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1. 发明授权

US06816386B2 Card connector for receiving information card with identifier therein 有权
标题翻译：用于接收具有标识符的信息卡的卡连接器
公开(公告)号：US06816386B2
公开(公告)日：2004-11-09
申请号：US10041339
申请日：2002-01-07
申请人： Wataru Oguchi , Toru Wagatsuma , Yoshimasa Kuroda
发明人： Wataru Oguchi , Toru Wagatsuma , Yoshimasa Kuroda
IPC分类号： H05K710
CPC分类号： G06K13/0856 , G06K7/0021 , G06K13/08 , H01R29/00
摘要： A compact card connector having reduced width and thickness is provided for receiving an information card whereby the information card has a narrow step-like recess along one of its side edges and a sliding identifier mechanism provided in a concave cut in the step. The card connector includes a frame that receives the information card, and an identifier detecting means for detecting a sliding position of the identifier. The identifier detecting means includes a suitably placed fixed contact member and a movable contact member which are mounted on the frame, with part of the movable contact member forming a projection for detecting the sliding position of the identifier, whereby the projection lies in an area within the housing space through which the step-like recess of the card is to pass. As the information card is inserted into the housing space, the projection touches an upper surface of the step-like recess and/or that of the identifier and works in the concave cut in the step.

2. 发明授权

US06807064B2 Electronic component with at least one semiconductor chip and method for producing the electronic component 有权
标题翻译：具有至少一个半导体芯片的电子部件和用于制造电子部件的方法
公开(公告)号：US06807064B2
公开(公告)日：2004-10-19
申请号：US10236895
申请日：2002-09-06
申请人： Harry Hedler , Thorsten Meyer
发明人： Harry Hedler , Thorsten Meyer
IPC分类号： H05K710
CPC分类号： H01L24/81 , H01L23/3114 , H01L24/10 , H01L24/13 , H01L24/72 , H01L2224/05569 , H01L2224/05573 , H01L2224/10165 , H01L2224/13 , H01L2224/13099 , H01L2224/8014 , H01L2224/81136 , H01L2224/8114 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/19043 , H01L2924/00
摘要： An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.
摘要翻译：具有至少一个半导体芯片的电子部件，连接到该半导体芯片的重新布线层以及与重新布线层相关联的印刷电路板。再布线层设置有与印刷电路板的接触面对应的柔性触点，并且重新布线层经由平坦的中间层牢固地连接到印刷电路板。对电子部件的制造方法进行说明。

3. 发明授权

US06798667B2 Solder ball collapse control apparatus and method thereof 有权
标题翻译：焊球塌陷控制装置及其方法
公开(公告)号：US06798667B2
公开(公告)日：2004-09-28
申请号：US10064857
申请日：2002-08-23
申请人： Vincent K. Chan
发明人： Vincent K. Chan
IPC分类号： H05K710
CPC分类号： B23K1/0016 , H01L23/49816 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/094 , H05K2201/2036 , Y02P70/613 , H01L2924/00
摘要： A solder ball collapse control apparatus and method thereof includes a plurality of first solder members, pieces of solder material in a shape capable of being used to properly create a solder joint. The first solder members have a first solder dimension and a first melting temperature and are disposed on a carrier substrate, wherein the first solder members include any piece of material capable of being disposed using a solder dispensing machine. The apparatus and method further includes a plurality of second members having a second dimension and a second melting temperature, disposed on the carrier substrate in relation to the plurality of first solder members. The second members include any piece of material capable of being disposed using the solder dispensing machine, wherein the first solder member dimension is greater than the second member dimension and the second melting temperature is greater than the first melting temperature.
摘要翻译：焊球塌陷控制装置及其方法包括多个第一焊料构件，能够用于适当地形成焊点的形状的焊料材料片。第一焊料构件具有第一焊料尺寸和第一熔融温度并且设置在载体基板上，其中第一焊料构件包括能够使用焊料分配机布置的任何材料片。该装置和方法还包括多个具有第二尺寸和第二熔化温度的第二构件，其相对于多个第一焊料构件设置在载体衬底上。第二构件包括能够使用焊料分配机布置的任何一种材料，其中第一焊料构件尺寸大于第二构件尺寸，并且第二熔化温度大于第一熔化温度。

