，并且对已经传送到一个单位块的晶片W进行正常的照射处理。

2. 发明专利

JP2005033178A Substrate treatment equipment and substrate treatment method 有权
标题翻译：基板处理设备和基板处理方法
公开(公告)号：JP2005033178A
公开(公告)日：2005-02-03
申请号：JP2004136555
申请日：2004-04-30
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SHIGETOMI KENICHI , SATA NOBUYUKI , TAKEI TOSHICHIKA , KANEDA MASATOSHI
IPC分类号： H05B3/00 , H01L21/00 , H01L21/027 , H01L21/687
CPC分类号： H01L21/67248 , H01L21/67103 , H01L21/68714
摘要： PROBLEM TO BE SOLVED: To conduct a heat treatment having a high accuracy in a short time when a substrate is placed on a substrate placing section, the temperature of the substrate is stabilized at an aimed process temperature and the specified heat treatment (a heating or a cooling) is conducted.
SOLUTION: Substrate treatment equipment is constituted so that a first power command value is output to a power supply section supplying a heat supply section with a power on the basis of a preset output pattern while a second power command value smaller than the first power command value is output and the control is changed over to a PID control when or immediately before the substrate is placed on the substrate placing section. The temperature of the substrate placing section, in which a heat is robbed by the substrate and the temperature is lowered, can be returned quickly in this case, and the temperature can be stabilized rapidly. It is preferable that an integral element and a differential element are obtained previously before the control is changed over to the PID control, and that a PID arithemtic operation is conducted by using the values of the elements when the control is changed over to the PID control.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了在将基板放置在基板放置部上时在短时间内进行高精度的热处理，基板的温度在目标工艺温度和规定的热处理（进行加热或冷却）。解决方案：基板处理设备被构造成使得第一电力指令值被输出到供电部分，该电源部分基于预设输出模式向供热部分提供电力，而第二电力指令值小于第一电力指令值输出功率指令值，并且在基板被放置在基板放置部上或之前将控制切换到PID控制。在这种情况下，可以快速地返回其中被基板劫掠的热量和温度降低的基板放置部分的温度，并且可以快速地稳定温度。优选的是，在将控制切换到PID控制之前，先获得积分元件和差分元件，并且通过使用当控制转换到PID控制时的元件的值来进行PID仿真操作。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004273845A Device and method for application 有权
公开(公告)号：JP2004273845A
公开(公告)日：2004-09-30
申请号：JP2003063851
申请日：2003-03-10
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KOBAYASHI SHINJI , MIYAMOTO TETSUTSUGU , HAMADA MASAHITO , KANEDA MASATOSHI
IPC分类号： G03F7/16 , B05C11/08 , B05C11/10 , B05D1/00 , B05D1/40 , H01L21/00 , H01L21/027 , H01L21/687
CPC分类号： H01L21/68721 , B05D1/005 , G03F7/162 , H01L21/6715 , H01L21/68735 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To provide a device and method for application by which an applied solution adhering to the side faces and rear surfaces of the corner sections of a square substrate can be washed out by spin coating. SOLUTION: In order to wash out the applied solution which adheres to the side faces and rear surfaces of the corner sections of the substrate when an applied solution supplied from an applied solution nozzle is spread on the surface of the substrate by a centrifugal force by rotating the substrate while the substrate is held horizontally in a substrate holding section, a cleaning fluid is supplied to the rear surface side of the substrate from a cleaning fluid supplying section installed to the substrate holding section so that the supplying section may rotate together with the holding section. The cleaning fluid reaches the rear surfaces and side faces of the corner sections due to the centrifugal force caused by the rotation of the holding section and washes out the applied solution. In this case, the actions of the centrifugal force caused by the rotation and the surface tension of the cleaning fluid acting on the substrate side are combined with each other and clean the rear surfaces and side faces of the corner sections of the substrate. Consequently, even when the four corners of the substrates are supported by means of, for example, a substrate transporting means, the contamination of the means is suppressed. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2003023057A Apparatus and method for opening/closing substrate- housing cassette 有权
标题翻译：用于打开/关闭基板壳体的装置和方法
公开(公告)号：JP2003023057A
公开(公告)日：2003-01-24
申请号：JP2001205073
申请日：2001-07-05
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEDA MASATOSHI
IPC分类号： H01L21/677 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for opening/closing substrate- housing cassette capable of eliminating a fault occurring due to a clearance between a key hole which is not decided by standards and a key decided by the standards.
SOLUTION: The method for opening/closing the substrate-housing cassette comprises steps of setting the key hole 36a to a predetermined normal angle by further rotating the key 8 in the clockwise direction, for example, 1° to 3° and locking since the hole 36a will not be set to the predetermined angle by the clearance between the key 8 and the hole 36a as it is, if the key 8 is rotated in the clockwise direction by 90°. That is, the method comprises steps of increasing the rotation of the key 8 as compared with the normal locking angle of the hole 36a, and locking.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于打开/关闭基板壳体盒的装置和方法，其能够消除由于不由标准决定的键孔和由标准决定的键之间的间隙而发生的故障。解决方案：用于打开/关闭基板壳体盒的方法包括通过使键8沿顺时针方向（例如1度）进一步旋转将键孔36a设定到预定的法线角度的步骤。到3度并且由于孔8a由于键8和孔36a之间的间隙而不能将孔36a设定为预定角度，如果键8沿顺时针方向旋转90度，则该方法包括与孔36a的正常锁定角度相比增加键8的旋转和锁定的步骤。

