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    • 10. 发明授权
    • Device for the simultaneous double-side grinding of a workpiece in wafer form
    • 用于以晶圆形式同时双面研磨工件的装置
    • US06997779B2
    • 2006-02-14
    • US11070297
    • 2005-03-02
    • Joachim JungeRobert Weiss
    • Joachim JungeRobert Weiss
    • B24B7/00
    • B24B37/08B24B41/061B24B49/08H01L21/02013
    • A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
    • 用于同时双面研磨工件晶片的装置具有两个共线研磨轮和两个相对定位用于工件的静压轴承的水平面,每个具有至少一个静压轴承和用于测量工件之间的间隔的至少一个动压力管 和氢键。 面向工件的水力平台的表面是非平面构造,其轮廓是这样的,使得表面和工件之间的间距在靠近研磨轮的靠近水槽的边缘处采取最小值, 磨轮。 在另一实施例中,液体和磨损材料可以从动压管附近排出的至少一个孔靠近每个动压管。