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1. 发明授权

US07335063B2 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US07335063B2
公开(公告)日：2008-02-26
申请号：US11635090
申请日：2006-12-07
申请人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
发明人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

2. 发明申请

US20090011641A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR 有权
标题翻译：高速，高密度电气连接器
公开(公告)号：US20090011641A1
公开(公告)日：2009-01-08
申请号：US11958457
申请日：2007-12-18
申请人： THOMAS S. COHEN , Brian Kirk , Marc B. Cartier, JR.
发明人： THOMAS S. COHEN , Brian Kirk , Marc B. Cartier, JR.
IPC分类号： H01R13/648 , H01R13/02 , H01R43/00
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地间隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

3. 发明授权

US07163421B1 High speed high density electrical connector 有权
标题翻译：高速高密度电连接器
公开(公告)号：US07163421B1
公开(公告)日：2007-01-16
申请号：US11183564
申请日：2005-07-18
申请人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
发明人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

4. 发明授权

US07794278B2 Electrical connector lead frame 有权
标题翻译：电连接器引线框架
公开(公告)号：US07794278B2
公开(公告)日：2010-09-14
申请号：US12062581
申请日：2008-04-04
申请人： Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier, Jr. , David Manter
发明人： Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier, Jr. , David Manter
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R13/6471 , H01R13/6474 , H01R13/6585 , H01R13/6587
摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
摘要翻译：具有高速差动电连接器的电气互连系统。连接器由包含导电元件列的晶片组装，其中一些形成差分对。每列可以包括相邻的信号导体对的接地导体。接地导体可以比信号导体更宽，相邻的信号导体对之间的接地导体宽于位于至少一些列的端部的接地导体。每个导电元件可以在匹配的接触部分中端部，该配合接触部分定位成接合配合连接器中的互补接触元件。一些成对的信号导体的配合接触部分可以相对于列旋转。安装有差分信号连接器的印刷电路板可以在信号导体对周围形成细长的止动片。

5. 发明授权

US07753731B2 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US07753731B2
公开(公告)日：2010-07-13
申请号：US11958457
申请日：2007-12-18
申请人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
发明人： Thomas S. Cohen , Brian Kirk , Marc B. Cartier, Jr.
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

6. 发明授权

US08864521B2 High frequency electrical connector 有权
标题翻译：高频电连接器
公开(公告)号：US08864521B2
公开(公告)日：2014-10-21
申请号：US13029052
申请日：2011-02-16
申请人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
发明人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
IPC分类号： H01R13/648 , H01R12/73 , H01R13/6585 , H01R13/6477 , H01R13/514 , H01R13/504 , H01R12/72 , H01R13/6587
CPC分类号： H01R13/6461 , H01R12/585 , H01R12/724 , H01R12/735 , H01R13/504 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/658 , H01R13/6585 , H01R13/6587 , H01R13/6598 , H01R24/62 , H01R24/68
摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
摘要翻译：一个改进的宽边耦合，开放引脚现场连接器。当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。该材料还可以减少串扰和模式转换。选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。有损材料可以选择性地定位在导电构件的匹配接触部分附近。描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。有损耗材料可替代地位于一对导电构件的宽侧之间。

7. 发明授权

US07581990B2 High speed, high density electrical connector with selective positioning of lossy regions 有权
标题翻译：高速，高密度电连接器，有选择地定位有损区域
公开(公告)号：US07581990B2
公开(公告)日：2009-09-01
申请号：US12062577
申请日：2008-04-04
申请人： Brian Kirk , Thomas S. Cohen
发明人： Brian Kirk , Thomas S. Cohen
IPC分类号： H01R9/03
CPC分类号： H01R13/514 , H01R12/52 , H01R12/724 , H01R13/6477 , H01R13/6599
摘要： An electrical interconnection system with high speed, high density electrical connectors. The connectors incorporate electrically lossy material, selectively positioned to reduce crosstalk without undesirably attenuating signals. The lossy material may be molded through ground conductors that separate adjacent differential pairs within columns of conductive elements in the connector. However, regions of lossy material may be set back from the edges of the ground conductors to avoid undesired attenuation of signals. Also, the lossy material may be positioned in multiple regions along the length of signal conductors. The regions may be separated by holes, notches, gaps or other openings in the lossy material, which can be simply formed as part of a molding operation.
摘要翻译：具有高速，高密度电连接器的电气互连系统。这些连接器包括电损耗材料，选择性地定位以减少串扰，而不会不期望地衰减信号。可以通过接地导体来模制有损耗的材料，所述接地导体在连接器中的导电元件的列内分隔相邻的差分对。然而，有损材料的区域可以从接地导体的边缘回退，以避免信号的不期望的衰减。此外，有损耗材料可以位于沿信号导体长度的多个区域中。这些区域可以由有损材料中的孔，缺口，间隙或其它开口分开，其可以简单地形成为模制操作的一部分。

