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1. 发明授权

US06496053B1 Corrosion insensitive fusible link using capacitance sensing for semiconductor devices 失效
标题翻译：使用半导体器件的电容感测的腐蚀不敏感的熔丝
公开(公告)号：US06496053B1
公开(公告)日：2002-12-17
申请号：US09416977
申请日：1999-10-13
申请人： Timothy Daubenspeck , Kurt R. Kimmel , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , W David Pricer , Jed H. Rankin
发明人： Timothy Daubenspeck , Kurt R. Kimmel , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , W David Pricer , Jed H. Rankin
IPC分类号： H01L2900
CPC分类号： H01L28/40 , H01L23/5258 , H01L2924/0002 , Y10S257/91 , H01L2924/00
摘要： A structure and method for a programming device or a fuse includes a capacitive circuit having a capacitance which is alterable. The capacitive circuit can include a first capacitor, a fuse link connected to the first capacitor and a second capacitor connected to the fuse link, wherein removing a portion of the fuse link changes the capacitance.
摘要翻译：用于编程设备或熔丝的结构和方法包括具有可改变的电容的电容电路。电容电路可以包括第一电容器，连接到第一电容器的熔丝链和连接到熔丝链路的第二电容器，其中去除熔丝链的一部分改变电容。

2. 发明授权

US06835973B2 Antifuse for use with low &kgr; dielectric foam insulators 失效
标题翻译：用于低kappa电介质泡沫绝缘子的防腐剂
公开(公告)号：US06835973B2
公开(公告)日：2004-12-28
申请号：US10159573
申请日：2002-05-31
申请人： Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
发明人： Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
IPC分类号： H01L2710
CPC分类号： H01L23/5254 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： A fusible link for a semiconductor device comprises an insulating substrate and a conductive line pair on the surface of the insulating substrate, with the conductive line pair having spaced ends. A polymer is disposed over the insulating substrate and between the conductive line pair ends. The polymer is capable of being changed from a non-conductive to a conductive state upon exposure to an energy beam. Preferably, the polymer comprises a polyimide, more preferably, a polymer/onium salt mixture, most preferably, a polyaniline polymer doped with a triphenylsufonium salt. The link may further comprise a low &kgr; nanopore/nanofoam dielectric material adjacent the conductive line ends.
摘要翻译：用于半导体器件的可熔连接件包括在绝缘衬底的表面上的绝缘衬底和导电线对，导电线对具有间隔开的端部。聚合物设置在绝缘基板之上和导线对端之间。聚合物能够在暴露于能量束时从非导电状态改变为导电状态。优选地，聚合物包括聚酰亚胺，更优选聚合物/鎓盐混合物，最优选掺杂有三苯基鎓盐的聚苯胺聚合物。该连接可以进一步包括邻近导线末端的低kappa纳米孔/纳米电流介电材料。

3. 发明授权

US06458630B1 Antifuse for use with low k dielectric foam insulators 失效
标题翻译：用于低k电介质泡沫绝缘子的防腐剂
公开(公告)号：US06458630B1
公开(公告)日：2002-10-01
申请号：US09417853
申请日：1999-10-14
申请人： Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
发明人： Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
IPC分类号： H01L2128
CPC分类号： H01L23/5254 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： A fusible link for a semiconductor device comprises an insulating substrate and a conductive line pair on the surface of the insulating substrate, with the conductive line pair having spaced ends. A polymer is disposed over the insulating substrate and between the conductive line pair ends. The polymer is capable of being changed from a non-conductive to a conductive state upon exposure to an energy beam. Preferably, the polymer comprises a polyimide, more preferably, a polymer/onium salt mixture, most preferably, a polyaniline polymer doped with a triphenylsufonium salt. The link may further comprise a low k nanopore/nanofoam dielectric material adjacent the conductive line ends.
摘要翻译：用于半导体器件的可熔连接件包括在绝缘衬底的表面上的绝缘衬底和导电线对，导电线对具有间隔开的端部。聚合物设置在绝缘基板之上和导线对端之间。聚合物能够在暴露于能量束时从非导电状态改变为导电状态。优选地，聚合物包括聚酰亚胺，更优选聚合物/鎓盐混合物，最优选掺杂有三苯基鎓盐的聚苯胺聚合物。该连接可以进一步包括邻近导电线端部的低k纳米孔/纳米空间电介质材料。