4. 发明授权

US06778404B1 Stackable ball grid array 有权
公开(公告)号：US06778404B1
公开(公告)日：2004-08-17
申请号：US09586050
申请日：2000-06-02
申请人： Todd O. Bolken , Cary J. Baerlocher , Chad A. Cobbley , David J. Corisis
发明人： Todd O. Bolken , Cary J. Baerlocher , Chad A. Cobbley , David J. Corisis
IPC分类号： H05K710
CPC分类号： H05K3/303 , H01L25/105 , H01L25/18 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K2201/10515 , H05K2201/10734 , H05K2203/167 , Y02P70/613 , H01L2924/00
摘要： A stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a pre-formed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orient each package with respect to an adjacent package, substrate or printed circuit board. The alignment features also support the weight of the adjacent package during solder ball reflow to maintain stack height and parallelism between packages. Each memory device is serially connected to the adjacent memory device through the vias and solder balls on each package.

5. 发明授权

US06744635B2 Removable visual indication structure for a printed circuit board 有权
标题翻译：印刷电路板的可拆卸视觉指示结构
公开(公告)号：US06744635B2
公开(公告)日：2004-06-01
申请号：US09504304
申请日：2000-02-15
申请人： Roland F. Portman , Edgar Jhay Gregorios
发明人： Roland F. Portman , Edgar Jhay Gregorios
IPC分类号： H05K710
CPC分类号： H05K3/301 , H05K1/0266 , H05K2201/10106 , H05K2201/10325 , H05K2201/10446
摘要： In a first aspect, a removable visual indication structure is disclosed. The removable visual indication structure includes a removable connection portion and a visual indication portion coupled to the removable connection portion wherein the visual indication structure can be removably attached to a printed circuit board. In a second aspect, a printed circuit board system is disclosed. The system includes a printed circuit board, at least one pin coupled to the printed circuit board, and at least one removable visual indication structure coupled to the at least one pin. In yet a third aspect, a method for fabricating a removable visual indication structure is disclosed. The method includes providing at least one visual indicator, providing a removable connector adapted to be coupled to the printed circuit board, and coupling the at least one visual indicator to the removable connector. Accordingly, the method and system provides a simple and cost effective way for manufacturers to provide visual indicators to various types of systems while at the same time increasing the amount of space available on the printed circuit board.
摘要翻译：在第一方面，公开了可拆卸的视觉指示结构。可拆卸视觉指示结构包括可移除连接部分和耦合到可移除连接部分的视觉指示部分，其中视觉指示结构可移除地附接到印刷电路板。在第二方面，公开了一种印刷电路板系统。该系统包括印刷电路板，耦合到印刷电路板的至少一个引脚以及耦合到至少一个引脚的至少一个可拆卸视觉指示结构。在第三方面中，公开了一种用于制造可拆卸视觉指示结构的方法。该方法包括提供至少一个视觉指示器，提供适于联接到印刷电路板的可移除连接器，以及将至少一个视觉指示器耦合到可拆卸连接器。因此，该方法和系统为制造商提供了一种简单且具有成本效益的方式来为各种类型的系统提供可视指示器，同时增加了印刷电路板上可用的空间量。

