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1. 发明授权

US4564426A Process for the deposition of palladium-nickel alloy 失效
标题翻译：钯 - 镍合金沉积工艺
公开(公告)号：US4564426A
公开(公告)日：1986-01-14
申请号：US723371
申请日：1985-04-15
申请人： Timothy P. Henning , Robert D. Topa
发明人： Timothy P. Henning , Robert D. Topa
IPC分类号： C25D3/56
CPC分类号： C25D3/567
摘要： A palladium-nickel alloy is deposited onto a substrate by electroplating from a plating bath containing palladosammine chloride, nickel ion source, ammonium sulfate, ammonium chloride, and sufficient ammonium hydroxide to provide a pH of about 7.0 to about 8.3 at a temperature of about 60.degree. F. to about 90.degree. F.
摘要翻译：通过从包含氯化帕拉多胺，镍离子源，硫酸铵，氯化铵和足够的氢氧化铵的电镀液中电镀，将钯 - 镍合金沉积在基底上，以在约60℃的温度下提供约7.0至约8.3的pH °F至约90°F

2. 发明授权

US5006917A Thermocompression bonding in integrated circuit packaging 失效
标题翻译：集成电路封装中的热压接
公开(公告)号：US5006917A
公开(公告)日：1991-04-09
申请号：US398799
申请日：1989-08-25
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/60 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

3. 发明授权

US5120418A Lead frame plating apparatus for thermocompression bonding 失效
标题翻译：用于热塑性接合的导线框架镀膜设备
公开(公告)号：US5120418A
公开(公告)日：1992-06-09
申请号：US664388
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.cm范围内的强电负电镀浴中镀金而制成。当前密度。提供了用于电镀不同区域的电镀装置，具有不同的电负性条件，具有独立供电的阳极。

4. 发明授权

US5148261A Thermocompression bonding in integrated circuit packaging 失效
标题翻译：集成电路封装中的热压接
公开(公告)号：US5148261A
公开(公告)日：1992-09-15
申请号：US646413
申请日：1991-01-28
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , Y10T428/12438
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.mm的强电负极电镀浴中镀金而制成。当前密度。提供用于电镀不同区域的电镀装置，具有不同的电负性条件，具有单独的独立供电的阳极。

5. 发明授权

US06626196B2 Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing 失效
标题翻译：在湿化学处理之前排气和排气方法比较小的高比例钻孔
公开(公告)号：US06626196B2
公开(公告)日：2003-09-30
申请号：US09882235
申请日：2001-06-15
申请人： Francis J. Downes, Jr. , Raymond T. Galasco , Lawrence P. Lehman , Robert D. Topa
发明人： Francis J. Downes, Jr. , Raymond T. Galasco , Lawrence P. Lehman , Robert D. Topa
IPC分类号： B08B312
CPC分类号： H05K3/0088 , B01D19/0068 , B01D19/0078 , B08B3/12 , C23C18/1851 , Y10S134/902 , Y10S438/906
摘要： An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the reliable plating thereof. This is carried out through the utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating process, thereby enabling all of the vias or holes to be degassed; in effect, having air removed and the vias or holes filled with liquid; thereby allowing subsequent process cleansing solutions to easily flow into the respective holes or vias in order to facilitate the electroless copper plating process.
摘要翻译：用于在湿化学处理（包括通孔的铜电镀）之前存在于诸如印刷电路板的面板中的小的高深度比钻孔或通孔的排气和方法，以便从所述孔中除去任何空气或气泡趋向于抑制其可靠电镀的通孔。这通过在清洁化学镀处理之前的液槽中利用超声预润湿来进行，从而使所有的通孔或孔被脱气; 实际上，除去空气和填充有液体的通孔或孔; 从而允许随后的工艺清洁溶液容易地流入相应的孔或通孔，以便于无电镀铜处理。

6. 发明授权

US5135155A Thermocompression bonding in integrated circuit packaging 失效
公开(公告)号：US5135155A
公开(公告)日：1992-08-04
申请号：US664359
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