5. 发明专利

JP2011086677A Apparatus and method for cooling substrate, and storage medium 有权
标题翻译：用于冷却基板和储存介质的装置和方法
公开(公告)号：JP2011086677A
公开(公告)日：2011-04-28
申请号：JP2009236447
申请日：2009-10-13
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： MIZUNAGA KOICHI , KUGA TAKAHIRO , KANEDA MASATOSHI
IPC分类号： H01L21/027
CPC分类号： H01L21/67103 , H01L21/68735
摘要： PROBLEM TO BE SOLVED: To provide a substrate cooling apparatus capable of cooling a substrate with high uniformity.
SOLUTION: A substrate cooling apparatus includes: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface and supporting the rear surface of the substrate; a coolant flow passage through which a coolant flows, wherein the coolant flow passage is provided in the mounting table to cool the mounting surface; a plurality of gas discharge ports provided in the circumferential direction at a peripheral edge of the mounting surface and discharging cooling gas for cooling the substrate; a gas suction port provided at the center of the mounting surface to suck the cooling gas; and a groove provided in the mounting surface to diffuse the cooling gas in the circumferential direction of the substrate. The substrate cooling apparatus with such a configuration can cool the substrate mounted on the mounting surface with high uniformity.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够以高均匀性冷却基板的基板冷却装置。解决方案：基板冷却装置包括：安装台，其包括用于在其上安装基板的安装表面; 设置在所述安装面上并支撑所述基板的背面的突起部; 冷却剂流动通道，冷却剂流过所述冷却剂流动通道，其中所述冷却剂流动通道设置在所述安装台中以冷却所述安装表面; 多个气体排出口，其设置在所述安装面的周缘部的圆周方向上，排出用于冷却所述基板的冷却气体; 气体吸入口，设置在所述安装表面的中心以吸取所述冷却气体; 以及设置在所述安装表面中的槽，用于沿所述基板的圆周方向扩散所述冷却气体。具有这种结构的基板冷却装置可以高度均匀地冷却安装在安装表面上的基板。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2008177303A Device and method for treating substrate and storage medium 有权
标题翻译：用于处理基板和存储介质的设备和方法
公开(公告)号：JP2008177303A
公开(公告)日：2008-07-31
申请号：JP2007008431
申请日：2007-01-17
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SHO SHOKEN , TAKAGI YASUHIRO , KANEDA MASATOSHI
IPC分类号： H01L21/027 , H01L21/683
CPC分类号： G03F7/70708 , B05C11/00 , C23C14/541 , C23C16/00 , C23C16/46 , H01L21/67109 , H01L21/67288 , H01L21/683 , H01L21/6838 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To reduce the quantity of suction for correcting the shapes of substrates by rapidly equalizing the temperatures of the substrates even in the substrates warped in various shapes when the substrates are heated through openings formed between the substrates and a heating plate for placing the substrates. SOLUTION: A plurality of ring-shaped barriers lower than projections are provided around the heating plate forming a plurality of projections for holding the substrate. The openings are partitioned into a plurality of regions, and the substrate is sucked through the plurality of regions. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了减少用于校正基板形状的抽吸量，即使在通过形成在基板之间的开口加热基板和加热之间，即使在各种形状扭曲的基板中也快速平衡基板的温度用于放置基板的板。解决方案：在加热板的周围设置多个低于凸起的环形屏障，形成用于保持基板的多个突起。开口分隔成多个区域，并且基板通过多个区域被吸引。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008177494A Heater, heating method, and storage medium 有权
标题翻译：加热器，加热方法和储存介质
公开(公告)号：JP2008177494A
公开(公告)日：2008-07-31
申请号：JP2007011707
申请日：2007-01-22
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KAWAMICHI TATSUYA , SAKAI YUICHI , KANEDA MASATOSHI
IPC分类号： H01L21/027 , B05C9/14 , B05D3/02
CPC分类号： H01L21/67109 , H01L21/6838 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To restrain precipitation of a sublimated product produced from a coating film of the substrate in a passage for attracting the substrate at the time of attracting to a heating plate side and heating a substrate with a coating film applied on the surface while supporting the same with a plurality of projections provided on the heating plate.
SOLUTION: A ring-like member is provided for sectioning a gas flow on the front side and the rear side of a substrate. A gas supply opening is provided in the ring-like member for supplying a pure gas between the substrate and a heating plate so that the pure gas is vacuumed from the passage for attracting the substrate.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了抑制在吸附到加热板侧时吸附基板的通道中由基板的涂膜产生的升华产物的沉淀，并且涂覆涂布膜的基板加热该表面同时支撑设置在加热板上的多个突起。解决方案：提供一种环状构件，用于在衬底的前侧和后侧上划分气流。气体供给开口设置在环状构件中，用于在基板和加热板之间提供纯气体，使得纯净气体从用于吸引基板的通道被抽真空。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007165936A Heat treatment apparatus 有权
标题翻译：热处理设备
公开(公告)号：JP2007165936A
公开(公告)日：2007-06-28
申请号：JP2007062070
申请日：2007-03-12
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKEI TOSHICHIKA , KANEDA MASATOSHI
IPC分类号： H01L21/027 , G03F1/76 , G03F7/38
摘要： PROBLEM TO BE SOLVED: To improve in-plane uniformity of a substrate in a heat treatment apparatus which performs heat treatment for a mask substrate, for example.
SOLUTION: When a substrate G on which coating liquid (resist liquid) is applied is put on a heating plate 4 to heat the substrate G in the heat treatment apparatus (heat treatment unit 3), a frame 5 is prepared above the heating plate 4 around the substrate G so that its inner surface faces the sides of the substrate and a space is formed between the surface of the heating plate. This frame 5 prevents dissipation of heat from the substrate sides and improves in-plane uniformity of the substrate temperature. The space between the frame 5 and the heating plate 4 prevents particles from staying this region and suppresses sticking of particles to the substrate G.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：例如，为了提高对进行掩模基板的热处理的热处理装置中的基板的面内均匀性。解决方案：当将涂覆液体（抗蚀剂液体）的基板G放在加热板4上以加热热处理设备（热处理单元3）中的基板G时，在加热板4围绕基板G，使得其内表面面向基板的侧面，并且在加热板的表面之间形成空间。该框架5防止从基板侧散热并提高基板温度的面内均匀性。框架5和加热板4之间的空间防止颗粒停留在该区域上并且抑制颗粒粘附到基板G上。（C）2007，JPO＆INPIT

