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1. 发明授权

US08546257B2 Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array 失效
标题翻译：电极阵列及其制造方法使用印版将颗粒排列成阵列
公开(公告)号：US08546257B2
公开(公告)日：2013-10-01
申请号：US13551159
申请日：2012-07-17
申请人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
发明人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
IPC分类号： H01L21/28
CPC分类号： G01N33/54366 , H01L24/11 , H01L24/13 , H01L2224/0362 , H01L2224/0401 , H01L2224/05554 , H01L2224/05567 , H01L2224/11003 , H01L2224/11334 , H01L2224/119 , H01L2224/13022 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/13178 , H01L2224/13181 , H01L2224/13184 , H01L2224/13186 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/053 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012
摘要： Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
摘要翻译：提供电极阵列及其制造方法，使用印版将导电颗粒排列成与电极阵列对准。在一个实施例中，半导体器件包括：半导体形貌，包括设置在半导体衬底上的电极阵列; 驻留在半导体形貌上的电介质层; 以及设置在电介质层中或电介质层上的至少一个导电颗粒与电极阵列中的至少一个对准。

2. 发明申请

US20120282771A1 ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING PLATES TO ARRANGE PARTICLES IN AN ARRAY 失效
标题翻译：电极阵列和使用印刷板在阵列上布置颗粒的方法
公开(公告)号：US20120282771A1
公开(公告)日：2012-11-08
申请号：US13551159
申请日：2012-07-17
申请人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
发明人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
IPC分类号： H01L21/28
CPC分类号： G01N33/54366 , H01L24/11 , H01L24/13 , H01L2224/0362 , H01L2224/0401 , H01L2224/05554 , H01L2224/05567 , H01L2224/11003 , H01L2224/11334 , H01L2224/119 , H01L2224/13022 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/13178 , H01L2224/13181 , H01L2224/13184 , H01L2224/13186 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/053 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012
摘要： Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
摘要翻译：提供电极阵列及其制造方法，使用印版将导电颗粒排列成与电极阵列对准。在一个实施例中，半导体器件包括：半导体形貌，包括设置在半导体衬底上的电极阵列; 驻留在半导体形貌上的电介质层; 以及设置在电介质层中或电介质层上的至少一个导电颗粒与电极阵列中的至少一个对准。

3. 发明申请

US20090278213A1 ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING PLATES TO ARRANGE PARTICLES IN AN ARRAY 审中-公开
标题翻译：电极阵列和使用印刷板在阵列上布置颗粒的方法
公开(公告)号：US20090278213A1
公开(公告)日：2009-11-12
申请号：US12117000
申请日：2008-05-08
申请人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
发明人： Tobias Kraus , Laurent Malaquin , Heiko Wolf
IPC分类号： H01L29/40 , H01L21/28
CPC分类号： G01N33/54366 , H01L24/11 , H01L24/13 , H01L2224/0362 , H01L2224/0401 , H01L2224/05554 , H01L2224/05567 , H01L2224/11003 , H01L2224/11334 , H01L2224/119 , H01L2224/13022 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/13178 , H01L2224/13181 , H01L2224/13184 , H01L2224/13186 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/053 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012
摘要： Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
摘要翻译：提供电极阵列及其制造方法，使用印版将导电颗粒排列成与电极阵列对准。在一个实施例中，半导体器件包括：半导体形貌，包括设置在半导体衬底上的电极阵列; 驻留在半导体形貌上的电介质层; 以及设置在电介质层中或电介质层上的至少一个导电颗粒与电极阵列中的至少一个对准。

4. 发明授权

US08028621B2 Three-dimensional structures and methods of fabricating the same using a printing plate 有权
标题翻译：三维结构及其制造方法使用印版
公开(公告)号：US08028621B2
公开(公告)日：2011-10-04
申请号：US12114146
申请日：2008-05-02
申请人： Tobias Kraus , Heiko Wolf
发明人： Tobias Kraus , Heiko Wolf
IPC分类号： H05K3/12 , H01L23/48
CPC分类号： B41F1/18 , B32B3/30 , B82Y40/00 , H01L24/11 , H01L24/13 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/11332 , H01L2224/1308 , H01L2224/13082 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/29499 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H05K3/06 , H05K3/102 , H05K3/12 , H05K3/245 , H05K2203/0113 , Y10T428/24612 , H01L2924/00014 , H01L2224/13099
摘要： Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
摘要翻译：制造三维结构的方法包括：将印版面与包含颗粒的悬浮液接触，以将颗粒排列在印版表面上的预定位置，所述预定位置包括横向邻近第二位置的第一位置; 将印版定位成印版面转向基片，第一位置与基片上的凸起对准; 使所述突起与设置在所述印刷版的第一位置处的第一颗粒层接触以将所述第一层颗粒转移到突出表面; 使打印板横向移动以将第二位置对准突起; 以及将设置在所述突起表面上的所述第一颗粒层与设置在所述印刷版的第二位置处的第二层颗粒接触，以将所述第二层颗粒转移到所述第一层颗粒的顶部。