6. 发明授权

US06720500B1 Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part 失效
标题翻译：插入式电子控制单元，具有插头构件的布线板的连接结构，电子部件与布线板的连接单元以及电子部件的安装工序
公开(公告)号：US06720500B1
公开(公告)日：2004-04-13
申请号：US09042989
申请日：1998-03-17
申请人： Masajiro Inoue
发明人： Masajiro Inoue
IPC分类号： H05K710
CPC分类号： H01R13/2414 , H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/11822 , H01L2224/13144 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81141 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/0106 , H01L2924/01063 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/12042 , H01L2924/15312 , H01L2924/1579 , H01L2924/351 , H05K1/113 , H05K3/0064 , H05K3/28 , H05K3/321 , H05K2201/0367 , H05K2201/09472 , H05K2201/09909 , H05K2201/10303 , H05K2201/10424 , H05K2201/10674 , H05K2201/10704 , Y10T29/4913 , Y10T29/49147 , H01L2224/13099 , H01L2924/00 , H01L2924/3512 , H01L2924/05442 , H01L2224/05599
摘要： A plug-in type electronic control unit is comprised of a wiring board, a plurality of electronic parts mounted on one surface of the wiring board by utilizing a wireless bonding process, and a plug member mounted on the other surface of the wiring board by utilizing a wireless bonding process. It is possible to suppress the planar extent of the unit by such a laminated structure, and to suppress the extent of the unit in a laminating direction by the employment of the wireless bonding process. Thus, it is possible to achieve a reduction in size of the plug-in type electronic control unit.
摘要翻译：插电式电子控制单元由布线板，通过利用无线接合工艺安装在布线板的一个表面上的多个电子部件和通过利用布线板安装在布线板的另一个表面上的插塞构件无线绑定过程。通过这样的层叠结构，可以抑制单位的平面化程度，并且通过使用无线接合处理来抑制单元在层叠方向上的程度。因此，可以实现插入式电子控制单元的尺寸的减小。

7. 发明授权

US06711028B2 Switching device and a method for the configuration thereof 有权
标题翻译：开关器件及其配置方法
公开(公告)号：US06711028B2
公开(公告)日：2004-03-23
申请号：US10066122
申请日：2002-01-30
申请人： Ofer Iny
发明人： Ofer Iny
IPC分类号： H05K710
CPC分类号： H05K7/1459 , H05K1/14
摘要： A switching device and a method for the configuration thereof is disclosed. A first aspect of the present invention comprises a switching device. The switching device comprises at least one line card and at least one switching card. The device includes a mid-plane coupled to the at least one line card and the at least one switching card. The A second aspect of the invention comprises a method for configuring a switching device. The method for configuring a switching device comprises providing a mid-plane, and providing at least one switching card and at least one line card on the mid-plane. The at least one switching card and the at least one line card are perpendicular to each other.
摘要翻译：公开了一种开关装置及其结构的方法。本发明的第一方面包括一种开关装置。交换设备包括至少一个线路卡和至少一个交换卡。该装置包括耦合到至少一个线路卡和至少一个交换卡的中间平面。本发明的第二方面包括一种用于配置交换设备的方法。配置开关装置的方法包括提供中间平面，并且在中间平面上提供至少一个开关卡和至少一个线卡。所述至少一个开关卡和所述至少一个线卡彼此垂直。

8. 发明授权

US06597582B2 Semiconductor device incorporating module structure 失效
公开(公告)号：US06597582B2
公开(公告)日：2003-07-22
申请号：US10170582
申请日：2002-06-14
申请人： Shinji Baba
发明人： Shinji Baba
IPC分类号： H05K710
CPC分类号： H01L23/3675 , H01L23/433 , H01L23/5385 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/1005 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/00014 , H01L2924/01057 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/16315 , H01L2924/3511 , Y10S439/946 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection terminals on upper and lower peripheral surfaces thereof and has an inner groove formed on the inner surface thereof. The module board has at least a semiconductor chip mounted thereon and is fitted into the inner groove of the block socket. The module board is electrically connected to the block socket. The connection terminals on the upper peripheral surface of the module socket may be mechanically fitted into and electrically connected to the connection terminals on the lower peripheral surface of other block socket having the same structure.

