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1. 发明授权

US08864521B2 High frequency electrical connector 有权
标题翻译：高频电连接器
公开(公告)号：US08864521B2
公开(公告)日：2014-10-21
申请号：US13029052
申请日：2011-02-16
申请人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
发明人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
IPC分类号： H01R13/648 , H01R12/73 , H01R13/6585 , H01R13/6477 , H01R13/514 , H01R13/504 , H01R12/72 , H01R13/6587
CPC分类号： H01R13/6461 , H01R12/585 , H01R12/724 , H01R12/735 , H01R13/504 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/658 , H01R13/6585 , H01R13/6587 , H01R13/6598 , H01R24/62 , H01R24/68
摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
摘要翻译：一个改进的宽边耦合，开放引脚现场连接器。当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。该材料还可以减少串扰和模式转换。选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。有损材料可以选择性地定位在导电构件的匹配接触部分附近。描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。有损耗材料可替代地位于一对导电构件的宽侧之间。

2. 发明申请

US20110230095A1 HIGH FREQUENCY ELECTRICAL CONNECTOR 有权
标题翻译：高频电气连接器
公开(公告)号：US20110230095A1
公开(公告)日：2011-09-22
申请号：US13029052
申请日：2011-02-16
申请人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
发明人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
IPC分类号： H01R13/648
CPC分类号： H01R13/6461 , H01R12/585 , H01R12/724 , H01R12/735 , H01R13/504 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/658 , H01R13/6585 , H01R13/6587 , H01R13/6598 , H01R24/62 , H01R24/68
摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.
摘要翻译：一个改进的宽边耦合，开放引脚现场连接器。当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。该材料还可以减少串扰和模式转换。选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。有损材料可以选择性地定位在导电构件的匹配接触部分附近。描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。有损耗材料可替代地位于一对导电构件的宽侧之间。通过使用相对较低损耗的材料，当导电构件用于承载信号时的损耗相对较低，但是在连接到地面的对上提供明显的谐振衰减。结果，实现了信噪比的全面提高。

3. 发明授权

US09225085B2 High performance connector contact structure 有权
标题翻译：高性能连接器接触结构
公开(公告)号：US09225085B2
公开(公告)日：2015-12-29
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

4. 发明申请

US20140004724A1 PRINTED CIRCUIT BOARD FOR RF CONNECTOR MOUNTING 有权
标题翻译：用于射频连接器安装的打印电路板
公开(公告)号：US20140004724A1
公开(公告)日：2014-01-02
申请号：US13930531
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/70
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

5. 发明授权

US09583853B2 Low cost, high performance RF connector 有权
标题翻译：低成本，高性能射频连接器
公开(公告)号：US09583853B2
公开(公告)日：2017-02-28
申请号：US13930447
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/70 , H01R13/648 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

6. 发明授权

US09022806B2 Printed circuit board for RF connector mounting 有权
标题翻译：用于射频连接器安装的印刷电路板
公开(公告)号：US09022806B2
公开(公告)日：2015-05-05
申请号：US13930531
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

7. 发明申请

US20140004746A1 HIGH PERFORMANCE CONNECTOR CONTACT STRUCTURE 有权
标题翻译：高性能连接器接触结构
公开(公告)号：US20140004746A1
公开(公告)日：2014-01-02
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/71
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

8. 发明申请

US20140004726A1 LOW COST, HIGH PERFORMANCE RF CONNECTOR 有权
标题翻译：低成本，高性能RF连接器
公开(公告)号：US20140004726A1
公开(公告)日：2014-01-02
申请号：US13930447
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/71 , H01R43/20
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。结果，可以以低成本制造互连系统。可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

9. 发明授权

US08968026B2 High speed network interface 有权
标题翻译：高速网络接口
公开(公告)号：US08968026B2
公开(公告)日：2015-03-03
申请号：US13342929
申请日：2012-01-03
申请人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
发明人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
IPC分类号： H01R24/00 , H01R13/66 , H01R24/64 , H01R107/00 , H05K1/02
CPC分类号： H01R13/6633 , H01R24/64 , H01R2107/00 , H05K1/0243 , H05K2201/09163 , H05K2201/10189 , H05K2201/10446
摘要： A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.
摘要翻译：适用于高速网络的网络接口。该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。构成每个初级线圈的线可以用组成二次线的线扭绞。然后可以将这两个线圈共同缠绕在共同的芯上。变压器可以连接到共模扼流圈。隔离电路可以被封装成使得变压器和线圈处于一条直线上，并具有用于多个并联布置的隔离电路。接口电路可以封装在连接器壳体中，该壳体也可适用于高速性能。外壳可以并联接收多个隔离电路。壳体还可以包括配合接触部分，其中每对信号导体的配合触点沿着空腔的同一侧定位。

10. 发明授权

US08771016B2 High bandwidth connector 有权
标题翻译：高带宽连接器
公开(公告)号：US08771016B2
公开(公告)日：2014-07-08
申请号：US13034670
申请日：2011-02-24
申请人： Prescott B. Atkinson , Mark W. Gailus , Mark G. Hanrahan
发明人： Prescott B. Atkinson , Mark W. Gailus , Mark G. Hanrahan
IPC分类号： H01R13/648
CPC分类号： H01R13/6474 , H01R12/724 , H01R12/737 , H01R13/514 , H01R13/6477 , H01R13/6598
摘要： An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and/or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.
摘要翻译：提供了一种改进的开口引脚现场连接器，用于通过选择性地应用一种或多种用于控制电性能参数的技术来承载高速信号时提高性能。有损材料可以被定位成与连接器的导电元件相邻，以便减少成对的导电元件的谐振和/或为差分信号导体对提供期望的特性阻抗。有损耗材料可以被成形和定位以避免电容耦合，否则可能会增加串扰。在直角连接器中，有损耗的材料可以具有逐步增加的厚度，以便沿较长和较短的导电元件提供相当的损耗。导电元件可以被成形为平衡被选择用于承载差分信号的对的性能特性，而不管沿着行或列的取向。或者，导电元件可以具有用有损部分覆盖的变窄的区域，用于在支持DC信号传播的同时减少谐振。

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