5. 发明授权

US07520951B1 Method of transferring nanoparticles to a surface 有权
标题翻译：将纳米粒子转移到表面的方法
公开(公告)号：US07520951B1
公开(公告)日：2009-04-21
申请号：US12105122
申请日：2008-04-17
申请人： Heiko Wolf , Tobias Kraus
发明人： Heiko Wolf , Tobias Kraus
IPC分类号： B44C1/175 , B44C1/24 , B32B37/02 , B32B37/10 , B32B37/12 , D06N7/04 , B32B37/06 , B32B38/18 , B05D1/38
CPC分类号： B05D1/28 , Y10T156/1089 , Y10T156/1707 , Y10T156/1724
摘要： A method of transferring nanoparticles to a surface is provided. The method includes rotating a perimeter surface through a colloidal solution such that nanoparticles are captured by binding sites, removing liquid from the captured nanoparticles and rotating a take-up roll such that the captured nanoparticles contact a carrier surface. Moreover, the method includes removing the captured nanoparticles from the perimeter surface and transferring the nanoparticles to the carrier surface with a carrier adhesive material, rotating the carrier surface such that the transferred nanoparticles contact a target substrate, and removing the transferred nanoparticles from the carrier surface and transferring the transferred nanoparticles to the target substrate with a target substrate material.
摘要翻译：提供了将纳米颗粒转移到表面的方法。该方法包括使周边表面旋转通过胶体溶液，使得纳米颗粒被结合位点捕获，从捕获的纳米颗粒中除去液体并旋转卷取辊，使得捕获的纳米颗粒接触载体表面。此外，该方法包括从周边表面去除捕获的纳米颗粒，并用载体粘合剂材料将纳米颗粒转移到载体表面，使载体表面旋转，使得转移的纳米颗粒接触靶基质，并从载体表面除去转移的纳米颗粒并用目标衬底材料将转移的纳米颗粒转移到目标衬底。

6. 发明申请

US20090272285A1 THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE 有权
标题翻译：三维结构及使用印刷板制作相同方法
公开(公告)号：US20090272285A1
公开(公告)日：2009-11-05
申请号：US12114146
申请日：2008-05-02
申请人： Tobias Kraus , Heiko Wolf
发明人： Tobias Kraus , Heiko Wolf
IPC分类号： B41F1/18 , H01L21/44 , H01L23/48 , B44F7/00
CPC分类号： B41F1/18 , B32B3/30 , B82Y40/00 , H01L24/11 , H01L24/13 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/11332 , H01L2224/1308 , H01L2224/13082 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/29499 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H05K3/06 , H05K3/102 , H05K3/12 , H05K3/245 , H05K2203/0113 , Y10T428/24612 , H01L2924/00014 , H01L2224/13099
摘要： Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
摘要翻译：制造三维结构的方法包括：将印版面与包含颗粒的悬浮液接触，以将颗粒排列在印版表面上的预定位置，所述预定位置包括横向邻近第二位置的第一位置; 将印版定位成印版面转向基片，第一位置与基片上的凸起对准; 使所述突起与设置在所述印刷版的第一位置处的第一颗粒层接触以将所述第一层颗粒转移到突出表面; 使打印板横向移动以将第二位置对准突起; 以及将设置在所述突起表面上的所述第一颗粒层与设置在所述印刷版的第二位置处的第二层颗粒接触，以将所述第二层颗粒转移到所述第一层颗粒的顶部。

7. 发明申请

US20110027499A1 RADIATION-ASSISTED NANOPARTICLE PRINTING 审中-公开
标题翻译：辐射辅助纳米复合印刷
公开(公告)号：US20110027499A1
公开(公告)日：2011-02-03
申请号：US12512975
申请日：2009-07-30
申请人： Heiko Wolf , Tobias Kraus , Andrea Decker
发明人： Heiko Wolf , Tobias Kraus , Andrea Decker
IPC分类号： B05D3/06
CPC分类号： B41M5/398 , H05K3/1275 , H05K3/207 , H05K2201/0257 , H05K2203/0113 , H05K2203/102 , H05K2203/107
摘要： A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate.
摘要翻译：一种纳米颗粒印刷方法，包括：使印版与目标基材接触，同时印版与目标基材接触，用强烈闪光的激光照射印刷板上的纳米颗粒，或使纳米颗粒进行微波辐射，使得能量选择性地转移到颗粒中，增加颗粒的局部温度，引起颗粒与靶基质的相互作用增加，并产生强连接并从印刷板上除去颗粒; 并从印刷基板上剥离印刷板。