8. 发明授权

US07794240B2 Electrical connector with complementary conductive elements 有权
标题翻译：具有互补导电元件的电连接器
公开(公告)号：US07794240B2
公开(公告)日：2010-09-14
申请号：US12062594
申请日：2008-04-04
申请人： Thomas S. Cohen , Brian Kirk
发明人： Thomas S. Cohen , Brian Kirk
IPC分类号： H01R9/09
CPC分类号： H01R12/727 , H01R13/6471 , H01R13/6477 , H01R13/6587 , Y10T29/49126
摘要： An electrical interconnection system with high speed, differential electrical connectors. The connectors are formed with columns of conductive elements, some of which carry signals some of which act as ground conductors. The conductive elements may contain projections to secure the conductive elements in a housing or to facilitate desirable current flow patterns. To avoid impedance discontinuities caused by the projections, adjacent conductive elements may be formed with complementary portions to provide a relatively uniform edge-to-edge spacing between signal and ground conductors along the length of the signal conductor. To manufacture such a connector in which both the signal and the ground conductive elements contain projections, the conductive elements carrying signals may be inserted into a housing from one side and the conductive elements acting as ground conductors may be inserted from an opposite side.
摘要翻译：具有高速差动电连接器的电气互连系统。连接器形成有导电元件列，其中一些具有一些作为接地导体的信号。导电元件可以包含用于将导电元件固定在壳体中的突起或者以便于所需的电流模式。为了避免由突起引起的阻抗不连续性，相邻的导电元件可以形成有互补部分，以沿着信号导体的长度提供在信号和接地导体之间的相对均匀的边缘到边缘间隔。为了制造这样的连接器，其中信号和接地导电元件都包含突起，承载信号的导电元件可以从一侧插入壳体中，并且用作接地导体的导电元件可以从相对侧插入。

9. 发明授权

US07722401B2 Differential electrical connector with skew control 有权
标题翻译：差分电连接器，带有偏斜控制
公开(公告)号：US07722401B2
公开(公告)日：2010-05-25
申请号：US12062570
申请日：2008-04-04
申请人： Brian Kirk , Thomas S. Cohen
发明人： Brian Kirk , Thomas S. Cohen
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/724 , H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. A housing for the wafer is formed with regions of higher and lower dielectric constant material. The regions of lower dielectric constant material are selectively positioned adjacent longer signal conductors of the differential pairs. The material may be preferentially placed along curved segments of the differential pair to reduce crosstalk in the connector while reducing skew.
摘要翻译：具有高速差动电连接器的电气互连系统。连接器由每个包含一列导电元件的晶片组装，其中一些形成差分对。用于晶片的壳体形成有较高和较低介电常数材料的区域。低介电常数材料的区域选择性地定位在差分对的更长的信号导体附近。材料可以优先放置在差动对的弯曲段上，以减少连接器中的串扰，同时减少偏斜。

10. 发明申请

US20080248660A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR WITH SELECTIVE POSITIONING OF LOSSY REGIONS 有权
标题翻译：高速，高密度电连接器，具有选择性位置的损失区域
公开(公告)号：US20080248660A1
公开(公告)日：2008-10-09
申请号：US12062577
申请日：2008-04-04
申请人： Brian Kirk , Thomas S. Cohen
发明人： Brian Kirk , Thomas S. Cohen
IPC分类号： H01R12/14
CPC分类号： H01R13/514 , H01R12/52 , H01R12/724 , H01R13/6477 , H01R13/6599
摘要： An electrical interconnection system with high speed, high density electrical connectors. The connectors incorporate electrically lossy material, selectively positioned to reduce crosstalk without undesirably attenuating signals. The lossy material may be molded through ground conductors that separate adjacent differential pairs within columns of conductive elements in the connector. However, regions of lossy material may be set back from the edges of the ground conductors to avoid undesired attenuation of signals. Also, the lossy material may be positioned in multiple regions along the length of signal conductors. The regions may be separated by holes, notches, gaps or other openings in the lossy material, which can be simply formed as part of a molding operation.
摘要翻译：具有高速，高密度电连接器的电气互连系统。这些连接器包括电损耗材料，选择性地定位以减少串扰，而不会不期望地衰减信号。可以通过接地导体来模制有损耗的材料，所述接地导体在连接器中的导电元件的列内分隔相邻的差分对。然而，有损材料的区域可以从接地导体的边缘回退，以避免信号的不期望的衰减。此外，有损耗材料可以位于沿信号导体长度的多个区域中。这些区域可以由有损材料中的孔，缺口，间隙或其它开口分开，其可以简单地形成为模制操作的一部分。

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