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1. 发明申请

US20120013222A1 Ultrasonic Sensor for Detecting and/or Scanning Objects 有权
标题翻译：用于检测和/或扫描物体的超声波传感器
公开(公告)号：US20120013222A1
公开(公告)日：2012-01-19
申请号：US12987514
申请日：2011-01-10
申请人： Thomas Herzog , Henning Heuer
发明人： Thomas Herzog , Henning Heuer
IPC分类号： H01L41/04 , H01L21/30
CPC分类号： G10K11/002
摘要： An ultrasonic sensor for detecting and/or scanning an object includes a substrate and a piezoelectric sensor unit arranged on or at this substrate and/or connected to this substrate. The rear side of the substrate facing away from the piezoelectric sensor unit has a surface structure including a plurality of elevated portions and recesses, with this surface structure being configured so that a diffuse scattering of ultrasonic waves incident on the rear side from the direction of the sensor unit takes place by it; and/or in that its elevated portions and/or recesses have a mean lateral extent in the range of 0.05 μm to 1 mm, preferably from 0.1 μm to 200 μm, preferably from 0.2 μm to 20 μm, and/or a mean lateral extent which is smaller than or equal to the wavelength of an ultrasonic wave which can be produced by the piezoelectric sensor unit.
摘要翻译：用于检测和/或扫描物体的超声波传感器包括布置在该基板上或其上的基板和压电传感器单元和/或连接到该基板。衬底的背离压电传感器单元的后侧具有包括多个升高部分和凹部的表面结构，该表面结构被配置为使得超声波的散射从入射到传感器单元由其进行; 和/或其高的部分和/或凹部具有0.05μm至1mm，优选为0.1μm至200μm，优选为0.2μm至20μm的平均横向范围，和/或平均横向范围其小于或等于可由压电传感器单元产生的超声波的波长。

2. 发明授权

US08468892B2 Ultrasonic sensor for detecting and/or scanning objects 有权
标题翻译：用于检测和/或扫描物体的超声波传感器
公开(公告)号：US08468892B2
公开(公告)日：2013-06-25
申请号：US12987514
申请日：2011-01-10
申请人： Thomas Herzog , Henning Heuer
发明人： Thomas Herzog , Henning Heuer
IPC分类号： G01N29/00
CPC分类号： G10K11/002
摘要： An ultrasonic sensor for detecting and/or scanning an object includes a substrate and a piezoelectric sensor unit arranged on or at this substrate and/or connected to this substrate. The rear side of the substrate facing away from the piezoelectric sensor unit has a surface structure including a plurality of elevated portions and recesses, with this surface structure being configured so that a diffuse scattering of ultrasonic waves incident on the rear side from the direction of the sensor unit takes place by it; and/or in that its elevated portions and/or recesses have a mean lateral extent in the range of 0.05 μm to 1 mm, preferably from 0.1 μm to 200 μm, preferably from 0.2 μm to 20 μm, and/or a mean lateral extent which is smaller than or equal to the wavelength of an ultrasonic wave which can be produced by the piezoelectric sensor unit.
摘要翻译：用于检测和/或扫描物体的超声波传感器包括布置在该基板上或其上的基板和压电传感器单元和/或连接到该基板。衬底的背离压电传感器单元的后侧具有包括多个升高部分和凹部的表面结构，该表面结构被配置为使得超声波的散射从入射到传感器单元由其进行; 和/或其高的部分和/或凹部具有在0.05μm至1mm的范围内的平均横向范围，优选为0.1μm至200μm，优选为0.2μm至20μm的平均横向范围和/或平均横向范围其小于或等于可由压电传感器单元产生的超声波的波长。

3. 发明授权

US4660346A Frame system, especially for racks and interior fixtures 失效
标题翻译：框架系统，特别适用于机架和内部固定装置
公开(公告)号：US4660346A
公开(公告)日：1987-04-28
申请号：US758418
申请日：1985-07-24
申请人： Frank Burger , Thomas Herzog
发明人： Frank Burger , Thomas Herzog
IPC分类号： E04C3/04 , E04C3/08 , E04C3/32 , E04H12/00
CPC分类号： E04C3/32 , E04C3/08 , E04C2003/0486 , E04C2003/0495
摘要： The frame system, especially for racks and interior fixtures comprises elongate lattice girders, including three chords not disposed in one plane and interconnected in transverse direction by ties. The ties are so arranged with respect to the chords that their legs define the sides of regular pyramids having square bases. Each of the pyramid surfaces is suitable for the connection of two lattice girders.
摘要翻译：框架系统，特别是用于机架和内部固定装置的装置包括细长的格子桁架，其包括三个未设置在一个平面中并且在横向方向上由连杆相互连接的和弦。领带相对于和弦如此布置，它们的腿限定具有正方形底座的普通金字塔的侧面。每个金字塔表面适合连接两个格子梁。

4. 发明授权

US06653732B2 Electronic component having a semiconductor chip 有权
标题翻译：具有半导体芯片的电子部件
公开(公告)号：US06653732B2
公开(公告)日：2003-11-25
申请号：US09850587
申请日：2001-05-07
申请人： Peter Alpern , Thomas Herzog , Wolfgang Sauert , Heinz Schauer , Rainer Tilgner
发明人： Peter Alpern , Thomas Herzog , Wolfgang Sauert , Heinz Schauer , Rainer Tilgner
IPC分类号： H01L2348
CPC分类号： H01L23/522 , H01L22/26 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.
摘要翻译：电子部件包括半导体芯片和/或测试结构。半导体芯片包括具有至少一个互连层，至少一个绝缘层和至少一个平坦化层的多层涂层。还公开了一种制造该组件的方法。在平坦化层中设置嵌入的粘附区域，由此粘附区域向相邻的绝缘层提供粘附表面。

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