4. 发明授权

US06335229B1 Inductive fuse for semiconductor device 失效
标题翻译：半导体器件感应保险丝
公开(公告)号：US06335229B1
公开(公告)日：2002-01-01
申请号：US09417289
申请日：1999-10-13
申请人： Wilbur D. Pricer , Rosemary A. Previti-Kelly , William T. Motsiff
发明人： Wilbur D. Pricer , Rosemary A. Previti-Kelly , William T. Motsiff
IPC分类号： H01L2182
CPC分类号： H01L23/5256 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for blowing a fuse including removing an insulator above a fuse link and etching the fuse link.
摘要翻译：一种用于熔断保险丝的方法和结构，包括去除熔丝链上方的绝缘体并蚀刻熔丝。

5. 发明授权

US06713838B2 Inductive fuse for semiconductor device 失效
标题翻译：半导体器件感应保险丝
公开(公告)号：US06713838B2
公开(公告)日：2004-03-30
申请号：US10003587
申请日：2001-10-29
申请人： Wilbur D. Pricer , Rosemary A. Previti-Kelly , William T. Motsiff
发明人： Wilbur D. Pricer , Rosemary A. Previti-Kelly , William T. Motsiff
IPC分类号： H01L2900
CPC分类号： H01L23/5256 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for blowing a fuse including removing an insulator above a fuse link and etching the fuse link.
摘要翻译：一种用于熔断保险丝的方法和结构，包括去除熔丝链上方的绝缘体并蚀刻熔丝。

6. 发明授权

US5326430A Cooling microfan arrangements and process 失效
公开(公告)号：US5326430A
公开(公告)日：1994-07-05
申请号：US164494
申请日：1993-12-07
申请人： John E. Cronin , Rosemary A. Previti-Kelly , James G. Ryan , Timothy D. Sullivan
发明人： John E. Cronin , Rosemary A. Previti-Kelly , James G. Ryan , Timothy D. Sullivan
IPC分类号： F04D25/08 , H02N1/00 , H01L21/306 , B44C1/22 , C03C15/00 , C23F1/00
CPC分类号： F04D25/08 , H02N1/004
摘要： A micro electrostatic cooling fan arrangement is provided which includes a heat source having a planar surface, a stator attached to the heat source, an axle attached to the heat source and spaced from the stator, a rotary element including a hub having an aperture therein and a fan blade, the axle passing through the aperture of the hub and the fan blade having a major surface thereof disposed at an angle with respect to the surface of the heat source and attached to the hub at one end, with the other end of the fan blade being adjacent to but spaced from the stator and a voltage source applied to the stator having sufficient voltage to charge the fan blade. Also, a process is provided for making a microfan which includes forming a strip of sacrificial material on a planar surface of a heat source, applying a spin on insulating layer over the heat source and the strip for producing a sloping surface extending from about the top of the strip toward the planar surface of the heat source, applying a layer of conductive material on the sloping surface and strip and defining from the layer of conductive material a fan blade on the sloping surface of the spin on insulating layer and a stator at one end of the fan blade.

7. 发明授权

US5043789A Planarizing silsesquioxane copolymer coating 失效
标题翻译：平均倍半硅氧烷共聚物涂层
公开(公告)号：US5043789A
公开(公告)日：1991-08-27
申请号：US494006
申请日：1990-03-15
申请人： Harold G. Linde , Rosemary A. Previti-Kelly
发明人： Harold G. Linde , Rosemary A. Previti-Kelly
IPC分类号： C09D183/08 , C09D183/00 , H01L21/312
CPC分类号： H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3121 , H01L21/3122
摘要： An improved insulating layer is formed by applying to a suitable substrate an organic solution, prepared by reacting an aminoalkoxysilane monomer, an arylalkoxysilane or arylsilazane monomer and water in a solvent, and then heating the coated substrate under conditions so as to evaporate the solvent and form a layer of cured ladder-type silsesquioxane copolymer. The insulating layer, which demonstrates excellent planarizing and thermal stability characteristics, is particularly useful in semiconductor device applications.

8. 发明授权

US5006488A High temperature lift-off process 失效
标题翻译：高温剥离过程
公开(公告)号：US5006488A
公开(公告)日：1991-04-09
申请号：US417935
申请日：1989-10-06
申请人： Rosemary A. Previti-Kelly
发明人： Rosemary A. Previti-Kelly
IPC分类号： H01L21/302 , H01L21/027 , H01L21/28 , H01L21/3065 , H01L21/3205
CPC分类号： H01L21/28 , H01L21/0272 , Y10S148/075 , Y10S148/10 , Y10S438/951
摘要： Disclosed is a process for forming a pattern of metallization on a processed semiconductor substrate, under high temperature conditions, employing a polyimide precursor material as a lift-off layer. Advantageously, the material is photosensitive, and, after exposure and development, the portions of the layer remaining on the substrate can be completely and readily removed with conventional solvents.

