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1. 发明授权

US06771517B2 Printed circuit board stiffener 有权
标题翻译：印刷电路板加强筋
公开(公告)号：US06771517B2
公开(公告)日：2004-08-03
申请号：US10202377
申请日：2002-07-26
申请人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H02B101
CPC分类号： H05K7/1461 , H05K1/0271
摘要： Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure. The stiffener supports the printed circuit board to resist bending and flexing stresses. In yet another embodiment, a combination of one or more stiffeners and one or more frames are provided such that the printed circuit board resists bending and flexing stresses.
摘要翻译：提出了减少电路板弯曲的装置和方法。该装置被固定到印刷电路板上以提供用于减少弯曲和弯曲的刚性支撑。在一个实施例中，提供了刚性框架，其适于紧固到一个或多个部件并且被紧固到印刷电路板。该框架适于从PCB表面升高附接的部件，从而允许组件与PCB一起安装在PCB上。该框架适于占据印刷电路板表面积的最小值，以便不会使电子部件移位。在另一个实施例中，提供了一种细长的桁架状加强件，其适于紧固在印刷电路板的一侧并适于跨越印刷电路板。细长的加强件适于具有开放结构，以使冷却流动扰动和重量最小化。细长加强件包括形成桁架状结构的多个支脚。加强件支撑印刷电路板以抵抗弯曲和弯曲应力。在另一个实施例中，提供一个或多个加强件和一个或多个框架的组合，使得印刷电路板抵抗弯曲和弯曲应力。

2. 发明授权

US06512676B1 Printed circuit board stiffener 失效
公开(公告)号：US06512676B1
公开(公告)日：2003-01-28
申请号：US09619725
申请日：2000-07-20
申请人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H05K500
CPC分类号： H05K7/1461 , H05K1/0271
摘要： Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure. The stiffener supports the printed circuit board to resist bending and flexing stresses. In yet another embodiment, a combination of one or more stiffeners and one or more frames are provided such that the printed circuit board resists bending and flexing stresses.

3. 发明授权

US06487082B1 Printed circuit board component packaging 有权
标题翻译：印刷电路板组件包装
公开(公告)号：US06487082B1
公开(公告)日：2002-11-26
申请号：US09620059
申请日：2000-07-20
申请人： Thomas Alex Crapisi , Jeffrey S. Conger , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey S. Conger , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H05K710
CPC分类号： H05K1/181 , H05K1/023 , H05K1/18 , H05K2201/09418 , H05K2201/10022 , H05K2201/10545 , H05K2201/10689 , H05K2201/10734 , Y02P70/611
摘要： A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four processor boards. A printed circuit board is provided with conductive apertures and portions corresponding to an efficient Packaging allowing for the attachment of the processor-chip on one side of the printed circuit board, and the HUB and other supporting electronic components on the other side of the printed circuit board. This configuration allows for the close spacing of the electrical conductors of the HUB and the processors without the limitations imposed by the physical dimensions of the respective hardware. Additionally, a symmetric packaging of the conductive apertures and portions about a centerline of the printed circuit board allows for a simple design modification to allow for a two two-processor board to be manufactured from a similarly configured four-processor board.
摘要翻译：提出了一种印刷电路板装置，配置和方法，其提供了HUB和多个处理器之间的紧密间隔以及用于两个或四个处理器板的通用配置。印刷电路板设置有导电孔和对应于有效包装的部分，其允许在印刷电路板的一侧上附接处理器芯片，并且在印刷电路的另一侧上的HUB和其他支撑电子部件板。该配置允许HUB和处理器的电导体的紧密间隔，而不受相应硬件的物理尺寸施加的限制。此外，导电孔和印刷电路板的中心线周围的部分的对称封装允许简单的设计修改，以允许由类似配置的四处理器板制造两个两处理器板。

