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1. 发明授权

US08350159B2 Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08350159B2
公开(公告)日：2013-01-08
申请号：US12731173
申请日：2010-03-25
申请人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
发明人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
IPC分类号： H05K1/00 , H05K1/09 , H05K1/03 , H05K7/00 , G11B21/16 , G11B5/48
CPC分类号： H05K3/10 , G11B5/484 , G11B5/486 , H05K1/025 , H05K1/028 , H05K1/056 , H05K3/28 , H05K2201/055 , Y10T156/1002 , Y10T156/1034
摘要： A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
摘要翻译：在绝缘层上形成基极绝缘层，在基底绝缘层上形成写入布线迹线和读取布线迹线。写入布线迹线和读取布线迹线形成在基底绝缘层的主体区域上，并且写入布线迹线形成在基底绝缘层的辅助区域上。基底绝缘层沿弯曲部弯曲。这将使写入布线轨迹位于写入布线轨迹的上方。

2. 发明授权

US09095064B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US09095064B2
公开(公告)日：2015-07-28
申请号：US13688413
申请日：2012-11-29
申请人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
发明人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
IPC分类号： H05K3/02 , H05K3/10 , G11B5/48 , H05K1/02 , H05K1/05 , H05K3/28
CPC分类号： H05K3/10 , G11B5/484 , G11B5/486 , H05K1/025 , H05K1/028 , H05K1/056 , H05K3/28 , H05K2201/055 , Y10T156/1002 , Y10T156/1034
摘要： A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
摘要翻译：在绝缘层上形成基极绝缘层，在基底绝缘层上形成写入布线迹线和读取布线迹线。写入布线迹线和读取布线迹线形成在基底绝缘层的主体区域上，并且写入布线迹线形成在基底绝缘层的辅助区域上。基底绝缘层沿弯曲部弯曲。这将使写入布线轨迹位于写入布线轨迹的上方。

3. 发明授权

US09029708B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09029708B2
公开(公告)日：2015-05-12
申请号：US13086449
申请日：2011-04-14
申请人： Tetsuya Oosawa , Mitsuru Honjo , Daisuke Yamauchi
发明人： Tetsuya Oosawa , Mitsuru Honjo , Daisuke Yamauchi
IPC分类号： H05K1/00 , H05K1/05 , H05K1/02
CPC分类号： H05K1/056 , H05K1/0245 , H05K1/0251 , Y10T29/49155
摘要： A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.
摘要翻译：基体绝缘层形成在悬架体上。读取布线图案，写入布线图案和接地图案在基底绝缘层上平行地形成。第一覆盖绝缘层形成在基底绝缘层上以覆盖读取的布线图案，写入布线图案和接地图案。在写入布线图案上方的第一覆盖绝缘层的区域中形成接地层。第二盖绝缘层形成在第一盖绝缘层上以覆盖接地层。

4. 发明授权

US08853546B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08853546B2
公开(公告)日：2014-10-07
申请号：US12837543
申请日：2010-07-16
申请人： Daisuke Yamauchi , Tetsuya Oosawa , Mitsuru Honjo , Masami Inoue
发明人： Daisuke Yamauchi , Tetsuya Oosawa , Mitsuru Honjo , Masami Inoue
IPC分类号： H05K1/00 , H05K3/36 , H05K3/24 , H05K1/05 , H05K3/00 , H05K3/28
CPC分类号： H05K1/056 , C25D7/00 , H05K3/002 , H05K3/0052 , H05K3/242 , H05K3/28 , H05K2201/0187 , H05K2201/0191 , H05K2201/10977 , Y10T29/49124 , Y10T29/49126
摘要： A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.
摘要翻译：基体绝缘层形成在悬架体上。在基底绝缘层上一体地形成电镀用引线和布线迹线。覆盖绝缘层形成在基底绝缘层上以覆盖电镀用引线和布线迹线。在形成有电镀用引线的基极绝缘层的区域的上方的覆盖绝缘层的一部分的厚度设定为小于基底绝缘层的其它区域以上的覆盖绝缘层的一部分的厚度。