9. 发明授权

US06535378B1 Portable computer with detachable battery pack 失效
标题翻译：带可拆卸电池的便携式电脑
公开(公告)号：US06535378B1
公开(公告)日：2003-03-18
申请号：US08762131
申请日：1996-12-09
申请人： Toshiaki Oguchi , Asao Saito , Katsutoshi Mukaijima , Hideo Nakamura
发明人： Toshiaki Oguchi , Asao Saito , Katsutoshi Mukaijima , Hideo Nakamura
IPC分类号： H05K710
CPC分类号： G06F1/1616 , G06F1/1632 , G06F1/1635 , G06F1/166 , G06F1/1683 , H01M2/1055 , Y10T16/522
摘要： A battery pack to be externally attached to a system body of a portable computer contains a plurality of batteries in two rows. A groove is formed on that portion of the top of the battery pack which correspond to the region between the rows of batteries. A hinge unit for swingably supporting a display unit is provided on the rear end of the system body of the computer in a manner such that it is partially housed in the groove of the battery pack. With this arrangement, the computer is reduced in thickness. The battery pack, which is connected to the rear end of the system body, is rotatable relatively to the system body. During use of the computer, therefore, a keyboard can be slightly declined toward a user by rotating the battery pack to raise the rear end of the system body.
摘要翻译：外部连接到便携式计算机的系统主体的电池组包含两行中的多个电池。在电池组的顶部的与电池排之间的区域相对应的部分上形成凹槽。用于可摆动地支撑显示单元的铰链单元设置在计算机的系统主体的后端，使得其部分地容纳在电池组的槽中。通过这种布置，计算机的厚度减小。连接到系统主体的后端的电池组可相对于系统主体旋转。因此，在使用计算机期间，通过旋转电池组以使系统主体的后端升高，键盘可能会朝向用户略微下降。

10. 发明授权

US06421251B1 Array board interconnect system and method 失效
公开(公告)号：US06421251B1
公开(公告)日：2002-07-16
申请号：US09019383
申请日：1998-02-05
申请人： Sharon Sheau-Pyng Lin
发明人： Sharon Sheau-Pyng Lin
IPC分类号： H05K710
CPC分类号： G06F17/5022 , G06F17/5027
摘要： The FPGA array in the Simulation system is provided on the motherboard through a particular board interconnect structure to provide easy expandability and maximize packaging density with a single PCB design. Each chip may have up to eight sets of interconnections, where the interconnections are arranged according to adjacent direct-neighbor interconnects (i.e., N[73:0], S[73:0], W[73:0], E[73:0]), and one-hope neighbor interconnects (i.e., NH[27:0], SH[27:0], XH[36:0], XH[72:37]), excluding the local bus connections, within a single board and across different boards. Each chip is capable of being interconnected directly to adjacent neighbor chips, or in one hop to a non-adjacent chip located above, below, left, and right. In the X direction (east-west), the array is connected in a torus. In the Y direction (north-south), the array is connected in a column. The interconnects alone can couple logic devices and other components within a single board. However, the inter-board connectors are provided to couple these boards and interconnects together across different boards to carry signals between (1) the PCI bus via the motherboard and the array boards, and (2) any two array boards, all without passing through a backplane or motherboard to achieve the highest packaging density. A motherboard connector connects the board to the motherboard, and hence, to the PCI bus, power, and ground. For some boards, the motherboard connector is not used for direct connection to the motherboard. In a six-board configuration, only boards 1, 3 and 5 are directly connected to the motherboard while the remaining boards 2, 4, and 6 rely on their neighbor boards for motherboard connectivity. Thus, every other board is directly connected to the motherboard, and interconnects and local buses of these boards are coupled together via inter-board connectors arranged solder-side to component-side. PCI signals are routed through one of the boards (typically the first board) only. Power and ground are applied to the other motherboard connectors for those boards. Placed solder-side to component-side, the various inter-board connectors allow communication among the PCI bus components, the FPGA logic devices, memory devices, and various Simulation system control circuits.

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