4. 发明授权

US06726505B2 Memory daughter card apparatus, configurations, and methods 有权
标题翻译：内存子卡设备，配置和方法
公开(公告)号：US06726505B2
公开(公告)日：2004-04-27
申请号：US10231511
申请日：2002-08-29
申请人： Stephen Cermak, III , Jeffrey S. Conger , David Paul Gruber , Thomas Alex Crapisi , Stephen A. Bowen , Steven Shafer , Mark Ronald Sikkink
发明人： Stephen Cermak, III , Jeffrey S. Conger , David Paul Gruber , Thomas Alex Crapisi , Stephen A. Bowen , Steven Shafer , Mark Ronald Sikkink
IPC分类号： H01R1360
CPC分类号： G06F1/184
摘要： New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion. The spacer portion includes pin coupler, relief portion, and aperture. The standoff is inserted into an aperture of a first printed circuit board and turned 90 degrees to secure the spacer portion and the foot to the first printed circuit board. An aperture in a second printed circuit board is slid over the alignment pin portion, wherein the second printed circuit board rests on the spacer portion. The fastening means is used through an aperture in the second printed circuit board communicating with the spacer portion.
摘要翻译：提供了新的方法和配置，其允许大的存储器容量以及存储器芯片与一个或多个处理器之间的最小化互连距离以及HUB芯片组。该装置，结构和方法包括提供具有一个或多个处理器导电部分和一个或多个彼此紧密接近的z轴连接器导电部分的印刷电路板，以及连接印刷电路一侧上的一个或多个处理器并将处理器板相对侧的存储器子卡的一个或多个z轴连接器连接起来。支座用于支撑和固定水平放置的z轴存储器子卡，并确保z轴子卡与处理器板之间的适当间隔。支座包括对准销部分和间隔部分。对准销部分包括对准部分，脚部和推动部分。间隔部分包括销联接器，浮雕部分和孔。将间隔插入第一印刷电路板的孔中并转动90度以将间隔件部分和脚固定到第一印刷电路板。第二印刷电路板中的孔径在对准销部分上滑动，其中第二印刷电路板搁置在间隔部分上。紧固装置通过与间隔件部分连通的第二印刷电路板中的孔而使用。

5. 发明授权

US06483699B1 Baffle system for air cooled computer assembly 有权
标题翻译：风冷电脑组装挡板系统
公开(公告)号：US06483699B1
公开(公告)日：2002-11-19
申请号：US09619818
申请日：2000-07-20
申请人： Richard B. Salmonson , David Paul Gruber , Stephen A. Bowen
发明人： Richard B. Salmonson , David Paul Gruber , Stephen A. Bowen
IPC分类号： H05K720
CPC分类号： H05K7/20727 , G06F1/20
摘要： An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs. One curved baffle is positioned between one memory ASIC and the outside of the PCB assembly and the other curved baffle is positioned between the other memory ASIC and the opposite side of the PCB assembly. The curved baffles include a curved portion, an extended portion and a front portion. The heat producing components include memory DIMMS, 4 130 watt microprocessors, and two 40 watt memory ASICs.
摘要翻译：包括印刷电路板组件或U型外壳的空气冷却的计算机组件。计算机组件还包括位于PCB组件一端的三个120mm风扇，其提供穿过PCB组件的气流。印刷电路板组件具有顶侧和底侧，包括在顶侧和底侧上的发热部件。一部分发热部件是垂直于空气流动方向定位的DIMM存储器。计算机组件还包括位于PCB组件附近的空气挡板系统。空气挡板系统分隔和平衡发热部件之间的气流，使得每个部件都被充分冷却。空气挡板系统包括一个平的挡板和一对弯曲的挡板。平板挡板垂直于空气流的方向定位，并位于两个40瓦记忆之间和之前。弯曲的挡板位于与两个存储器ASIC相邻的位置。一个弯曲的挡板位于一个存储器ASIC和PCB组件的外部之间，另一个弯曲的挡板位于另一个存储器ASIC和PCB组件的相对侧之间。弯曲的挡板包括弯曲部分，延伸部分和前部。发热组件包括存储器DIMMS，4个130瓦的微处理器和两个40瓦的存储器ASIC。

6. 发明授权

US06434007B1 Heat sink attachment clip 失效
标题翻译：散热片附件夹
公开(公告)号：US06434007B1
公开(公告)日：2002-08-13
申请号：US09620335
申请日：2000-07-20
申请人： Richard B. Salmonson , David Paul Gruber
发明人： Richard B. Salmonson , David Paul Gruber
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for securing a heat sink to a chip on a circuit board using a clip to secure the heat sink to the chip. The assembly includes a pair of support beams, a clip attached to the pair of support beams, and a heat sink. Optionally, the assembly also includes a plurality of bias members biased between the heat sink and the circuit board and a pair of positioning pins positioned between the heat sink and the circuit board. The clip is biased between the heat sink and the pair of support beams. The clip has a plate having a first end and a second end with the first end having an aperture for fastening the first end to a first support beam and the second end having a hook for fastening the second end to a second support beam. Optionally, the clip is made of spring steel and provides a downward biasing force of between about 3 psi and about 25 psi and preferably about 10 psi.
摘要翻译：一种散热器组件，用于使用夹子将散热器固定在电路板上的芯片上，以将散热片固定在芯片上。组件包括一对支撑梁，固定在该对支撑梁上的夹子和散热器。可选地，组件还包括偏置在散热器和电路板之间的多个偏置构件和位于散热器和电路板之间的一对定位销。夹子偏置在散热器和一对支撑梁之间。夹子具有板，其具有第一端和第二端，第一端具有用于将第一端紧固到第一支撑梁的孔，并且第二端具有用于将第二端紧固到第二支撑梁的钩。可选地，夹子由弹簧钢制成，并提供约3psi至约25psi，优选约10psi的向下偏压力。

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