5. 发明授权

US07866930B2 Bolt 有权
标题翻译：螺栓
公开(公告)号：US07866930B2
公开(公告)日：2011-01-11
申请号：US11914660
申请日：2005-06-13
申请人： Yoshihiro Murase , Tetsuya Oosawa , Mitsuru Kozawa , Sadayoshi Hasegawa
发明人： Yoshihiro Murase , Tetsuya Oosawa , Mitsuru Kozawa , Sadayoshi Hasegawa
IPC分类号： F16B35/04
CPC分类号： F16B35/047
摘要： In a bolt of the present invention, a guide portion having a small diameter is formed at the distal end of a shaft portion and ridge having an inverted direction screw configuration relative to the ridge formed on a constant diameter portion is formed. When the bolt is inserted obliquely into a nut and the ridge gets into engagement with a female screw portion of the nut, an effect of floating the bolt is generated, and the bolt cannot be driven into the nut unless it is set in an appropriate tightening posture. Consequently, biting and seizing of the bolt to the nut can be prevented securely. If the ridge is formed into a double threaded screw having an inverted direction screw configuration, the effect can be further intensified.
摘要翻译：在本发明的螺栓中，形成具有小直径的引导部分，在轴部的远端形成有相对于形成在恒定直径部分上的脊的反向螺杆构造的脊。当螺栓倾斜插入螺母并且脊与螺母的内螺纹部分接合时，产生浮动螺栓的效果，并且螺栓不能被驱动到螺母中，除非其被设定在适当的紧固姿势。因此，可以可靠地防止螺栓咬合到螺母上。如果脊形成为具有反向螺杆构造的双螺纹螺钉，则可以进一步增强其效果。

6. 发明申请

US20090060676A1 BOLT 有权
标题翻译：螺栓
公开(公告)号：US20090060676A1
公开(公告)日：2009-03-05
申请号：US11914660
申请日：2005-06-13
申请人： Yoshihiro Murase , Tetsuya Oosawa , Mitsuru Kozawa , Sadayoshi Hasegawa
发明人： Yoshihiro Murase , Tetsuya Oosawa , Mitsuru Kozawa , Sadayoshi Hasegawa
IPC分类号： F16B35/00
CPC分类号： F16B35/047
摘要： In a bolt of the present invention, a guide portion (116) having a small diameter is formed at the distal end of a shaft portion (15) and ridge (31) having an inverted direction screw configuration relative to the ridge (30) formed on a constant diameter portion (115) is formed. When the bolt (1) is inserted obliquely into a nut (100) and the ridge (31) gets into engagement with a female screw portion (105) of the nut (100), an effect of floating the bolt (1) is generated, and the bolt 1 cannot be driven into the nut 100 unless it is set in an appropriate tightening posture. Consequently, biting and seizing of the bolt 1 to the nut can be prevented securely. If the ridge (31) is formed into a double threaded screw having an inverted direction screw configuration, the effect can be further intensified.
摘要翻译：在本发明的螺栓中，在轴部（15）的前端形成具有小直径的引导部（116），并且相对于形成的脊（30）具有相反方向的螺旋构造的脊部（31）在恒定直径部分（115）上形成。当螺栓（1）倾斜地插入螺母（100）并且脊（31）与螺母（100）的内螺纹部分（105）接合时，产生浮动螺栓（1）的效果，并且螺栓1不能被驱动到螺母100中，除非其被设定在适当的紧固姿势。因此，可以可靠地防止螺栓1咬合到螺母。如果脊（31）形成为具有反向螺杆构造的双螺纹螺杆，则可以进一步增强其效果。

7. 发明授权

US07336446B2 Suspension board having a circuit and a flying lead portion 有权
标题翻译：悬挂板具有电路和飞行引线部分
公开(公告)号：US07336446B2
公开(公告)日：2008-02-26
申请号：US11002199
申请日：2004-12-03
申请人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
发明人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
IPC分类号： G11B21/16
CPC分类号： G11B5/486 , G11B5/484 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/4092 , H05K2201/0394 , H05K2201/0969
摘要： A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.
摘要翻译：一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5，引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

8. 发明申请

US20050122627A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20050122627A1
公开(公告)日：2005-06-09
申请号：US11002199
申请日：2004-12-03
申请人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
发明人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
IPC分类号： G11B5/60 , G11B5/00 , G11B5/012 , G11B5/48 , G11B21/00 , G11B21/02 , G11B21/21 , H05K1/05 , H05K1/11 , H05K3/24 , H05K3/28 , H05K3/40
CPC分类号： G11B5/486 , G11B5/484 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/4092 , H05K2201/0394 , H05K2201/0969
摘要： A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.
摘要翻译：一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5和飞行引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

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