8. 发明申请

US20110244192A1 THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE 审中-公开
标题翻译：三维结构及使用印刷板制作相同方法
公开(公告)号：US20110244192A1
公开(公告)日：2011-10-06
申请号：US13159662
申请日：2011-06-14
申请人： Tobias Kraus , Heiko Wolf
发明人： Tobias Kraus , Heiko Wolf
IPC分类号： B32B3/30 , B05D5/12 , B32B5/16
CPC分类号： B41F1/18 , B32B3/30 , B82Y40/00 , H01L24/11 , H01L24/13 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/11332 , H01L2224/1308 , H01L2224/13082 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/29499 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H05K3/06 , H05K3/102 , H05K3/12 , H05K3/245 , H05K2203/0113 , Y10T428/24612 , H01L2924/00014 , H01L2224/13099
摘要： Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
摘要翻译：制造三维结构的方法包括：将印版面与包含颗粒的悬浮液接触，以将颗粒排列在印版表面上的预定位置，所述预定位置包括横向邻近第二位置的第一位置; 将印版定位成印版面转向基片，第一位置与基片上的凸起对准; 使所述突起与设置在所述印刷版的第一位置处的第一颗粒层接触以将所述第一层颗粒转移到突出表面; 使打印板横向移动以将第二位置对准突起; 以及将设置在所述突起表面上的所述第一颗粒层与设置在所述印刷版的第二位置处的第二层颗粒接触，以将所述第二层颗粒转移到所述第一层颗粒的顶部。

9. 发明授权

US08821965B2 Accurate deposition of nano-objects on a surface 有权
标题翻译：将纳米物体精确沉积在表面上
公开(公告)号：US08821965B2
公开(公告)日：2014-09-02
申请号：US13456596
申请日：2012-04-26
申请人： Urs T. Duerig , Felix Holzner , Cyrill Kuemin , Armin W. Knoll , Philip Paul , Heiko Wolf
发明人： Urs T. Duerig , Felix Holzner , Cyrill Kuemin , Armin W. Knoll , Philip Paul , Heiko Wolf
IPC分类号： B05D5/12 , B82Y30/00 , B82Y40/00 , B82B3/00 , C23C14/04 , C23C18/04 , C23C18/06 , C23C18/08
CPC分类号： B82B3/0076 , B05D5/12 , B82B3/0014 , B82Y30/00 , B82Y40/00 , C23C14/04 , C23C18/04 , C23C18/06 , C23C18/08
摘要： The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate
摘要翻译：本发明特别涉及用于在表面上沉积纳米物体的方法。该方法包括：在其一个表面上提供具有表面图案的基底; 在所述基板的所述表面上提供转印层; 在与所述表面图案限定的位置处平行于所述基板的所述表面平行于所述转印层的表面上的功能化区域，例如与纳米物体呈现增强的结合相互作用; 沉积纳米物体并使其在功能化区域被捕获; 并通过能量刺激来减少转移层，以将聚合物分解成蒸发单元，直到纳米物体到达基底表面。本发明还提供一种半导体器件，其包括衬底和准确地设置在衬底上的纳米物体

10. 发明申请

US20130009287A1 ACCURATE DEPOSITION OF NANO-OBJECTS ON A SURFACE 有权
标题翻译：精确沉积在表面上的纳米对象
公开(公告)号：US20130009287A1
公开(公告)日：2013-01-10
申请号：US13606326
申请日：2012-09-07
申请人： Urs T. Duerig , Felix Holzner , Cyrill Kuemin , Armin W. Knoll , Philip Paul , Heiko Wolf
发明人： Urs T. Duerig , Felix Holzner , Cyrill Kuemin , Armin W. Knoll , Philip Paul , Heiko Wolf
IPC分类号： H01L29/02
CPC分类号： B82B3/0076 , B05D5/12 , B82B3/0014 , B82Y30/00 , B82Y40/00 , C23C14/04 , C23C18/04 , C23C18/06 , C23C18/08
摘要： The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate.
摘要翻译：本发明特别涉及用于在表面上沉积纳米物体的方法。该方法包括：在其一个表面上提供具有表面图案的基底; 在所述基板的所述表面上提供转印层; 在与所述表面图案限定的位置处平行于所述基板的所述表面平行于所述转印层的表面上的功能化区域，例如与纳米物体呈现增强的结合相互作用; 沉积纳米物体并使其在功能化区域被捕获; 并通过高能刺激来减薄转移层，以将聚合物分解成蒸发单元，直到纳米物体到达基底表面。本发明还提供一种半导体器件，其包括衬底和准确地设置在衬底上的纳米物体。

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