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2. 发明授权

US5785585A Polish pad conditioner with radial compensation 失效
标题翻译：抛光垫调节器带径向补偿
公开(公告)号：US5785585A
公开(公告)日：1998-07-28
申请号：US529823
申请日：1995-09-18
申请人： Paul Anthony Manfredi , Richard Alan Bartley , Raymond George Morris , Timothy Scott Chamberlin
发明人： Paul Anthony Manfredi , Richard Alan Bartley , Raymond George Morris , Timothy Scott Chamberlin
IPC分类号： B24B53/007 , B24B53/017 , B24B5/00
CPC分类号： B24B53/017
摘要： An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.
摘要翻译：描述了适用于原位使用的抛光垫的调理装置和调整方法。该装置由楔形调节板组成，其宽度根据其长度而变化，其确切几何形状是抛光工艺对抛光垫进行调理的径向效应的函数。调理板搁置在抛光垫上，并被一个宽松的框架围绕，该框架将调节板相对于旋转的抛光台固定，防止调节板的横向运动，但允许板沿垂直方向移动，它可以平放在抛光垫上。调理板的底面具有粗糙表面，其用于研磨抛光垫并将其调节到由调节板在抛光垫上的向下的力，调节板底面的粗糙度，以及调理板与抛光垫表面接触的时间。

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