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    • 3. 发明申请
    • HEAT SINK AND LIGHTING DEVICE COMPRISING A HEAT SINK
    • 包含散热器的散热和照明装置
    • US20100242519A1
    • 2010-09-30
    • US12746539
    • 2007-12-07
    • Nicole BreidenasselAlessandro ScordinoGiovanni Scilla
    • Nicole BreidenasselAlessandro ScordinoGiovanni Scilla
    • F25D27/00F28F7/00
    • F21V29/83F21V29/503F21V29/74F21V29/75F21V29/773F21Y2115/10
    • A heat sink may include a light source region for mounting a light source; a heat spreading and dissipation structure covering at least part of an exterior of the heat sink; wherein the structure comprises vertically aligned fins; wherein the structure comprises an air flow channel leading from a bottom region to a lateral region, the air flow channel being created by a gap between adjacent fins; wherein the light source region comprises an open cavity formed by a cavity wall comprising a light source mounting region adapted to receive the light source; wherein the fins are integrally connected to the exterior of the cavity wall; wherein the heat sink comprises a solid heat sink base extending from the light source mounting region to the exterior and protruding from the cavity wall; and wherein the structure is in thermal connection with the heat sink base.
    • 散热器可以包括用于安装光源的光源区域; 覆盖散热器外部的至少一部分的散热和散热结构; 其中所述结构包括垂直排列的翅片; 其中所述结构包括从底部区域引导到横向区域的空气流动通道,所述空气流动通道由相邻翅片之间的间隙产生; 其中所述光源区域包括由空腔壁形成的开放空腔,所述空腔壁包括适于接收所述光源的光源安装区域; 其中所述翅片一体地连接到所述腔壁的外部; 其中所述散热器包括从所述光源安装区域延伸到外部并从所述空腔壁突出的固体散热器基座; 并且其中所述结构与所述散热器基座热连接。
    • 4. 发明授权
    • Housing for electrical components
    • 电气元件外壳
    • US08665603B2
    • 2014-03-04
    • US12745696
    • 2007-12-03
    • Alessandro BriedaGiovanni ScillaAlessandro Scordino
    • Alessandro BriedaGiovanni ScillaAlessandro Scordino
    • H05K5/00
    • H05K7/1417
    • A housing for electrical components is provided. The housing may include a mouth portion to cooperate with a circuit board in an assembled condition wherein said circuit board is applied against said mouth portion of the housing. The housing may include at least one spring formation located at said mouth portion to cooperate with said circuit board to elastically urge said circuit board away from said mouth portion, and at least one hook-like formation extending from said mouth portion distally of said housing, said hook-like formation adapted to cooperate with said circuit board to retain said circuit board assembled to said housing against the force exerted by said spring formation.
    • 提供了用于电气部件的壳体。 壳体可以包括在组装状态下与电路板协作的口部分,其中所述电路板被施加在壳体的所述口部上。 壳体可以包括位于所述嘴部处的至少一个弹簧形式,以与所述电路板配合以弹性地迫使所述电路板远离所述口部;以及至少一个从所述口部向远侧延伸的钩状结构, 所述钩状结构适于与所述电路板配合,以克服所述弹簧形成所施加的力而将组装在所述壳体上的所述电路板保持在一起。
    • 5. 发明申请
    • Multiple-Cell LED Arrangement, Related Cell and Manufacturing Process
    • 多单元LED布置,相关单元和制造工艺
    • US20090284172A1
    • 2009-11-19
    • US11989608
    • 2006-07-27
    • Alessandro MaschiettoGiovanni Scilla
    • Alessandro MaschiettoGiovanni Scilla
    • H05B37/02H01L21/50
    • H05B33/083H05B33/086H05B33/0866
    • A LED arrangement includes: —a plurality of cells (0, 1, 2, 3) each including at least one respective LED having a binning class as a function of its emission wavelength (L1, L2) and brightness (B1, B2) characteristics, —a plurality of impedance elements (R0, R1, R2, R3) respectively coupled with the cells (0, 1, 2, 3), each impedance element (R0, R1, R2, R3) having an impedance value indicative of the binning class of the at least one LED included in the respective cell (0, 1, 2, 3), and —a controller (5) configured for sensing (6, 80, 81, 82, 83) the impedance values of the impedance elements (R0, R1, R2, R3) and adaptively drive each cell (0, 1, 2, 3) as a function of its binning class as indicated by the impedance element (R0, R1, R2, R3) coupled to the cell.
    • LED布置包括: - 多个单元(0,1,2,3),每个单元包括至少一个相应的LED,其具有作为其发射波长(L1,L2)和亮度(B1,B2)特性的函数的合并等级 分别与单元(0,1,2,3)耦合的多个阻抗元件(R0,R1,R2,R3),每个阻抗元件(R0,R1,R2,R3)具有指示 包括在相应单元(0,1,2,3)中的至少一个LED的组合类别,以及 - 被配置为感测(6,80,81,82,83)阻抗的阻抗的控制器(5) 元素(R0,R1,R2,R3),并自适应地驱动每个单元(0,1,2,3)作为其耦合类别的函数,如耦合到单元的阻抗元件(R0,R1,R2,R3)所示 。
    • 6. 发明申请
    • DRIVER ARRANGEMENT FOR LED LAMPS
    • LED灯具的驱动装置
    • US20070290625A1
    • 2007-12-20
    • US11762381
    • 2007-06-13
    • Xi Yuan HERui MaGiovanni Scilla
    • Xi Yuan HERui MaGiovanni Scilla
    • H05B41/16
    • H02M3/3385H05B33/0815Y02B20/347
    • A driver arrangement for LED light sources includes a transformer having primary and secondary winding connections. A first electronic switch (SW1) controls current flow through the primary winding, and a sensing resistor is coupled to the primary winding to produce a current sensing signal. A second electronic switch (SW2) is sensitive to the sensing signal to switch off SW1 as current flow through the primary winding reaches a given threshold. SW1 is thus alternatively turned-on and off in alternating turn-on and switch-off phases to power the LED light source via the secondary winding. SW1 is a field effect transistor, preferably a MOSFET. The transformer is SELV-rated. The sensing resistor may be a variable resistor to adjust the duration of the on/off phases to permit controlled dimming.
    • 用于LED光源的驱动装置包括具有初级和次级绕组连接的变压器。 第一电子开关(SW 1)控制通过初级绕组的电流,并且感测电阻器耦合到初级绕组以产生电流感测信号。 第二个电子开关(SW 2)对于感测信号敏感,以便通过初级绕组的电流流动达到给定的阈值来关闭SW 1。 SW 1因此在交替的导通和关断阶段中交替地导通和关闭,以通过次级绕组为LED光源供电。 SW 1是场效应晶体管,优选为MOSFET。 变压器额定电压为SELV。 感测电阻器可以是可变电阻器,以调节开/关相位的持续时间以允许受控的调光。