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    • 10. 发明申请
    • EMI-PREVENTING SOCKET AND MANUFACTURING METHOD THEREOF
    • 防EMI插座及其制造方法
    • US20130017724A1
    • 2013-01-17
    • US13355305
    • 2012-01-20
    • Gang LIU
    • Gang LIU
    • H01R13/648B29C45/14
    • H01R43/24H01R13/6581Y10T29/49117Y10T29/49169
    • A manufacturing method for an EMI-preventing socket comprises the following steps of: providing an EMI-preventing element and a plurality of pins that include a ground pin; connecting a connecting portion of the EMI-preventing element to the ground pin; providing a mold; placing the EMI-preventing element, the ground pin and the other pins in the mold in such a manner that the EMI-preventing element surrounds the pins; and providing a molding material into the mold to wrap the pins, and a joint of the connection portion of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one ends of the pins are exposed out of the socket body of the EMI-preventing socket. An EMI-preventing socket made by the manufacturing method is also disclosed.
    • 防EMI插座的制造方法包括以下步骤:提供防EMI元件和包括接地引脚的多个引脚; 将防EMI元件的连接部分连接到接地引脚; 提供模具; 将防EMI元件,接地销和其他销放置在模具中,使得防EMI元件围绕销; 以及将模制材料提供到模具中以包裹销,以及防EMI元件的连接部分和接地销的接头,以形成防EMI插座的插座主体。 防EMI元件的一部分和销的一端从防EMI插座的插座主体露出。 还公开了一种通过制造方法制造的防EMI插座。