9. 发明专利

JP2005340286A Heat treatment apparatus and heat treatment method 有权
标题翻译：热处理设备和热处理方法
公开(公告)号：JP2005340286A
公开(公告)日：2005-12-08
申请号：JP2004153606
申请日：2004-05-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKEI TOSHICHIKA , KANEDA MASATOSHI
IPC分类号： G03F1/68 , G03F1/82 , G05D23/22 , H01L21/00 , H01L21/027 , H01L21/68 , H01L21/683 , H05B3/00 , H05B3/02 , H05B3/10 , H05B3/74 , G03F1/08
CPC分类号： H01L21/67248 , G05D23/1935 , G05D23/22 , H01L21/67109
摘要： PROBLEM TO BE SOLVED: To perform highly precise heat treatment in short time when a substrate is placed on a heating plate, a temperature is stabilized to a target process temperature and prescribed heat treatment is performed. SOLUTION: When the substrate placed on a cooling plate is placed on the heating plate by a private conveyance means and heat treatment is to be performed, a system is switched from PID control by a control unit to a heater module heating the heating plate by power supply before the substrate is placed on the heating plate to MV control by a fixed pattern output part. Then, the system is switched to control by the control unit at prescribed timing after the substrate is placed on the heating plate. Thus, the temperature of the heating plate whose temperature drops can speedily be restored before the substrate is placed. The temperature can speedily be stabilized and highly precise heat treatment can be performed in short time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当将基板放置在加热板上时，在短时间内进行高精度的热处理，将温度稳定在目标工艺温度并进行规定的热处理。
解决方案：当将放置在冷却板上的基板通过专用输送装置放置在加热板上并进行热处理时，将系统从控制单元的PID控制切换到加热模块在将基板放置在加热板上以通过固定模式输出部分进行MV控制之前，通过电源供电。然后，在将基板放置在加热板上之后，在规定的时刻将控制单元切换到控制单元进行控制。因此，在放置基板之前，可以快速恢复温度下降的加热板的温度。温度可以快速稳定，并能在短时间内进行高精度的热处理。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2004247345A Thermal treatment device 有权
公开(公告)号：JP2004247345A
公开(公告)日：2004-09-02
申请号：JP2003032603
申请日：2003-02-10
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKEI TOSHICHIKA , KANEDA MASATOSHI
IPC分类号： H01L21/027 , G03F7/16 , H01L21/00 , H01L21/38
CPC分类号： H01L21/67109 , G03F7/168
摘要： PROBLEM TO BE SOLVED: To enable a thermal treatment device which thermally treats, for instance, a masked substrate to keep the substrate at a prescribed temperature more uniform through its surface.
SOLUTION: In the thermal treatment device (thermal treatment unit 3), when the substrate G on which a coating solution (resist liquid) is applied is placed on a heating plate 4 and heated, a frame 5 is provided above the heating plate 4 and around the substrate G so as to make its side faces confront the side faces of the substrate G and form a gap between itself and the surface of the heating plate. Heat is restrained from being released from the surface of the substrate G by the frame 5 to keep the temperature of the substrate G more uniform through its surface. A gap is formed between the frame 5 and the heating plate 4, so that particles hardly stay in this region and are restrained from adhering to the substrate G.
COPYRIGHT: (C)2004,JPO&NCIPI

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