7. 发明授权

US06228246B1 Removal of metal skin from a copper-Invar-copper laminate 失效
标题翻译：从铜Inv铜层压板去除金属表皮
公开(公告)号：US06228246B1
公开(公告)日：2001-05-08
申请号：US09347581
申请日：1999-07-01
申请人： Madhav Datta , Raymond T. Galasco , Lawrence P. Lehman , Roy H. Magnuson , Robin A. Susko , Robert D. Topa
发明人： Madhav Datta , Raymond T. Galasco , Lawrence P. Lehman , Roy H. Magnuson , Robin A. Susko , Robert D. Topa
IPC分类号： C25F300
CPC分类号： H05K3/44 , C25F3/00 , H05K3/07 , H05K2201/0338 , H05K2201/0347 , H05K2203/0285 , H05K2203/0361
摘要： A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a substrate that includes the laminate as an inner plane. Removing the metal skin combines electrochemical polishing (ECP) with ultrasonics. ECP dissolves the metal skin in an acid solution, while ultrasonics agitates and circulates the acid solution to sweep the metal skin out of the through hole. ECP is activated when a pulse power supply is turned on and generates a periodic voltage pulse from a pulse power supply whose positive terminal is coupled to the laminate and whose negative terminal is coupled to a conductive cathode. After the metal skin is removed, the laminate is differentially etched such that the copper is etched at a faster rate than the Invar. To prevent the differential etching, a copper layer is formed on a surface of the substrate with an electrical resistance R1 between the copper layer and the positive terminal of the pulse power supply. Additionally, an electrical resistance R2 is formed between the laminate and the positive terminal of the pulse power supply. Adjustment of R1 and R2 controls the relative etch rates of the copper and the Invar.
摘要翻译：从铜 - 堇青铜（CIC）层压板的通孔表面去除金属表皮而不会引起层压板的不均匀回蚀的方法。金属皮肤包括沉积在通孔表面上的碎屑，因为通孔是通过激光或机械钻孔形成的，所述基底包括层压体作为内平面。去除金属皮肤结合电化学抛光（ECP）与超声波。 ECP将金属皮肤溶解在酸性溶液中，同时超声波搅拌并循环酸溶液以将金属皮肤从通孔中扫出。当脉冲电源接通时，ECP被激活，并从脉冲电源产生周期性的电压脉冲，该脉冲电源的正极端子耦合到层压板并且其负极端子连接到导电阴极。在去除金属表皮之后，层压体被差异蚀刻，使得以比Invar更快的速度蚀刻铜。为了防止差分蚀刻，在衬底的表面上在铜层和脉冲电源的正端之间具有电阻R1形成铜层。此外，在层压体和脉冲电源的正极端之间形成电阻R2。 R1和R2的调整控制铜和殷钢的相对蚀刻速率。

8. 发明授权

US5242569A Thermocompression bonding in integrated circuit packaging 失效
标题翻译：集成电路封装中的热压接
公开(公告)号：US5242569A
公开(公告)日：1993-09-07
申请号：US664399
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.mm的强电负极电镀浴中镀金而制成。当前密度。提供用于电镀不同区域的电镀装置，具有不同的电负性条件，具有单独的独立供电的阳极。

9. 发明授权

US5237743A Method of forming a conductive end portion on a flexible circuit member 失效
标题翻译：在柔性电路部件上形成导电端部的方法
公开(公告)号：US5237743A
公开(公告)日：1993-08-24
申请号：US901054
申请日：1992-06-19
申请人： Raymond A. Busacco , Fletcher W. Chapin , David W. Dranchak , Jaynal A. Molla , George J. Saxenmeyer, Jr. , Robert D. Topa
发明人： Raymond A. Busacco , Fletcher W. Chapin , David W. Dranchak , Jaynal A. Molla , George J. Saxenmeyer, Jr. , Robert D. Topa
IPC分类号： H01R43/00 , H01R4/26 , H01R13/03 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/36 , H05K3/40
CPC分类号： H01R13/2435 , H01R12/714 , H01R13/03 , H01R4/26 , H05K3/403 , H01R43/16 , H05K1/118 , H05K2201/0373 , H05K2201/09172 , H05K3/365 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224
摘要： A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.

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