9. 发明授权

US07144490B2 Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer 有权
标题翻译：使用钛 - 钨种子层选择性地电镀半导体器件I / O焊盘的方法
公开(公告)号：US07144490B2
公开(公告)日：2006-12-05
申请号：US10707047
申请日：2003-11-18
申请人： Tien-Jen Cheng , David E. Eichstadt , Jonathan H. Griffith , Sarah H. Knickerbocker , Rosemary A. Previti-Kelly , Roger A. Quon , Kamalesh K. Srivastava , Keith Kwong-Hon Wong
发明人： Tien-Jen Cheng , David E. Eichstadt , Jonathan H. Griffith , Sarah H. Knickerbocker , Rosemary A. Previti-Kelly , Roger A. Quon , Kamalesh K. Srivastava , Keith Kwong-Hon Wong
IPC分类号： C25D5/02 , C25D7/12
CPC分类号： H01L24/13 , C25D5/022 , C25D5/12 , C25D7/123 , H01L24/11 , H01L2224/03912 , H01L2224/0401 , H01L2224/05018 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05558 , H01L2224/05562 , H01L2224/05644 , H01L2224/1147 , H01L2224/1148 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2224/29099 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： A method for selective electroplating of a semiconductor input/output (I/O) pad includes forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad. A seed layer is formed over the TiW layer, and portions of the seed layer are selectively removed such that remaining seed layer material corresponds to a desired location of interconnect metallurgy for the I/O pad. At least one metal layer is electroplated over the remaining seed layer material, using the TiW layer as a conductive electroplating medium.
摘要翻译：一种用于半导体输入/输出（I / O）焊盘的选择性电镀的方法包括在半导体衬底上的钝化层上形成钛 - 钨（TiW）层，所述TiW层进一步延伸到形成在钝化层中的开口中暴露I / O焊盘，使得TiW层覆盖开口的侧壁和I / O焊盘的顶表面。在TiW层上形成种子层，并且选择性地去除种子层的部分，使得剩余的种子层材料对应于用于I / O焊盘的互连冶金的期望位置。使用TiW层作为导电电镀介质，在剩余的种子层材料上电镀至少一层金属层。

10. 发明授权

US5296775A Cooling microfan arrangements and process 失效
标题翻译：冷却微管安排和工艺
公开(公告)号：US5296775A
公开(公告)日：1994-03-22
申请号：US950621
申请日：1992-09-24
申请人： John E. Cronin , Rosemary A. Previti-Kelly , James G. Ryan , Timothy D. Sullivan
发明人： John E. Cronin , Rosemary A. Previti-Kelly , James G. Ryan , Timothy D. Sullivan
IPC分类号： F04D25/08 , H02N1/00
CPC分类号： F04D25/08 , H02N1/004
摘要： A micro electrostatic cooling fan arrangement is provided which includes a heat source having a planar surface, a stator attached to the heat source, an axle attached to the heat source and spaced from the stator, a rotary element including a hub having an aperture therein and a fan blade, the axle passing through the aperture of the hub and the fan blade having a major surface thereof disposed at an angle with respect to the surface of the heat source and attached to the hub at one end, with the other end of the fan blade being adjacent to but spaced from the stator and a voltage source applied to the stator having sufficient voltage to charge the fan blade.Also, a process is provided for making a microfan which includes forming a strip of sacrificial material on a planar surface of a heat source, applying a spin on insulating layer over the heat source and the strip for producing a sloping surface extending from about the top of the strip toward the planar surface of the heat source, applying a layer of conductive material on the sloping surface and strip and defining from the layer of conductive material a fan blade on the sloping surface of the spin on insulating layer and a stator at one end of the fan blade.
摘要翻译：提供一种微静电冷却风扇装置，其包括具有平坦表面的热源，附接到热源的定子，附接到热源并与定子间隔开的轴;旋转元件，包括其中具有孔的旋转元件，风扇叶片，通过轮毂的孔的轴和风扇叶片的主表面相对于热源的表面设置成一定角度并且在一端附接到轮毂，而另一端风扇叶片与定子相邻但间隔开，并且施加到定子的电压源具有足够的电压以对风扇叶片充电。此外，提供了一种制造微纤维的方法，其包括在热源的平坦表面上形成牺牲材料条，在绝热层上施加旋涂在热源和带上，用于产生从顶部延伸的倾斜表面的条带朝向热源的平面表面，在倾斜表面上施加一层导电材料，并且从导电材料层划分并限定绝缘层上的自旋的倾斜表面上的风扇叶片和一个定子上的风扇叶片风扇叶片的末端。

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